JPH10505023A - 無接触チップカード用のチップカードモジュールの製造方法 - Google Patents
無接触チップカード用のチップカードモジュールの製造方法Info
- Publication number
- JPH10505023A JPH10505023A JP8509119A JP50911996A JPH10505023A JP H10505023 A JPH10505023 A JP H10505023A JP 8509119 A JP8509119 A JP 8509119A JP 50911996 A JP50911996 A JP 50911996A JP H10505023 A JPH10505023 A JP H10505023A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- chip card
- semiconductor chip
- manufacturing
- antenna coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】
保持体(1)の上に配置されているアンテナコイル(5)を有するチップカードモジュールにおいて、その接続端(6)が同じく保持体(1)の上に配置されている半導体チップ(3)とボンド接続により接続されている。
Description
【発明の詳細な説明】
無接触チップカード用のチップカードモジュールの製造方法
無接触チップカードではそのなかに含まれている半導体チップの作動のために
必要なエネルギーが少なくとも1つのアンテナコイルを介して供給され、その際
にたいてい電磁誘導結合による伝達が選ばれる。データ転送もこれらのコイルを
介して行われる。
その際に印刷、エッチングまたは電気メッキ成長により形成されたストリップ
導体の形態のコイルも、巻かれたエナメル線コイルも一般に用いられており、そ
の際にこのようなエナメル線コイルの基本材料としては銅が使用される。
コイルを半導体チップと接続するためには先ずコイルの接続端がたとえば加熱
ブラシかけ、化学的処理または錫めっきにより絶縁除去され、また次いでたとえ
ばレーザーろう付け、スリット溶接、超音波溶接、ワイヤーラップまたは銀ラッ
ク接着剤による接着により接触化される。このような接続を形成するにはそれぞ
れ多数のさまざまな作業工程または組立工程が必要であり、これらはその実施の
ために多くの機械を必要とする。
ドイツ特許第 3721822号明細書から、アンテナコイルをボンド接続を介して半
導体チップと接続することは公知である。そこでば先ずコイルが巻かれ、その端
部が次いで別の作業工程でボンド接続を介して半導体チップと接続されなければ
ならない。
本発明の課題は、無接触チップカード用のチップカードモジュールの製造方法
であって、簡単で、経済的で、かつ容易に自動化可能な製造方法を提供すること
にある。
この課題は請求項1による方法により解決される。本発明の有利な実施態様は
従属請求項に記載されている。
本発明によればコイル接続端が直接に半導体チップの接触領域の上にボンディ
ングされる。その際にボンダーは直接に自動コイル巻き機械のワイヤー案内ヘッ
ドに一体化されているので、すべての組立工程は1つの機械により行うことがで
きる。特に有利なことはコイルに対してアルミニウムワイヤーが使用されること
である。これは銅の半分以下の軽量であり、また銅の半分に過ぎない弾性係数を
有するので、仕上がったカードはより小さい剛性を有する。この形式の太いワイ
ヤーによるボンディングはたとえばパワーエレクトロニクスから知られており、
また高い収率が得られるように良好に制御される。
本発明の有利な実施態様では、半導体チップは、チップカードの曲げ応力の際
の損傷から良好に保護されるように、自由に浮いてボンド接触によってのみ保持
体の孔のなかに配置されている。
以下、図面に示されている実施例により本発明を一層詳細に説明する。その際
に図面は本発明によるチップカードの可能な実施例を示す。
可撓性で非導電性の材料から成る平坦な保持体1は孔2を有する。この孔のな
かに半導体チップ3が入れられている。半導体チップ3は、通常のチップカード
領域にくらべてたとえば金被覆により拡大されている2つの接触領域4を有する
。接触領域4の上にアンテナコイル5の接続端部6がボンド接触により取付けら
れている。その際に、有利なことにアルミニウムから成っているワイヤーは先ず
接触領域4の1つの上にボンドされ、次いで、ボンダーが一体に組み込まれてい
る自動ワイヤー巻き機械の案内ヘッドを用いて多数のターンのコイルとして巻か
れ(図面には2つのターンしか示されていないが、それよりも多いターン数であ
ってもよい)、また最後に再び他方の接触領域の上にボンドされた。続いて半導
体チップ3が本発明による仕方でそれに取付けられたコイル5と共に、コイル5
が保持体1の上に配置されるように、保持体1の孔2のなかに入れられる。その
際に保持体1は、単に保持体の相応の被覆除去によりチップカードが完成される
ように、完成したチップカードの長さおよび幅を持つことができる。しかし保持
体1は、チップカードの枠状の中心部分のなかに入れ子として入れることができ
るように、チップカードよりも小さい寸法を有してもよい。
Claims (1)
- 【特許請求の範囲】 1.細いワイヤーの一端が半導体チップ(3)の第1の接触領域(4)の上にボ ンディングされ、 ワイヤーがボンドヘッドを用いて多数のターン(5)に導かれ、 ワイヤーが半導体チップ(3)の第2の接触領域(4)の上にボンディングさ れ、 アンテナコイル(5)を形成するワイヤーターンおよび半導体チップ(3)が 保持体(1)の上に配置される ことを特徴とするチップカードモジュールの製造方法。 2.アンテナコイル(5)を形成するワイヤーターンが、半導体チップ(3)が 保持体(1)の孔(2)のなかにワイヤー端(6)のボンド接続から浮いて保た れるように、保持体(1)の上に配置されることを特徴とする請求項1記載の方 法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4431605A DE4431605C2 (de) | 1994-09-05 | 1994-09-05 | Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten |
DE4431605.4 | 1994-09-05 | ||
PCT/DE1995/001201 WO1996007984A1 (de) | 1994-09-05 | 1995-09-05 | Verfahren zur herstellung eines chipkartenmoduls für kontaktlose chipkarten |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10505023A true JPH10505023A (ja) | 1998-05-19 |
Family
ID=6527470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8509119A Pending JPH10505023A (ja) | 1994-09-05 | 1995-09-05 | 無接触チップカード用のチップカードモジュールの製造方法 |
Country Status (12)
Country | Link |
---|---|
