KR100358785B1 - 무접촉스마트카드용스마트카드모듈을제조하기위한방법 - Google Patents

무접촉스마트카드용스마트카드모듈을제조하기위한방법 Download PDF

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KR100358785B1
KR100358785B1 KR1019970701445A KR19970701445A KR100358785B1 KR 100358785 B1 KR100358785 B1 KR 100358785B1 KR 1019970701445 A KR1019970701445 A KR 1019970701445A KR 19970701445 A KR19970701445 A KR 19970701445A KR 100358785 B1 KR100358785 B1 KR 100358785B1
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smart card
wire
semiconductor chip
manufacturing
carrier
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KR1019970701445A
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KR970705803A (ko
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요제프 문디글
데틀레프 호우도
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지멘스 악티엔게젤샤프트
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Abstract

스마트 카드 모듈은 운반체(1)위에 배치된 안테나 코일(5)과, 결합 접촉에 의해서 운반체(1)위에 배치된 반도체 칩(3)에 연결되는 연결부(6)를 갖는다.

Description

무 접촉 스마트 카드용 스마트 카드 모듈을 제조하기 위한 방법
무 접촉 스마트 카드의 경우에, 상기 카드에 포함된 반도체 칩을 동작시키는데 필요한 전력은 일반적으로 선택되는 변압기내의 적어도 하나의 안테나 코일에 의해 공급된다. 또한 데이타 이동은 상기 코일에 의해 일어난다.
이 경우에, 인쇄되거나 에칭된 코일 또는 스트립-라인 형태로 전착에 의해 성장된 코일 및 에나멜-절연된 권선 코일이 일반적인데, 에나멜 절연된 권선 코일용 기본 재료로 구리가 이용된다.
상기 코일을 반도체 칩에 연결하기 위하여, 절연체가 초기에 예를들어 가열, 브러싱, 화학처리 또는 주석 코팅에 의해 코일의 연결부로부터 해체되고난후, 접촉부가 예를들어, 레이저 납땜, 갭 용접, 초음파 용접, 와이어 랩 또는 은 에나멜 접착에 의해 결합된 접착제에 의해 형성된다. 따라서, 이러한 연결부의 형성은 개개의 경우에 다수의 서로 다른 동작과 어셈블리 단계를 필요로하며, 또한 이들의 수행을 위해서는 다수의 장치가 필요하다.
독일 특허 제3,721,822 C1호에는 결합제(bond)를 통해 반도체 칩에 안테나코일을 연결하는것이 개시되어 있다. 그러므로 이러한 개시된 바의 경우에 코일은 초기에 권선되어야만 하며, 이때 코일의 단부는 부가의 동작 단계에서 결합제에 의해서 반도체 칩에 연결된다.
본 발명은 무 접촉 스마트 카드용 스마트 카드 모듈을 제조하기 위한 방법에 관한것이다.
도1은 본 발명에 따른 스마트 카드 모듈의 가능한 실시예를 나타내는 도면.
본 발명의 목적은 무 접촉 스마트 카드용 스마트 카드 모듈을 제조하기위한 방법을 제공함과 동시에, 이 방법이 간단하고 비용이 저렴하며 또한 쉽게 자동화 될 수 있도록 하는데 있다.
이러한 목적은 청구항 1에 따른 방법에 의해 달성된다. 본 발명의 바람직한 개선은 종속항에서 구체적으로 기술된다.
코일 연결부는 본 발명의 방법에 의해 반도체 칩의 접촉 영역에 바로 결합되어 있다. 이 경우에, 결합 장치는 자동코일-권선장치의 와이어 안내 헤드에 바로 결합되며, 그 결과 모든 어셈블리 단계는 하나의 장치를 이용하여 수행될수 있다. 알루미늄 와이어는 코일용으로 특히 바람직하게 사용된다. 이 와이어는 구리의 절반 이상으로 가볍고, 또한 약 반 정도 크기의 탄성 모듈을 가지며, 그 결과 완성된 카드는 더 작은 강도를 갖는다. 이런 형태의 두꺼운 와이어 결합은 예를 들어 전력 전자 공학에서 공지되어 있고, 또한 바람직하게 조절되며, 그 결과 높은 생산량이 달성된다.
