KR100469815B1 - 반도체웨이퍼형물품용그리퍼 - Google Patents
반도체웨이퍼형물품용그리퍼 Download PDFInfo
- Publication number
- KR100469815B1 KR100469815B1 KR10-1998-0022858A KR19980022858A KR100469815B1 KR 100469815 B1 KR100469815 B1 KR 100469815B1 KR 19980022858 A KR19980022858 A KR 19980022858A KR 100469815 B1 KR100469815 B1 KR 100469815B1
- Authority
- KR
- South Korea
- Prior art keywords
- gripping claws
- gripper
- gripping
- deployment
- article
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (6)
- 대체로 원형의 외측 둘레를 가지는 반도체 웨이퍼형 물품을 붙잡기 위한 그리퍼(gripper)로서, 베이스체(base body)와, 그 베이스체에 대하여 반경방향 안쪽 및 바깥쪽으로 이동할 수 있도록 상기 베이스체에 이동 가능하게 배치된 다수의 그리핑 클로(gripping claw)와, 상기 베이스체 쪽으로 반경방향 안쪽으로 상기 그리핑 클로를 밀어붙이는 탄성 수단, 및 그 탄성 수단의 밀어붙임에 대항하여 반경방향 바깥쪽으로 상기 그리핑 클로들을 밀어붙이는 전개(展開) 수단으로서, 상기 그리핑 클로의 이동방향에 수직인 축선을 따라 이동할 수 있고, 상기 그리핑 클로들에 작용하고 개개의 그리핑 클로가 다른 그리핑 클로보다 더 안쪽으로 반경방향 이동하는 것을 방지하도록 된 원추형 자켓 면을 가지는 전개체를 포함하는 전개 수단을 구비한 반도체 웨이퍼형 물품용 그리퍼에 있어서,상기 전개체는 스프링 수단에 의해 상기 전개체의 상기 원추형 자켓 면이 상기 그리핑 클로들에 접촉하도록 유지되어 있고, 상기 그리핑 클로들의 이동방향으로 작용하도록 상기 스프링 수단에 의해 가해지는 힘이 상기 베이스체 쪽으로 반경방향 안쪽으로 상기 그리핑 클로를 밀어붙이는 상기 탄성 수단에 의해 가해지는 힘보다 작게 되어 있는 것을 특징으로 하는 반도체 웨이퍼형 물품용 그리퍼.
- 제 1 항에 있어서, 상기 전개체의 상기 원추형 자켓 면이, 상기 스프링 수단에 의해, 상기 그리핑 클로들에 연결된 부품에 접촉하여 유지되는 것을 특징으로 하는 반도체 웨이퍼형 물품용 그리퍼.
- 제 1 항에 있어서, 상기 전개체의 상기 원추형 자켓 면이, 상기 스프링 수단에 의해, 상기 그리핑 클로들의 안내 봉을 위한 가이드체(guide body)에 배치된 롤러에 접촉하여 유지되는 것을 특징으로 하는 반도체 웨이퍼형 물품용 그리퍼.
- 제 1 항에 있어서, 상기 전개체의 상기 원추형 자켓 면이 개개의 그리핑 클로에 연결된 가이드체를 통해 상기 그리핑 클로들에 작용하는 것을 특징으로 하는 반도체 웨이퍼형 물품용 그리퍼.
- 제 1 항에 있어서, 상기 스프링 수단이 나선 압축 스프링인 것을 특징으로 하는 반도체 웨이퍼형 물품용 그리퍼.