US (1) | US5809633A (ja) |
EP (1) | EP0780006B1 (ja) |
JP (1) | JPH10505023A (ja) |
KR (1) | KR100358785B1 (ja) |
CN (1) | CN1105988C (ja) |
AT (1) | ATE173553T1 (ja) |
DE (2) | DE4431605C2 (ja) |
ES (1) | ES2125650T3 (ja) |
FI (1) | FI970924A0 (ja) |
RU (1) | RU2155379C2 (ja) |
UA (1) | UA54374C2 (ja) |
WO (1) | WO1996007984A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009259258A (ja) * | 1997-09-26 | 2009-11-05 | Gemplus Sca | 使い捨てチップ電子装置及び製造方法 |
JP2014096006A (ja) * | 2012-11-08 | 2014-05-22 | Toppan Tdk Label Co Ltd | 非接触通信媒体の製造方法、非接触通信媒体、及びアンテナと回路装置の接続方法 |
Families Citing this family (140)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7158031B2 (en) | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
DE4437721A1 (de) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Kontaktloses elektronisches Modul |
AT1470U1 (de) * | 1995-08-01 | 1997-05-26 | Austria Card | Laminierte karte und verfahren zu ihrer herstellung |
US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US6441736B1 (en) | 1999-07-01 | 2002-08-27 | Keith R. Leighton | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
US6036099A (en) | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
ATE193136T1 (de) * | 1996-02-12 | 2000-06-15 | David Finn | Verfahren und vorrichtung zur kontaktierung eines drahtleiters |
FR2747812B1 (fr) * | 1996-04-23 | 1998-05-22 | Solaic Sa | Carte a circuit integre sans contact avec antenne en polymere conducteur |
DE19616424A1 (de) * | 1996-04-25 | 1997-10-30 | Manfred Dr Michalk | Elektrisch isolierendes Material mit einem elektronischen Modul |
DE19627827A1 (de) * | 1996-07-10 | 1998-01-22 | Siemens Ag | Chipkarte und Verfahren zu ihrer Herstellung |
DE19634473C2 (de) * | 1996-07-11 | 2003-06-26 | David Finn | Verfahren zur Herstellung einer Chipkarte |
ATE210365T1 (de) * | 1996-07-18 | 2001-12-15 | Nagraid Sa | Verfahren zur herstellung von gedruckten schaltungen sowie nach diesem verfahren hergestellte gedruckte schaltung |
DE19647845C2 (de) * | 1996-11-19 | 2002-01-10 | Pav Card Gmbh | Verfahren zum Herstellen einer Chipkarte |
FR2756648B1 (fr) * | 1996-11-29 | 1999-01-08 | Solaic Sa | Carte a memoire du type sans contact |
DE19701167A1 (de) * | 1997-01-15 | 1998-07-23 | Siemens Ag | Chipkarte |
US6329213B1 (en) * | 1997-05-01 | 2001-12-11 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
DE19728512A1 (de) * | 1997-07-04 | 1999-01-07 | Aeg Identifikationssys Gmbh | Transponderanordnung und Verfahren zu deren Herstellung |
DE19731969A1 (de) * | 1997-07-24 | 1998-08-27 | Siemens Ag | Verfahren zum Herstellen eines elektrischen Bauteils |
US6339385B1 (en) | 1997-08-20 | 2002-01-15 | Micron Technology, Inc. | Electronic communication devices, methods of forming electrical communication devices, and communication methods |
FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
US20110043430A1 (en) * | 1997-10-16 | 2011-02-24 | Oded Bashan | Manufacture of a smart card |
JP3687783B2 (ja) * | 1997-11-04 | 2005-08-24 | エルケ ツァケル | コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード |
FR2774617B1 (fr) * | 1998-02-06 | 2000-05-05 | St Microelectronics Sa | Procede et machine d'usinage d'une cavite dans une carte a puce electronique renfermant une antenne |