본 발명의 바람직한 개선점으로서, 반도체 칩은 결합 접촉부에 의해 운반체의 리세스에 자유롭게 정지 고정되는 식으로 배치된다. 그 결과 반도체 칩은 스마트 카드가 휘어지는 압력을 받을 경우에는 파손에 대해 바람직하게 보호된다.
본 발명을 도 1을 참고로 예시적인 실시예를 이용하여 더 상세히 후술하겠다. 이 경우에, 도면은 본 발명에 따른 스마트 카드 모듈의 가능한 실시예를 나타낸다.
가요성인 비 전도성 재료로 이루어진 평판 운반체(1)는 리세스(2)를 갖는다. 반도체 칩(3)은 상기 리세스에 삽입된다. 반도체 칩(3)은 통상의 칩 접촉 영역과 비교해서 골드 평판등에 의하여 확대된 2개 접촉 영역(4)을 갖는다. 안테나 코일(5)의 연결부(6)는 결합 접촉에 의해 접촉 영역(4)에 고정된다. 이 경우에 알루미늄으로 유리하게 이루어진 와이어는 처음에 접촉 영역(4) 중 한 영역에 결합되고나서, 자동 와이어-권선 장치의 안내 헤드에 의해 권선되며, 결합 장치에는 코일을 형성하기 위해 다수의 권수(도면에는 2개의 권수만이 도시되지만, 더 있을 수 있다)가 결합되고 최종적으로 다른 접촉 영역에 다시 결합된다. 본 발명의 방법으로 이곳에 고정된 코일(5)을 갖는 반도체 칩(3)은 운반체(1)의 리세스에 삽입되며, 그 결과 코일(5)은 운반체(1) 위에 배치된다. 이 경우에, 운반체(7)는 완성된 스마트 카드의 길이와 폭을 가지며, 그 결과 스마트 카드는 운반체 위에 해당하는 덮게로서 완성될 수 있다. 그러나, 운반체(1)는 스마트 카드보다 작은 크기를 가질수 있으며, 그 결과 운반체(1)는 입구와 같이 프레임 형태인 스마트 카드의 중심부에 삽입될 수 있다.

Claims (2)

  1. 얇은 와이어의 한 단부는 반도체 칩(3)의 제1 접촉 영역(4)에 결합되는 단계;
    상기 와이어는 다수의 권수(5)로서 결합 헤드에 의해 안내되는 단계;
    상기 와이어는 상기 반도체 칩(3)의 제2 접촉 영역(4)에 결합되는 단계;
    안테나 코일(5)을 형성하는 상기 와이어 권수와 상기 반도체 칩(3)은 운반체(1)위에 배치되는 단계를 포함하는 것을 특징으로하는 스마트 카드 모듈 제조 방법.
  2. 제 1 항에 있어서, 상기 안테나 코일(5)을 형성하는 와이어 권수는 상기 반도체 칩(3)이 상기 와이어 단부(6)의 결합으로부터 정지되는 방식으로 상기 운반체(1)의 리세스(2)에 수용되도록 상기 운반체(1) 위에 배치되는 것을 특징으로 하는 스마트 카드 모듈 제조 방법.