- 제 1 항에 있어서, 상기 스프링 수단이 피스톤 로드를 가진 공기압 실린더를 포함하는 것을 특징으로 하는 반도체 웨이퍼형 물품용 그리퍼.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0106197A AT405701B (de) | 1997-06-18 | 1997-06-18 | Greifer für halbleiterwafer und andere scheibenförmige gegenstände |
ATA1061/97 | 1997-06-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990007081A KR19990007081A (ko) | 1999-01-25 |
KR100469815B1 true KR100469815B1 (ko) | 2005-03-16 |
Family
ID=3505747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-1998-0022858A KR100469815B1 (ko) | 1997-06-18 | 1998-06-18 | 반도체웨이퍼형물품용그리퍼 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5931518A (ko) |
EP (1) | EP0886304B1 (ko) |
JP (1) | JP3645420B2 (ko) |
KR (1) | KR100469815B1 (ko) |
AT (1) | AT405701B (ko) |
DE (1) | DE59802398D1 (ko) |
TW (1) | TW383444B (ko) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
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DE19818479C1 (de) * | 1998-04-24 | 1999-11-11 | Steag Hama Tech Ag | Vorrichtung und Verfahren zum Handhaben von Substraten |
US6167322A (en) * | 1998-07-10 | 2000-12-26 | Holbrooks; Orville Ray | Intelligent wafer handling system and method |
US7294317B2 (en) * | 2001-02-08 | 2007-11-13 | Sd Lizenzverwertungsgesellschaft Mbh & Co. | Exothermic reaction system |
US6689418B2 (en) | 2001-08-03 | 2004-02-10 | Applied Materials Inc. | Apparatus for wafer rinse and clean and edge etching |
US6708701B2 (en) | 2001-10-16 | 2004-03-23 | Applied Materials Inc. | Capillary ring |
US6786996B2 (en) | 2001-10-16 | 2004-09-07 | Applied Materials Inc. | Apparatus and method for edge bead removal |
US7104578B2 (en) * | 2002-03-15 | 2006-09-12 | Asm International N.V. | Two level end effector |
US7014235B1 (en) * | 2002-09-18 | 2006-03-21 | Storage Technology Corporation | Inertia actuation for robotic gripper mechanism |
US7181132B2 (en) | 2003-08-20 | 2007-02-20 | Asm International N.V. | Method and system for loading substrate supports into a substrate holder |
US20050112279A1 (en) * | 2003-11-24 | 2005-05-26 | International Business Machines Corporation | Dynamic release wafer grip and method of use |
US20060046499A1 (en) * | 2004-08-20 | 2006-03-02 | Dolechek Kert L | Apparatus for use in thinning a semiconductor workpiece |
US7193295B2 (en) * | 2004-08-20 | 2007-03-20 | Semitool, Inc. | Process and apparatus for thinning a semiconductor workpiece |
US7288489B2 (en) * | 2004-08-20 | 2007-10-30 | Semitool, Inc. | Process for thinning a semiconductor workpiece |
US7354649B2 (en) | 2004-08-20 | 2008-04-08 | Semitool, Inc. | Semiconductor workpiece |
US20060040111A1 (en) * | 2004-08-20 | 2006-02-23 | Dolechek Kert L | Process chamber and system for thinning a semiconductor workpiece |
JP4853239B2 (ja) * | 2006-11-07 | 2012-01-11 | 三菱電機株式会社 | ウェハ保持装置 |
CN101582389B (zh) * | 2009-06-04 | 2011-01-19 | 东莞宏威数码机械有限公司 | 柔性伸缩杆机构 |
JP5491834B2 (ja) | 2009-12-01 | 2014-05-14 | 川崎重工業株式会社 | エッジグリップ装置、及びそれを備えるロボット。 |
CN102935942B (zh) * | 2011-08-16 | 2015-03-04 | 中芯国际集成电路制造(北京)有限公司 | 电控操作器 |
US9028502B2 (en) * | 2011-09-23 | 2015-05-12 | Greatbatch Medical S.A. | Ceramic implant holder |
CN103192403B (zh) * | 2012-01-05 | 2015-11-11 | 沈阳新松机器人自动化股份有限公司 | 夹持装置 |
US9038262B2 (en) * | 2012-02-23 | 2015-05-26 | Beijing Sevenstar Electronics Co., Ltd. | Device for holding disk-shaped articles and method thereof |
US9373534B2 (en) | 2012-09-05 | 2016-06-21 | Industrial Technology Research Institute | Rotary positioning apparatus with dome carrier, automatic pick-and-place system, and operating method thereof |
US9082801B2 (en) * | 2012-09-05 | 2015-07-14 | Industrial Technology Research Institute | Rotatable locating apparatus with dome carrier and operating method thereof |
US9412639B2 (en) * | 2013-12-06 | 2016-08-09 | Tel Fsi, Inc. | Method of using separate wafer contacts during wafer processing |
TWI587427B (zh) * | 2015-09-02 | 2017-06-11 | E&R Eng Corp | 晶圓整平裝置 |
CN105171768A (zh) * | 2015-09-17 | 2015-12-23 | 苏州博众精工科技有限公司 | 一种抓取装置 |
CN105552012B (zh) * | 2016-01-20 | 2019-02-12 | 苏州光越微纳科技有限公司 | 机械式取料机构 |