FR2778475B1 (fr) | 1998-05-11 | 2001-11-23 | Schlumberger Systems & Service | Carte a memoire du type sans contact, et procede de fabrication d'une telle carte |
DE19844089C2 (de) * | 1998-06-25 | 2001-04-05 | Pav Card Gmbh | Verfahren zur Herstellung von Transponderanordnungen |
EP0967570B1 (de) * | 1998-06-25 | 2006-09-06 | PAV Card GmbH | Verfahren zur Herstellung von Transponderchips |
FR2781298B1 (fr) | 1998-07-20 | 2003-01-31 | St Microelectronics Sa | Procede de fabrication d'une carte a puce electronique et carte a puce electronique |
WO2000030210A1 (en) * | 1998-11-12 | 2000-05-25 | Motorola Inc. | Smartcard module and method of attaching antenna wires thereto |
US6205646B1 (en) * | 1998-12-21 | 2001-03-27 | Philips Electronics North America Corp. | Method for air-wound coil vacuum pick-up, surface mounting, and adjusting |
JP3335938B2 (ja) * | 1999-03-01 | 2002-10-21 | 新光電気工業株式会社 | Icカード用アンテナフレーム及びicカードの製造方法 |
JP3517374B2 (ja) * | 1999-05-21 | 2004-04-12 | 新光電気工業株式会社 | 非接触型icカードの製造方法 |
US7306158B2 (en) * | 2001-07-10 | 2007-12-11 | American Express Travel Related Services Company, Inc. | Clear contactless card |
US7837116B2 (en) | 1999-09-07 | 2010-11-23 | American Express Travel Related Services Company, Inc. | Transaction card |
US7239226B2 (en) | 2001-07-10 | 2007-07-03 | American Express Travel Related Services Company, Inc. | System and method for payment using radio frequency identification in contact and contactless transactions |
US7889052B2 (en) | 2001-07-10 | 2011-02-15 | Xatra Fund Mx, Llc | Authorizing payment subsequent to RF transactions |
DE19958328A1 (de) | 1999-10-08 | 2001-07-12 | Flexchip Ag | Verfahren zum Herstellen einer elektrischen Verbindung zwischen Chip-Kontaktelemente-Einheiten und externen Kontaktanschlüssen |
DE19948555A1 (de) * | 1999-12-03 | 2001-05-03 | Andreas Plettner | Verfahren zur Herstellung kontaktloser Chipkarten sowie zur Herstellung von elektrischen Einheiten, bestehend aus Chips mit Kontaktelementen |
FR2801122B1 (fr) * | 1999-11-16 | 2004-02-20 | Schlumberger Systems & Service | Carte a memoire du type sans contact et procedes de fabrication d'une telle carte |
US8429041B2 (en) | 2003-05-09 | 2013-04-23 | American Express Travel Related Services Company, Inc. | Systems and methods for managing account information lifecycles |
US8543423B2 (en) | 2002-07-16 | 2013-09-24 | American Express Travel Related Services Company, Inc. | Method and apparatus for enrolling with multiple transaction environments |
US7172112B2 (en) | 2000-01-21 | 2007-02-06 | American Express Travel Related Services Company, Inc. | Public/private dual card system and method |
JP3680676B2 (ja) * | 2000-02-03 | 2005-08-10 | 松下電器産業株式会社 | 非接触データキャリア |
US7627531B2 (en) | 2000-03-07 | 2009-12-01 | American Express Travel Related Services Company, Inc. | System for facilitating a transaction |
DE10014620A1 (de) * | 2000-03-24 | 2001-09-27 | Andreas Plettner | Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente |
WO2001084470A2 (en) * | 2000-05-02 | 2001-11-08 | Supercom Ltd. | Upgrading conventional documents to smart documents |
EP1176548A3 (en) * | 2000-07-28 | 2003-03-05 | Oji Paper Co., Ltd. | IC package and method of fabricating the same |
US6588660B1 (en) | 2000-09-29 | 2003-07-08 | Hewlett-Packard Development Company, L.P. | Passive contactless smartcard security system |