KR1019970701445A 1994-09-05 1995-09-05 무접촉스마트카드용스마트카드모듈을제조하기위한방법 KR100358785B1 (ko)

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Families Citing this family (142)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
AT1470U1 (de) * 1995-08-01 1997-05-26 Austria Card Laminierte karte und verfahren zu ihrer herstellung
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US6441736B1 (en) 1999-07-01 2002-08-27 Keith R. Leighton Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices
US6036099A (en) 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
ATE193136T1 (de) * 1996-02-12 2000-06-15 David Finn Verfahren und vorrichtung zur kontaktierung eines drahtleiters
FR2747812B1 (fr) * 1996-04-23 1998-05-22 Solaic Sa Carte a circuit integre sans contact avec antenne en polymere conducteur
DE19616424A1 (de) * 1996-04-25 1997-10-30 Manfred Dr Michalk Elektrisch isolierendes Material mit einem elektronischen Modul
DE19627827A1 (de) * 1996-07-10 1998-01-22 Siemens Ag Chipkarte und Verfahren zu ihrer Herstellung
DE19634473C2 (de) * 1996-07-11 2003-06-26 David Finn Verfahren zur Herstellung einer Chipkarte
ATE210365T1 (de) * 1996-07-18 2001-12-15 Nagraid Sa Verfahren zur herstellung von gedruckten schaltungen sowie nach diesem verfahren hergestellte gedruckte schaltung
DE19647845C2 (de) * 1996-11-19 2002-01-10 Pav Card Gmbh Verfahren zum Herstellen einer Chipkarte
FR2756648B1 (fr) * 1996-11-29 1999-01-08 Solaic Sa Carte a memoire du type sans contact
DE19701167A1 (de) * 1997-01-15 1998-07-23 Siemens Ag Chipkarte
US6329213B1 (en) * 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
DE19728512A1 (de) * 1997-07-04 1999-01-07 Aeg Identifikationssys Gmbh Transponderanordnung und Verfahren zu deren Herstellung
DE19731969A1 (de) * 1997-07-24 1998-08-27 Siemens Ag Verfahren zum Herstellen eines elektrischen Bauteils
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
FR2769109B1 (fr) * 1997-09-26 1999-11-19 Gemplus Sca Dispositif electronique a puce jetable et procede de fabrication
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
US20110043430A1 (en) * 1997-10-16 2011-02-24 Oded Bashan Manufacture of a smart card
JP3687783B2 (ja) * 1997-11-04 2005-08-24 エルケ ツァケル コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード
FR2774617B1 (fr) * 1998-02-06 2000-05-05 St Microelectronics Sa Procede et machine d'usinage d'une cavite dans une carte a puce electronique renfermant une antenne
FR2778475B1 (fr) 1998-05-11 2001-11-23 Schlumberger Systems & Service Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
DE19844089C2 (de) * 1998-06-25 2001-04-05 Pav Card Gmbh Verfahren zur Herstellung von Transponderanordnungen
EP0967570B1 (de) * 1998-06-25 2006-09-06 PAV Card GmbH Verfahren zur Herstellung von Transponderchips
FR2781298B1 (fr) 1998-07-20 2003-01-31 St Microelectronics Sa Procede de fabrication d'une carte a puce electronique et carte a puce electronique
WO2000030210A1 (en) * 1998-11-12 2000-05-25 Motorola Inc. Smartcard module and method of attaching antenna wires thereto
US6205646B1 (en) * 1998-12-21 2001-03-27 Philips Electronics North America Corp. Method for air-wound coil vacuum pick-up, surface mounting, and adjusting
JP3335938B2 (ja) * 1999-03-01 2002-10-21 新光電気工業株式会社 Ｉｃカード用アンテナフレーム及びｉｃカードの製造方法
JP3517374B2 (ja) * 1999-05-21 2004-04-12 新光電気工業株式会社 非接触型ｉｃカードの製造方法
US7306158B2 (en) * 2001-07-10 2007-12-11 American Express Travel Related Services Company, Inc. Clear contactless card
US7837116B2 (en) 1999-09-07 2010-11-23 American Express Travel Related Services Company, Inc. Transaction card
US7239226B2 (en) 2001-07-10 2007-07-03 American Express Travel Related Services Company, Inc. System and method for payment using radio frequency identification in contact and contactless transactions
US7889052B2 (en) 2001-07-10 2011-02-15 Xatra Fund Mx, Llc Authorizing payment subsequent to RF transactions
DE19958328A1 (de) 1999-10-08 2001-07-12 Flexchip Ag Verfahren zum Herstellen einer elektrischen Verbindung zwischen Chip-Kontaktelemente-Einheiten und externen Kontaktanschlüssen
