JPWO2021210348A1 - - Google Patents
Info
- Publication number
- JPWO2021210348A1 JPWO2021210348A1 JP2022515266A JP2022515266A JPWO2021210348A1 JP WO2021210348 A1 JPWO2021210348 A1 JP WO2021210348A1 JP 2022515266 A JP2022515266 A JP 2022515266A JP 2022515266 A JP2022515266 A JP 2022515266A JP WO2021210348 A1 JPWO2021210348 A1 JP WO2021210348A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4043—Edge-emitting structures with vertically stacked active layers
- H01S5/405—Two-dimensional arrays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/30—Semiconductor lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/06825—Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
- H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020073083 | 2020-04-15 | ||
PCT/JP2021/011498 WO2021210348A1 (ja) | 2020-04-15 | 2021-03-19 | 光源装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021210348A1 true JPWO2021210348A1 (ja) | 2021-10-21 |
Family
ID=78083693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022515266A Pending JPWO2021210348A1 (ja) | 2020-04-15 | 2021-03-19 |
Country Status (3)
Country | Link |
---|---|
US (1) | US12000567B2 (ja) |
JP (1) | JPWO2021210348A1 (ja) |
WO (1) | WO2021210348A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023144878A (ja) * | 2022-03-28 | 2023-10-11 | 日亜化学工業株式会社 | 光源装置および光源装置の製造方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR910004265B1 (ko) | 1987-03-26 | 1991-06-25 | 가부시기가이샤 히다찌세이사꾸쇼 | 반도체 레이저 장치와 그 제조 방법 및 그것을 사용한 광 헤드 |
JP2533871B2 (ja) | 1987-03-26 | 1996-09-11 | 株式会社日立製作所 | 半導体レ−ザ装置 |
JPH01241504A (ja) * | 1988-03-23 | 1989-09-26 | Hitachi Ltd | 複合光デバイスの組立方法 |
JP3304825B2 (ja) | 1997-06-13 | 2002-07-22 | シャープ株式会社 | 半導体レーザ装置およびその製造方法 |
JP3486900B2 (ja) * | 2000-02-15 | 2004-01-13 | ソニー株式会社 | 発光装置およびそれを用いた光装置 |
JP4127665B2 (ja) | 2003-07-18 | 2008-07-30 | 東日本旅客鉄道株式会社 | 鉄道車両用伝送システム |
JP2005327826A (ja) | 2004-05-13 | 2005-11-24 | Sony Corp | 集積型半導体レーザ装置、集積型半導体レーザ装置の製造方法、集積型半導体発光装置、集積型半導体発光装置の製造方法、光学ピックアップ装置および光ディスク装置 |
JP4844791B2 (ja) | 2004-05-14 | 2011-12-28 | ソニー株式会社 | 半導体発光装置およびそれを用いた光装置 |
JP2005353614A (ja) | 2004-05-28 | 2005-12-22 | Ricoh Co Ltd | 半導体レーザーアレイ、半導体レーザーアレイヘッド、印刷用版材製版装置、光走査装置、画像記録装置 |
JP5227666B2 (ja) | 2007-06-18 | 2013-07-03 | 三洋電機株式会社 | 半導体レーザ装置およびその製造方法 |
US8275013B2 (en) | 2007-06-18 | 2012-09-25 | Sanyo Electric Co., Ltd. | Semiconductor laser device and method of manufacturing the same |
JP5097473B2 (ja) | 2007-08-10 | 2012-12-12 | 三洋電機株式会社 | レーザモジュール、照明装置および投写型映像表示装置 |
US8774244B2 (en) * | 2009-04-21 | 2014-07-08 | Daylight Solutions, Inc. | Thermal pointer |
JP5522977B2 (ja) * | 2009-06-09 | 2014-06-18 | 三菱電機株式会社 | 多波長半導体レーザ装置 |
JP5633670B2 (ja) | 2010-03-01 | 2014-12-03 | ソニー株式会社 | 発光装置およびそれを用いた光装置 |
JP2012044015A (ja) * | 2010-08-20 | 2012-03-01 | Sanyo Electric Co Ltd | 半導体レーザ装置および光装置 |
JP5799727B2 (ja) * | 2011-10-06 | 2015-10-28 | 三菱電機株式会社 | 多波長半導体レーザ装置及び多波長半導体レーザ装置の製造方法 |
JP2015153842A (ja) | 2014-02-13 | 2015-08-24 | 三菱電機株式会社 | 半導体レーザ光源 |
US11363243B2 (en) * | 2014-03-21 | 2022-06-14 | Lightwave International, Inc. | Laser arrays |
US20200182434A1 (en) * | 2016-06-28 | 2020-06-11 | Sharp Kabushiki Kaisha | Light source module |
WO2019003546A1 (ja) | 2017-06-30 | 2019-01-03 | シャープ株式会社 | レーザ光源装置 |
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2021
- 2021-03-19 WO PCT/JP2021/011498 patent/WO2021210348A1/ja active Application Filing
- 2021-03-19 US US17/996,339 patent/US12000567B2/en active Active
- 2021-03-19 JP JP2022515266A patent/JPWO2021210348A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2021210348A1 (ja) | 2021-10-21 |
US20230204194A1 (en) | 2023-06-29 |
US12000567B2 (en) | 2024-06-04 |
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Legal Events
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240226 |