US6923378B2 (en) | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
GB2371264A (en) * | 2001-01-18 | 2002-07-24 | Pioneer Oriental Engineering L | Smart card with embedded antenna |
JP2002319011A (ja) * | 2001-01-31 | 2002-10-31 | Canon Inc | 半導体装置、半導体装置の製造方法及び電子写真装置 |
US6582887B2 (en) | 2001-03-26 | 2003-06-24 | Daniel Luch | Electrically conductive patterns, antennas and methods of manufacture |
US7564409B2 (en) * | 2001-03-26 | 2009-07-21 | Ertek Inc. | Antennas and electrical connections of electrical devices |
US7452656B2 (en) | 2001-03-26 | 2008-11-18 | Ertek Inc. | Electrically conductive patterns, antennas and methods of manufacture |
US7394425B2 (en) * | 2001-03-26 | 2008-07-01 | Daniel Luch | Electrically conductive patterns, antennas and methods of manufacture |
US7650314B1 (en) | 2001-05-25 | 2010-01-19 | American Express Travel Related Services Company, Inc. | System and method for securing a recurrent billing transaction |
US7725427B2 (en) | 2001-05-25 | 2010-05-25 | Fred Bishop | Recurrent billing maintenance with radio frequency payment devices |
US8635131B1 (en) | 2001-07-10 | 2014-01-21 | American Express Travel Related Services Company, Inc. | System and method for managing a transaction protocol |
US9024719B1 (en) | 2001-07-10 | 2015-05-05 | Xatra Fund Mx, Llc | RF transaction system and method for storing user personal data |
US7503480B2 (en) * | 2001-07-10 | 2009-03-17 | American Express Travel Related Services Company, Inc. | Method and system for tracking user performance |
US7705732B2 (en) | 2001-07-10 | 2010-04-27 | Fred Bishop | Authenticating an RF transaction using a transaction counter |
US9454752B2 (en) | 2001-07-10 | 2016-09-27 | Chartoleaux Kg Limited Liability Company | Reload protocol at a transaction processing entity |
US7996324B2 (en) | 2001-07-10 | 2011-08-09 | American Express Travel Related Services Company, Inc. | Systems and methods for managing multiple accounts on a RF transaction device using secondary identification indicia |
US8960535B2 (en) | 2001-07-10 | 2015-02-24 | Iii Holdings 1, Llc | Method and system for resource management and evaluation |
US7746215B1 (en) | 2001-07-10 | 2010-06-29 | Fred Bishop | RF transactions using a wireless reader grid |
US8548927B2 (en) | 2001-07-10 | 2013-10-01 | Xatra Fund Mx, Llc | Biometric registration for facilitating an RF transaction |
US7668750B2 (en) | 2001-07-10 | 2010-02-23 | David S Bonalle | Securing RF transactions using a transactions counter |
US8001054B1 (en) | 2001-07-10 | 2011-08-16 | American Express Travel Related Services Company, Inc. | System and method for generating an unpredictable number using a seeded algorithm |
US20040236699A1 (en) | 2001-07-10 | 2004-11-25 | American Express Travel Related Services Company, Inc. | Method and system for hand geometry recognition biometrics on a fob |
US8538863B1 (en) | 2001-07-10 | 2013-09-17 | American Express Travel Related Services Company, Inc. | System and method for facilitating a transaction using a revolving use account associated with a primary account |
US7360689B2 (en) | 2001-07-10 | 2008-04-22 | American Express Travel Related Services Company, Inc. | Method and system for proffering multiple biometrics for use with a FOB |