DE19948555A1 (de) * 1999-12-03 2001-05-03 Andreas Plettner Verfahren zur Herstellung kontaktloser Chipkarten sowie zur Herstellung von elektrischen Einheiten, bestehend aus Chips mit Kontaktelementen
FR2801122B1 (fr) * 1999-11-16 2004-02-20 Schlumberger Systems & Service Carte a memoire du type sans contact et procedes de fabrication d'une telle carte
US8429041B2 (en) 2003-05-09 2013-04-23 American Express Travel Related Services Company, Inc. Systems and methods for managing account information lifecycles
US8543423B2 (en) 2002-07-16 2013-09-24 American Express Travel Related Services Company, Inc. Method and apparatus for enrolling with multiple transaction environments
US7172112B2 (en) 2000-01-21 2007-02-06 American Express Travel Related Services Company, Inc. Public/private dual card system and method
JP3680676B2 (ja) * 2000-02-03 2005-08-10 松下電器産業株式会社 非接触データキャリア
US7627531B2 (en) 2000-03-07 2009-12-01 American Express Travel Related Services Company, Inc. System for facilitating a transaction
DE10014620A1 (de) * 2000-03-24 2001-09-27 Andreas Plettner Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente
WO2001084470A2 (en) * 2000-05-02 2001-11-08 Supercom Ltd. Upgrading conventional documents to smart documents
EP1176548A3 (en) * 2000-07-28 2003-03-05 Oji Paper Co., Ltd. IC package and method of fabricating the same
US6588660B1 (en) 2000-09-29 2003-07-08 Hewlett-Packard Development Company, L.P. Passive contactless smartcard security system
US6923378B2 (en) 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
GB2371264A (en) * 2001-01-18 2002-07-24 Pioneer Oriental Engineering L Smart card with embedded antenna
JP2002319011A (ja) * 2001-01-31 2002-10-31 Canon Inc 半導体装置、半導体装置の製造方法及び電子写真装置
US6582887B2 (en) 2001-03-26 2003-06-24 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture
US7564409B2 (en) * 2001-03-26 2009-07-21 Ertek Inc. Antennas and electrical connections of electrical devices
US7452656B2 (en) 2001-03-26 2008-11-18 Ertek Inc. Electrically conductive patterns, antennas and methods of manufacture
US7394425B2 (en) * 2001-03-26 2008-07-01 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture
US7650314B1 (en) 2001-05-25 2010-01-19 American Express Travel Related Services Company, Inc. System and method for securing a recurrent billing transaction
US7725427B2 (en) 2001-05-25 2010-05-25 Fred Bishop Recurrent billing maintenance with radio frequency payment devices
US8635131B1 (en) 2001-07-10 2014-01-21 American Express Travel Related Services Company, Inc. System and method for managing a transaction protocol
US9024719B1 (en) 2001-07-10 2015-05-05 Xatra Fund Mx, Llc RF transaction system and method for storing user personal data
US7503480B2 (en) * 2001-07-10 2009-03-17 American Express Travel Related Services Company, Inc. Method and system for tracking user performance
US7705732B2 (en) 2001-07-10 2010-04-27 Fred Bishop Authenticating an RF transaction using a transaction counter
US9454752B2 (en) 2001-07-10 2016-09-27 Chartoleaux Kg Limited Liability Company Reload protocol at a transaction processing entity
US7996324B2 (en) 2001-07-10 2011-08-09 American Express Travel Related Services Company, Inc. Systems and methods for managing multiple accounts on a RF transaction device using secondary identification indicia
US8960535B2 (en) 2001-07-10 2015-02-24 Iii Holdings 1, Llc Method and system for resource management and evaluation
US7746215B1 (en) 2001-07-10 2010-06-29 Fred Bishop RF transactions using a wireless reader grid
US8548927B2 (en) 2001-07-10 2013-10-01 Xatra Fund Mx, Llc Biometric registration for facilitating an RF transaction
US7668750B2 (en) 2001-07-10 2010-02-23 David S Bonalle Securing RF transactions using a transactions counter
US8001054B1 (en) 2001-07-10 2011-08-16 American Express Travel Related Services Company, Inc. System and method for generating an unpredictable number using a seeded algorithm
US20040236699A1 (en) 2001-07-10 2004-11-25 American Express Travel Related Services Company, Inc. Method and system for hand geometry recognition biometrics on a fob