CN107777270B (zh) * | 2016-08-31 | 2019-08-23 | 佛山市飞碟智能科技有限公司 | 一种安全的智能送餐装置 |
US10800045B1 (en) * | 2017-10-31 | 2020-10-13 | Amazon Technologies, Inc. | Finger assembly having a spring-biased talon |
US10654176B2 (en) | 2017-10-31 | 2020-05-19 | Amazon Technologies, Inc. | Finger assembly having a talon and barrel cam actuation |
US10702994B1 (en) | 2017-10-31 | 2020-07-07 | Amazon Technologies, Inc. | Finger assembly having a talon and spin paddle actuation |
FR3078959B1 (fr) * | 2018-03-19 | 2020-04-17 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif de prehension d'une structure monocouche ou multicouche comportant des systemes de prehension |
CN110328611A (zh) * | 2019-07-25 | 2019-10-15 | 德屹智能科技(扬州)有限公司 | 夹持圆形特征工件的机器人打磨抓手 |
CN111618780A (zh) * | 2020-05-09 | 2020-09-04 | 苏州浪潮智能科技有限公司 | 一种cpu基座背板保护罩拆卸治具 |
CN112497244A (zh) * | 2020-11-12 | 2021-03-16 | 覃立万 | 一种多维度关节机械手 |
CN113246161B (zh) * | 2021-05-31 | 2022-04-15 | 吉林大学 | 一种多功能行李抓取折叠机械手 |
CN113644019B (zh) * | 2021-08-09 | 2024-03-19 | 恩纳基智能科技无锡有限公司 | 一种半导体贴片机的复合上料装置 |
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JPS5761487A (en) * | 1980-09-30 | 1982-04-13 | Fujitsu Fanuc Ltd | Hand for industrial robot |
US4453757A (en) * | 1980-11-28 | 1984-06-12 | Hitachi, Ltd. | Wafer gripping device |
US5431421A (en) * | 1988-05-25 | 1995-07-11 | Semitool, Inc. | Semiconductor processor wafer holder |
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US3170322A (en) * | 1962-06-05 | 1965-02-23 | Instron Corp | Grip |
US4705313A (en) * | 1986-06-30 | 1987-11-10 | Universal Instruments Corporation | Selective gripping of inside and outside of articles |
DE3624307C1 (de) * | 1986-07-18 | 1987-11-12 | Agfa Gevaert Ag | Vorrichtung zum Aufnehmen und Absetzen von Spulen |
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
JPH081922B2 (ja) * | 1991-01-25 | 1996-01-10 | 株式会社東芝 | ウェハ−保持装置 |
US5125708A (en) * | 1991-05-20 | 1992-06-30 | Nicky Borcea | Wedge gripper |
DE9204457U1 (de) * | 1992-04-01 | 1992-05-27 | Sommer Automatic GmbH, 7541 Straubenhardt | Pneumatisch betätigter Greifer |
DE59407361D1 (de) * | 1993-02-08 | 1999-01-14 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige Gegenstände |
AT640U1 (de) * | 1993-10-22 | 1996-02-26 | Sez Semiconduct Equip Zubehoer | Greifer für halbleiterwafer und andere scheibenförmige gegenstände |
WO1997003456A1 (de) * | 1995-07-12 | 1997-01-30 | Sez Semiconductor-Equipment Zubehör Für Die Halbleiterfertigung Gesellschaft Mbh | Träger für scheibenförmige gegenstände, insbesondere siliziumscheiben |
DE19529537A1 (de) * | 1995-08-11 | 1997-02-13 | Leybold Ag | Vorrichtung zum Greifen und Halten eines flachen Substrats |
-
1997
- 1997-06-18 AT AT0106197A patent/AT405701B/de not_active IP Right Cessation
-
1998
- 1998-05-22 EP EP98890157A patent/EP0886304B1/de not_active Expired - Lifetime
- 1998-05-22 DE DE59802398T patent/DE59802398D1/de not_active Expired - Lifetime
- 1998-06-08 US US09/093,187 patent/US5931518A/en not_active Expired - Lifetime
- 1998-06-16 JP JP16871298A patent/JP3645420B2/ja not_active Expired - Lifetime
- 1998-06-17 TW TW087109647A patent/TW383444B/zh not_active IP Right Cessation
- 1998-06-18 KR KR10-1998-0022858A patent/KR100469815B1/ko not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5761487A (en) * | 1980-09-30 | 1982-04-13 | Fujitsu Fanuc Ltd | Hand for industrial robot |
US4453757A (en) * | 1980-11-28 | 1984-06-12 | Hitachi, Ltd. | Wafer gripping device |
US5431421A (en) * | 1988-05-25 | 1995-07-11 | Semitool, Inc. | Semiconductor processor wafer holder |
Also Published As
Publication number | Publication date |
---|---|
EP0886304B1 (de) | 2001-12-12 |
ATA106197A (de) | 1999-02-15 |
DE59802398D1 (de) | 2002-01-24 |
JPH1191949A (ja) | 1999-04-06 |
JP3645420B2 (ja) | 2005-05-11 |
US5931518A (en) | 1999-08-03 |
EP0886304A3 (de) | 2000-05-10 |
EP0886304A2 (de) | 1998-12-23 |
AT405701B (de) | 1999-11-25 |
KR19990007081A (ko) | 1999-01-25 |
TW383444B (en) | 2000-03-01 |
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