US9031880B2 (en) | 2001-07-10 | 2015-05-12 | Iii Holdings 1, Llc | Systems and methods for non-traditional payment using biometric data |
US7925535B2 (en) | 2001-07-10 | 2011-04-12 | American Express Travel Related Services Company, Inc. | System and method for securing RF transactions using a radio frequency identification device including a random number generator |
US7249112B2 (en) | 2002-07-09 | 2007-07-24 | American Express Travel Related Services Company, Inc. | System and method for assigning a funding source for a radio frequency identification device |
US7303120B2 (en) | 2001-07-10 | 2007-12-04 | American Express Travel Related Services Company, Inc. | System for biometric security using a FOB |
US7493288B2 (en) | 2001-07-10 | 2009-02-17 | Xatra Fund Mx, Llc | RF payment via a mobile device |
US8279042B2 (en) | 2001-07-10 | 2012-10-02 | Xatra Fund Mx, Llc | Iris scan biometrics on a payment device |
US7119659B2 (en) | 2001-07-10 | 2006-10-10 | American Express Travel Related Services Company, Inc. | Systems and methods for providing a RF transaction device for use in a private label transaction |
US8294552B2 (en) | 2001-07-10 | 2012-10-23 | Xatra Fund Mx, Llc | Facial scan biometrics on a payment device |
US7762457B2 (en) | 2001-07-10 | 2010-07-27 | American Express Travel Related Services Company, Inc. | System and method for dynamic fob synchronization and personalization |
US7827106B2 (en) | 2001-07-10 | 2010-11-02 | American Express Travel Related Services Company, Inc. | System and method for manufacturing a punch-out RFID transaction device |
US7805378B2 (en) | 2001-07-10 | 2010-09-28 | American Express Travel Related Servicex Company, Inc. | System and method for encoding information in magnetic stripe format for use in radio frequency identification transactions |
EP1302894A3 (de) * | 2001-10-12 | 2003-10-29 | Multitape GmbH | Kontaktlose Chipkarte und Herstellungsverfahren |
US20030085288A1 (en) * | 2001-11-06 | 2003-05-08 | Luu Deniel V.H. | Contactless SIM card carrier with detachable antenna and carrier therefore |
PT1456810E (pt) | 2001-12-18 | 2011-07-25 | L 1 Secure Credentialing Inc | Características de segurança com imagens múltiplas para documentos de identificação e processo para as efectuar |
AU2002364746A1 (en) | 2001-12-24 | 2003-07-15 | Digimarc Id Systems, Llc | Systems, compositions, and methods for full color laser engraving of id documents |
US7694887B2 (en) | 2001-12-24 | 2010-04-13 | L-1 Secure Credentialing, Inc. | Optically variable personalized indicia for identification documents |
US7728048B2 (en) | 2002-12-20 | 2010-06-01 | L-1 Secure Credentialing, Inc. | Increasing thermal conductivity of host polymer used with laser engraving methods and compositions |
WO2003055638A1 (en) | 2001-12-24 | 2003-07-10 | Digimarc Id Systems, Llc | Laser etched security features for identification documents and methods of making same |
CA2471457C (en) | 2001-12-24 | 2011-08-02 | Digimarc Id Systems, Llc | Covert variable information on id documents and methods of making same |
US7815124B2 (en) | 2002-04-09 | 2010-10-19 | L-1 Secure Credentialing, Inc. | Image processing techniques for printing identification cards and documents |
US6962439B2 (en) * | 2002-03-08 | 2005-11-08 | The Bagco, Inc. | Leak resistant tamper evident reclosable plastic bag |