US8538863B1 (en) 2001-07-10 2013-09-17 American Express Travel Related Services Company, Inc. System and method for facilitating a transaction using a revolving use account associated with a primary account
US7360689B2 (en) 2001-07-10 2008-04-22 American Express Travel Related Services Company, Inc. Method and system for proffering multiple biometrics for use with a FOB
US9031880B2 (en) 2001-07-10 2015-05-12 Iii Holdings 1, Llc Systems and methods for non-traditional payment using biometric data
US7925535B2 (en) 2001-07-10 2011-04-12 American Express Travel Related Services Company, Inc. System and method for securing RF transactions using a radio frequency identification device including a random number generator
US7249112B2 (en) 2002-07-09 2007-07-24 American Express Travel Related Services Company, Inc. System and method for assigning a funding source for a radio frequency identification device
US7303120B2 (en) 2001-07-10 2007-12-04 American Express Travel Related Services Company, Inc. System for biometric security using a FOB
US7493288B2 (en) 2001-07-10 2009-02-17 Xatra Fund Mx, Llc RF payment via a mobile device
US8279042B2 (en) 2001-07-10 2012-10-02 Xatra Fund Mx, Llc Iris scan biometrics on a payment device
US7119659B2 (en) 2001-07-10 2006-10-10 American Express Travel Related Services Company, Inc. Systems and methods for providing a RF transaction device for use in a private label transaction
US8294552B2 (en) 2001-07-10 2012-10-23 Xatra Fund Mx, Llc Facial scan biometrics on a payment device
US7762457B2 (en) 2001-07-10 2010-07-27 American Express Travel Related Services Company, Inc. System and method for dynamic fob synchronization and personalization
US7827106B2 (en) 2001-07-10 2010-11-02 American Express Travel Related Services Company, Inc. System and method for manufacturing a punch-out RFID transaction device
US7805378B2 (en) 2001-07-10 2010-09-28 American Express Travel Related Servicex Company, Inc. System and method for encoding information in magnetic stripe format for use in radio frequency identification transactions
EP1302894A3 (de) * 2001-10-12 2003-10-29 Multitape GmbH Kontaktlose Chipkarte und Herstellungsverfahren
US20030085288A1 (en) * 2001-11-06 2003-05-08 Luu Deniel V.H. Contactless SIM card carrier with detachable antenna and carrier therefore
PT1456810E (pt) 2001-12-18 2011-07-25 L 1 Secure Credentialing Inc Características de segurança com imagens múltiplas para documentos de identificação e processo para as efectuar
AU2002364746A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Systems, compositions, and methods for full color laser engraving of id documents
US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
WO2003055638A1 (en) 2001-12-24 2003-07-10 Digimarc Id Systems, Llc Laser etched security features for identification documents and methods of making same
CA2471457C (en) 2001-12-24 2011-08-02 Digimarc Id Systems, Llc Covert variable information on id documents and methods of making same
US7815124B2 (en) 2002-04-09 2010-10-19 L-1 Secure Credentialing, Inc. Image processing techniques for printing identification cards and documents
US6962439B2 (en) * 2002-03-08 2005-11-08 The Bagco, Inc. Leak resistant tamper evident reclosable plastic bag
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
JP4058300B2 (ja) * 2002-06-21 2008-03-05 株式会社日立製作所 携帯情報装置
US6805287B2 (en) 2002-09-12 2004-10-19 American Express Travel Related Services Company, Inc. System and method for converting a stored value card to a credit card
US7804982B2 (en) 2002-11-26 2010-09-28 L-1 Secure Credentialing, Inc. Systems and methods for managing and detecting fraud in image databases used with identification documents
US7712673B2 (en) 2002-12-18 2010-05-11 L-L Secure Credentialing, Inc. Identification document with three dimensional image of bearer
WO2004095348A2 (en) 2003-04-16 2004-11-04 Digimarc Corporation Three dimensional data storage
JP2005093867A (ja) * 2003-09-19 2005-04-07 Seiko Epson Corp 半導体装置及びその製造方法
DE202004003554U1 (de) * 2004-03-04 2004-06-03 Novacard Informationssysteme Gmbh Chipkarte
