JPWO2021070381A1 - - Google Patents
Info
- Publication number
- JPWO2021070381A1 JPWO2021070381A1 JP2021551088A JP2021551088A JPWO2021070381A1 JP WO2021070381 A1 JPWO2021070381 A1 JP WO2021070381A1 JP 2021551088 A JP2021551088 A JP 2021551088A JP 2021551088 A JP2021551088 A JP 2021551088A JP WO2021070381 A1 JPWO2021070381 A1 JP WO2021070381A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/040302 WO2021070381A1 (en) | 2019-10-11 | 2019-10-11 | Component supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021070381A1 true JPWO2021070381A1 (en) | 2021-04-15 |
| JP7378098B2 JP7378098B2 (en) | 2023-11-13 |
Family
ID=75437844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021551088A Active JP7378098B2 (en) | 2019-10-11 | 2019-10-11 | parts supply device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7378098B2 (en) |
| CN (1) | CN114556535A (en) |
| DE (1) | DE112019007800T5 (en) |
| WO (1) | WO2021070381A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW460906B (en) * | 1999-03-05 | 2001-10-21 | Siemens Ag | Equipment to insert a substrate with flip-chips |
| JP3636127B2 (en) * | 2001-10-12 | 2005-04-06 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| DE10203601A1 (en) * | 2002-01-30 | 2003-08-14 | Siemens Ag | Chip removal device, chip removal system, placement system and method for removing chips from a wafer |
| JP3832460B2 (en) | 2003-09-17 | 2006-10-11 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP2008066472A (en) * | 2006-09-06 | 2008-03-21 | Canon Machinery Inc | Composite processor for workpiece |
| DE102016117815B4 (en) * | 2016-09-21 | 2018-04-12 | Asm Assembly Systems Gmbh & Co. Kg | Caching of FCOB chips in a chip transfer device |
| DE102017124582A1 (en) * | 2017-10-20 | 2019-04-25 | Asm Assembly Systems Gmbh & Co. Kg | Complementary tool for chip transfer device with removal tool and turning tool |
-
2019
- 2019-10-11 WO PCT/JP2019/040302 patent/WO2021070381A1/en active Application Filing
- 2019-10-11 JP JP2021551088A patent/JP7378098B2/en active Active
- 2019-10-11 CN CN201980100829.XA patent/CN114556535A/en active Pending
- 2019-10-11 DE DE112019007800.3T patent/DE112019007800T5/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7378098B2 (en) | 2023-11-13 |
| DE112019007800T5 (en) | 2022-08-11 |
| WO2021070381A1 (en) | 2021-04-15 |
| CN114556535A (en) | 2022-05-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
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| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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| A61 | First payment of annual fees (during grant procedure) |
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