US7824029B2 (en) | 2002-05-10 | 2010-11-02 | L-1 Secure Credentialing, Inc. | Identification card printer-assembler for over the counter card issuing |
JP4058300B2 (ja) * | 2002-06-21 | 2008-03-05 | 株式会社日立製作所 | 携帯情報装置 |
US6805287B2 (en) | 2002-09-12 | 2004-10-19 | American Express Travel Related Services Company, Inc. | System and method for converting a stored value card to a credit card |
US7804982B2 (en) | 2002-11-26 | 2010-09-28 | L-1 Secure Credentialing, Inc. | Systems and methods for managing and detecting fraud in image databases used with identification documents |
US7712673B2 (en) | 2002-12-18 | 2010-05-11 | L-L Secure Credentialing, Inc. | Identification document with three dimensional image of bearer |
WO2004095348A2 (en) | 2003-04-16 | 2004-11-04 | Digimarc Corporation | Three dimensional data storage |
JP2005093867A (ja) * | 2003-09-19 | 2005-04-07 | Seiko Epson Corp | 半導体装置及びその製造方法 |
DE202004003554U1 (de) * | 2004-03-04 | 2004-06-03 | Novacard Informationssysteme Gmbh | Chipkarte |
EP1738303B1 (fr) * | 2004-03-25 | 2008-09-17 | Bauer, Eric | Procede de fabrication d'une etiquette electronique |
US7318550B2 (en) | 2004-07-01 | 2008-01-15 | American Express Travel Related Services Company, Inc. | Biometric safeguard method for use with a smartcard |
FR2876507B1 (fr) * | 2004-10-12 | 2006-12-01 | K Sa As | Etiquette sans contact a antenne en y omnidirectionnelle |
CA2585168C (en) * | 2004-11-02 | 2014-09-09 | Imasys Ag | Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit |
US20060180674A1 (en) * | 2005-02-14 | 2006-08-17 | Aladdin Knowledge Systems Ltd. | Security card apparatus |
JP2006271596A (ja) * | 2005-03-29 | 2006-10-12 | Aruze Corp | ゲーム用カード |
EP1720120A1 (en) * | 2005-05-04 | 2006-11-08 | Axalto S.A. | A method for manufacturing a smart card, a thus manufactured smart card, and a method for manufacturing a wired antenna |
US8286332B2 (en) | 2006-09-26 | 2012-10-16 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
US7971339B2 (en) | 2006-09-26 | 2011-07-05 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US7581308B2 (en) | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
US8608080B2 (en) * | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
US8322624B2 (en) * | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
US7979975B2 (en) * | 2007-04-10 | 2011-07-19 | Feinics Amatech Teavanta | Methods of connecting an antenna to a transponder chip |
US8240022B2 (en) * | 2006-09-26 | 2012-08-14 | Feinics Amatech Teorowita | Methods of connecting an antenna to a transponder chip |
US7546671B2 (en) | 2006-09-26 | 2009-06-16 | Micromechanic And Automation Technology Ltd. | Method of forming an inlay substrate having an antenna wire |
JP2008246104A (ja) * | 2007-03-30 | 2008-10-16 | Angel Shoji Kk | Rfidを内蔵したゲームカードおよびその製造方法 |
HK1109708A2 (en) * | 2007-04-24 | 2008-06-13 | On Track Innovations Ltd | Interface card and apparatus and process for the formation thereof |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
IL184260A0 (en) * | 2007-06-27 | 2008-03-20 | On Track Innovations Ltd | Mobile telecommunications device having sim/antenna coil interface |
ATE488816T1 (de) | 2007-09-18 | 2010-12-15 | Hid Global Ireland Teoranta | Verfahren zur kontaktierung eines drahtleiters gelegt auf ein substrat |
