JPWO2021070381A1 - - Google Patents

Info

Publication number
JPWO2021070381A1
JPWO2021070381A1 JP2021551088A JP2021551088A JPWO2021070381A1 JP WO2021070381 A1 JPWO2021070381 A1 JP WO2021070381A1 JP 2021551088 A JP2021551088 A JP 2021551088A JP 2021551088 A JP2021551088 A JP 2021551088A JP WO2021070381 A1 JPWO2021070381 A1 JP WO2021070381A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021551088A
Other versions
JP7378098B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021070381A1 publication Critical patent/JPWO2021070381A1/ja
Application granted granted Critical
Publication of JP7378098B2 publication Critical patent/JP7378098B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021551088A 2019-10-11 2019-10-11 部品供給装置 Active JP7378098B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/040302 WO2021070381A1 (ja) 2019-10-11 2019-10-11 部品供給装置

Publications (2)

Publication Number Publication Date
JPWO2021070381A1 true JPWO2021070381A1 (ja) 2021-04-15
JP7378098B2 JP7378098B2 (ja) 2023-11-13

Family

ID=75437844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021551088A Active JP7378098B2 (ja) 2019-10-11 2019-10-11 部品供給装置

Country Status (4)

Country Link
JP (1) JP7378098B2 (ja)
CN (1) CN114556535A (ja)
DE (1) DE112019007800T5 (ja)
WO (1) WO2021070381A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124238A (ja) * 2001-10-12 2003-04-25 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2005517289A (ja) * 2002-01-30 2005-06-09 シーメンス　アクチエンゲゼルシヤフト チップ取出し装置、チップ取出しシステム、装着システムおよびウェーハからチップを取り出すための方法
US7028392B1 (en) * 1999-03-05 2006-04-18 Siemens Dematic Ag Device for fitting a substrate with a flip chip
JP2008066472A (ja) * 2006-09-06 2008-03-21 Canon Machinery Inc ワーク複合処理装置
DE102016117815A1 (de) * 2016-09-21 2018-03-22 Asm Assembly Systems Gmbh & Co. Kg Zwischenspeichern von FCOB Chips in einer Chip-Transfervorrichtung
JP2019080061A (ja) * 2017-10-20 2019-05-23 エーエスエム・アセンブリー・システムズ・ゲーエムベーハー・ウント・コ・カーゲー 取出しツールと反転ツールとを有するチップ搬送装置のための補足ツール

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3832460B2 (ja) 2003-09-17 2006-10-11 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7028392B1 (en) * 1999-03-05 2006-04-18 Siemens Dematic Ag Device for fitting a substrate with a flip chip
JP2003124238A (ja) * 2001-10-12 2003-04-25 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2005517289A (ja) * 2002-01-30 2005-06-09 シーメンス　アクチエンゲゼルシヤフト チップ取出し装置、チップ取出しシステム、装着システムおよびウェーハからチップを取り出すための方法
JP2008066472A (ja) * 2006-09-06 2008-03-21 Canon Machinery Inc ワーク複合処理装置
DE102016117815A1 (de) * 2016-09-21 2018-03-22 Asm Assembly Systems Gmbh & Co. Kg Zwischenspeichern von FCOB Chips in einer Chip-Transfervorrichtung
JP2019080061A (ja) * 2017-10-20 2019-05-23 エーエスエム・アセンブリー・システムズ・ゲーエムベーハー・ウント・コ・カーゲー 取出しツールと反転ツールとを有するチップ搬送装置のための補足ツール

Also Published As

Publication number Publication date
DE112019007800T5 (de) 2022-08-11
CN114556535A (zh) 2022-05-27
WO2021070381A1 (ja) 2021-04-15
JP7378098B2 (ja) 2023-11-13

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