EP1738303B1 (fr) * 2004-03-25 2008-09-17 Bauer, Eric Procede de fabrication d'une etiquette electronique
US7318550B2 (en) 2004-07-01 2008-01-15 American Express Travel Related Services Company, Inc. Biometric safeguard method for use with a smartcard
FR2876507B1 (fr) * 2004-10-12 2006-12-01 K Sa As Etiquette sans contact a antenne en y omnidirectionnelle
CA2585168C (en) * 2004-11-02 2014-09-09 Imasys Ag Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit
US20060180674A1 (en) * 2005-02-14 2006-08-17 Aladdin Knowledge Systems Ltd. Security card apparatus
JP2006271596A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
EP1720120A1 (en) * 2005-05-04 2006-11-08 Axalto S.A. A method for manufacturing a smart card, a thus manufactured smart card, and a method for manufacturing a wired antenna
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US8608080B2 (en) * 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7979975B2 (en) * 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Ｒｆｉｄを内蔵したゲームカードおよびその製造方法
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
ATE488816T1 (de) 2007-09-18 2010-12-15 Hid Global Ireland Teoranta Verfahren zur kontaktierung eines drahtleiters gelegt auf ein substrat
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
CN101933034B (zh) * 2008-01-23 2015-04-01 斯迈达Ip有限公司 用于制造智能卡嵌体的方法和***
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
US8613132B2 (en) 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate
EP2567349B1 (en) 2010-05-04 2014-11-12 Féinics AmaTech Teoranta Manufacturing rfid inlays
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
CN101976368A (zh) * 2010-09-21 2011-02-16 深圳市卡的智能科技有限公司 Ic卡的制作方法
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
DE102011016159B3 (de) * 2011-04-05 2012-10-18 Micronas Gmbh Anordnung aus einem integrierten passiven Bauelement und einem auf einem Metallträger angeordneten Halbleiterkörper
EP2718876A1 (en) 2011-06-04 2014-04-16 Féinics AmaTech Teoranta Preparing a substrate for embedding wire
DE102011114635A1 (de) * 2011-10-04 2013-04-04 Smartrac Ip B.V. Chipkarte und Verfahren zur Herstellung einer Chipkarte
CN103577869A (zh) * 2012-08-01 2014-02-12 东莞市锐祥智能卡科技有限公司 卡片绕线方法
JP6091849B2 (ja) * 2012-11-08 2017-03-08 株式会社トッパンＴｄｋレーベル 非接触通信媒体の製造方法、非接触通信媒体、及びアンテナと回路装置の接続方法
WO2015038652A1 (en) * 2013-09-10 2015-03-19 The Charles Stark Draper Laboratory, Inc. Method for forming electronic component and electronic component
KR101516005B1 (ko) * 2014-09-19 2015-05-07 주식회사 모비너스 와이어를 이용한 nfc안테나
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce
CN109214494B (zh) * 2018-10-25 2021-07-09 上海东方磁卡信息股份有限公司 非接触智能卡及其制造方法
CN109786305B (zh) * 2019-01-28 2021-02-26 上海东方磁卡信息股份有限公司 非接触卡制造设备及非接触卡制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143915A1 (de) * 1981-11-05 1983-05-11 Brown, Boveri & Cie Ag, 6800 Mannheim Identitaetskarte
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
US4857893A (en) * 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
DE4019915A1 (de) * 1990-06-22 1992-01-02 Bosch Gmbh Robert Verfahren und einrichtung zur herstellung einer verbindung zwischen einem bonddraht und einer metallischen kontaktflaeche
DE4034225C2 (de) * 1990-10-26 1994-01-27 Reinhard Jurisch Datenträger für Identifikationssysteme
WO1993009551A1 (de) * 1991-11-08 1993-05-13 Herbert Stowasser Transponder sowie verfahren und vorrichtung zur herstellung
FI89752C (fi) * 1992-04-01 1993-11-10 Picopak Oy Foerfarande foer anslutning av en mikrokrets till en induktiv spole i ett smartkort samt anordning vid ett induktivt smartkort

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ES2125650T3 (es) 1999-03-01
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US5809633A (en) 1998-09-22
EP0780006A1 (de) 1997-06-25
DE59504285D1 (de) 1998-12-24
DE4431605C2 (de) 1998-06-04
EP0780006B1 (de) 1998-11-18
FI970924A (fi) 1997-03-04
CN1160447A (zh) 1997-09-24
WO1996007984A1 (de) 1996-03-14
FI970924A0 (fi) 1997-03-04
DE4431605A1 (de) 1996-03-07
UA54374C2 (uk) 2003-03-17
ATE173553T1 (de) 1998-12-15
CN1105988C (zh) 2003-04-16
JPH10505023A (ja) 1998-05-19

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