US20090123743A1 (en) * | 2007-11-14 | 2009-05-14 | Guy Shafran | Method of manufacture of wire imbedded inlay |
US8028923B2 (en) * | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
CN101933034B (zh) * | 2008-01-23 | 2015-04-01 | 斯迈达Ip有限公司 | 用于制造智能卡嵌体的方法和*** |
US20100090008A1 (en) * | 2008-10-13 | 2010-04-15 | Oded Bashan | Authentication seal |
US8613132B2 (en) | 2009-11-09 | 2013-12-24 | Feinics Amatech Teoranta | Transferring an antenna to an RFID inlay substrate |
EP2567349B1 (en) | 2010-05-04 | 2014-11-12 | Féinics AmaTech Teoranta | Manufacturing rfid inlays |
US8195236B2 (en) | 2010-06-16 | 2012-06-05 | On Track Innovations Ltd. | Retrofit contactless smart SIM functionality in mobile communicators |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
CN101976368A (zh) * | 2010-09-21 | 2011-02-16 | 深圳市卡的智能科技有限公司 | Ic卡的制作方法 |
US8424757B2 (en) | 2010-12-06 | 2013-04-23 | On Track Innovations Ltd. | Contactless smart SIM functionality retrofit for mobile communication device |
DE102011016159B3 (de) * | 2011-04-05 | 2012-10-18 | Micronas Gmbh | Anordnung aus einem integrierten passiven Bauelement und einem auf einem Metallträger angeordneten Halbleiterkörper |
EP2718876A1 (en) | 2011-06-04 | 2014-04-16 | Féinics AmaTech Teoranta | Preparing a substrate for embedding wire |
DE102011114635A1 (de) * | 2011-10-04 | 2013-04-04 | Smartrac Ip B.V. | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
CN103577869A (zh) * | 2012-08-01 | 2014-02-12 | 东莞市锐祥智能卡科技有限公司 | 卡片绕线方法 |
WO2015038652A1 (en) * | 2013-09-10 | 2015-03-19 | The Charles Stark Draper Laboratory, Inc. | Method for forming electronic component and electronic component |
KR101516005B1 (ko) * | 2014-09-19 | 2015-05-07 | 주식회사 모비너스 | 와이어를 이용한 nfc안테나 |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
CN109214494B (zh) * | 2018-10-25 | 2021-07-09 | 上海东方磁卡信息股份有限公司 | 非接触智能卡及其制造方法 |
CN109786305B (zh) * | 2019-01-28 | 2021-02-26 | 上海东方磁卡信息股份有限公司 | 非接触卡制造设备及非接触卡制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3143915A1 (de) * | 1981-11-05 | 1983-05-11 | Brown, Boveri & Cie Ag, 6800 Mannheim | Identitaetskarte |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
US4857893A (en) * | 1986-07-18 | 1989-08-15 | Bi Inc. | Single chip transponder device |
DE3721822C1 (en) * | 1987-07-02 | 1988-11-10 | Philips Patentverwaltung | Chip card |
DE4019915A1 (de) * | 1990-06-22 | 1992-01-02 | Bosch Gmbh Robert | Verfahren und einrichtung zur herstellung einer verbindung zwischen einem bonddraht und einer metallischen kontaktflaeche |
DE4034225C2 (de) * | 1990-10-26 | 1994-01-27 | Reinhard Jurisch | Datenträger für Identifikationssysteme |
WO1993009551A1 (de) * | 1991-11-08 | 1993-05-13 | Herbert Stowasser | Transponder sowie verfahren und vorrichtung zur herstellung |
FI89752C (fi) * | 1992-04-01 | 1993-11-10 | Picopak Oy | Foerfarande foer anslutning av en mikrokrets till en induktiv spole i ett smartkort samt anordning vid ett induktivt smartkort |
-
1994
- 1994-09-05 DE DE4431605A patent/DE4431605C2/de not_active Expired - Fee Related
-
1995
- 1995-05-09 UA UA97030971A patent/UA54374C2/uk unknown
- 1995-09-05 JP JP8509119A patent/JPH10505023A/ja active Pending
- 1995-09-05 DE DE59504285T patent/DE59504285D1/de not_active Expired - Lifetime
- 1995-09-05 RU RU97105182/09A patent/RU2155379C2/ru active
- 1995-09-05 ES ES95929753T patent/ES2125650T3/es not_active Expired - Lifetime
- 1995-09-05 WO PCT/DE1995/001201 patent/WO1996007984A1/de active IP Right Grant
- 1995-09-05 KR KR1019970701445A patent/KR100358785B1/ko not_active IP Right Cessation
- 1995-09-05 EP EP95929753A patent/EP0780006B1/de not_active Expired - Lifetime
- 1995-09-05 CN CN95195671A patent/CN1105988C/zh not_active Expired - Lifetime
- 1995-09-05 AT AT95929753T patent/ATE173553T1/de active
-
1997
- 1997-03-04 FI FI970924A patent/FI970924A0/fi unknown
- 1997-03-05 US US08/812,111 patent/US5809633A/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009259258A (ja) * | 1997-09-26 | 2009-11-05 | Gemplus Sca | 使い捨てチップ電子装置及び製造方法 |
JP4618462B2 (ja) * | 1997-09-26 | 2011-01-26 | ジェマルト エスアー | 使い捨てチップ電子装置及び製造方法 |
JP2014096006A (ja) * | 2012-11-08 | 2014-05-22 | Toppan Tdk Label Co Ltd | 非接触通信媒体の製造方法、非接触通信媒体、及びアンテナと回路装置の接続方法 |
Also Published As
Publication number | Publication date |
---|---|
RU2155379C2 (ru) | 2000-08-27 |
ES2125650T3 (es) | 1999-03-01 |
KR970705803A (ko) | 1997-10-09 |
US5809633A (en) | 1998-09-22 |
EP0780006A1 (de) | 1997-06-25 |
DE59504285D1 (de) | 1998-12-24 |
DE4431605C2 (de) | 1998-06-04 |
EP0780006B1 (de) | 1998-11-18 |
FI970924A (fi) | 1997-03-04 |
CN1160447A (zh) | 1997-09-24 |
KR100358785B1 (ko) | 2003-04-21 |
WO1996007984A1 (de) | 1996-03-14 |
FI970924A0 (fi) | 1997-03-04 |
DE4431605A1 (de) | 1996-03-07 |
UA54374C2 (uk) | 2003-03-17 |
ATE173553T1 (de) | 1998-12-15 |
CN1105988C (zh) | 2003-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH10505023A (ja) | 無接触チップカード用のチップカードモジュールの製造方法 | |
EP2235667B1 (en) | Manufacture of a smart card | |
US6088230A (en) | Procedure for producing a chip mounting board and chip-mounting board thus produced | |
JP3721520B2 (ja) | ワイヤ導体を接触させるための方法 | |
JP3634737B2 (ja) | 半導体デバイスアセンブリ | |
US7971339B2 (en) | Method and apparatus for making a radio frequency inlay | |
RU97105182A (ru) | Способ изготовления модуля микросхемной карты для бесконтактных микросхемных карт | |
US8348171B2 (en) | Smartcard interconnect | |
JPH11328352A (ja) | アンテナとicチップとの接続構造、及びicカード | |
KR100763572B1 (ko) | 칩 모듈용 칩 캐리어 및 칩 모듈 제조방법 | |
JP5571689B2 (ja) | Ic非接触通信デバイスの製造方法 | |
EP1091398B1 (en) | IC-package bonding method with bonding wire inductor | |
US7312528B2 (en) | Semiconductor device having antenna connection electrodes | |
JPH1041424A (ja) | 半導体ダイを収納するスマートカード | |
JPS63246851A (ja) | 半導体装置の保持器および集積回路をプラスチック・パッケージの内部に収納する方法 | |
JP5167264B2 (ja) | 無線周波数インレイを作製する方法および装置 | |
JPS63245950A (ja) | 半導体チップをパッケージングするにあたって同一平面上を曲線状に延びるリードフレームのリードを階段状に曲げる方法 | |
CN107111779B (zh) | 包括互连区的单面电子模块的制造方法 | |
CN102395981A (zh) | Ic封装的引线框架和制造方法 | |
JP2005136901A (ja) | Icカード用アンテナモジュール及びその製造方法、並びに、icカード及びその製造方法 | |
KR101313122B1 (ko) | 트랜스폰더 칩 및 관련 인레이 기판에의 안테나 연결 방법 | |
CA2449413C (en) | Method and device for bonding a wire conductor | |
JPH02188298A (ja) | Icモジュールおよびicカード | |
JP2000293650A (ja) | 非接触式icカード用モジュール及び非接触式icカード | |
JP2005149189A (ja) | データキャリアおよびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20031112 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20040105 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20031218 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20040302 |