CN114556535A

CN114556535A - Component supply device

Info

Publication number: CN114556535A
Application number: CN201980100829.XA
Authority: CN
Inventors: 糀谷勉
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2019-10-11
Filing date: 2019-10-11
Publication date: 2022-05-27
Also published as: JP7378098B2; DE112019007800T5; JPWO2021070381A1; WO2021070381A1

Abstract

The invention provides a component supply device which can be more miniaturized. The component supply device is provided with: a pickup unit that picks up the first component by the component holding head facing downward in a state where the first surface of the first component faces upward, turns over the component holding head picked up by the first component to face upward, and transfers the first component to the mounting head in a state where the second surface of the first component faces upward; and a relay unit that receives the second component from the component holding head and transfers the second component to the mounting head while the component holding head that has picked up the second component is tilted upward while the component holding head is tilted downward and upward.

Description

Component supply device

Technical Field

The present invention relates to a component supply device.

Background

Conventionally, a component supply device is known which takes out a component from a supply unit and transfers the component to a mounting head (see, for example, patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2005-93667

Disclosure of Invention

Problems to be solved by the invention

However, there is still room for improvement in terms of further downsizing the component supply device.

Accordingly, an object of the present invention is to solve the above problems and to provide a component supply device that can be further miniaturized.

Means for solving the problems

In order to achieve the above object, a component supply device according to an aspect of the present invention is a component supply device for supplying a component having a first surface and a second surface opposite to the first surface to a mounting head for mounting the component on a substrate, the component supply device including: a pickup unit including a component holding head that holds a component, the first component being picked up by the component holding head facing downward in a state where a first surface of the first component faces upward, the component holding head picked up by the first component being turned upward, and the first component being delivered to the mounting head in a state where a second surface of the first component faces upward; and a relay unit that receives the second component from the component holding head and transfers the second component to the mounting head while the component holding head that has picked up the second component is tilted upward while the component holding head is tilted downward and upward.

Effects of the invention

According to the component supply device of the present invention, the component supply device can be further miniaturized.

Drawings

Fig. 1 is a plan view showing a schematic configuration of a component mounting apparatus according to an embodiment of the present invention.

Fig. 2 is a plan view showing a schematic configuration of the first component supply device according to the embodiment of the present invention.

Fig. 3 is a cross-sectional view taken along the X direction showing the schematic configuration of the first component supply device according to the embodiment of the present invention.

Fig. 4 is a plan view showing a schematic structure of the carrier holding portion according to the embodiment of the present invention.

Fig. 5 is a plan view showing a schematic structure of the carrier holding portion in a state where the carrier is not held according to the embodiment of the present invention.

Fig. 6 is a plan view showing a schematic structure of a holding portion main body according to the embodiment of the present invention.

Fig. 7 is a plan view showing a schematic structure of the carrier held by the carrier holding portion according to the embodiment of the present invention.

Fig. 8 is a sectional view taken along line a-a of fig. 5 showing a state before the carrier is held by the carrier holding portion in the embodiment of the present invention.

Fig. 9 is a sectional view taken along line a-a of fig. 5 showing a state where the carrier is held by the carrier holding portion according to the embodiment of the present invention.

Fig. 10 is a plan view showing a schematic structure of a movable base according to the embodiment of the present invention.

Fig. 11 is a sectional view taken along line B-B of fig. 5 showing a state where the carrier is held by the carrier holding portion according to the embodiment of the present invention.

Fig. 12 is a cross-sectional view taken along line C-C of fig. 5 showing a state where the carrier is held by the carrier holding portion according to the embodiment of the present invention.

Fig. 13 is a sectional view showing a schematic structure of a pickup unit according to the embodiment of the present invention.

Fig. 14 is a side view showing the schematic configuration of the pickup unit and the relay unit according to the embodiment of the present invention.

Fig. 15 is a side view showing a schematic configuration of the pickup unit and the relay unit according to the embodiment of the present invention.

Fig. 16 is a side view showing the schematic configuration of the pickup unit and the relay unit according to the embodiment of the present invention.

Fig. 17 is a top view of the pickup unit of the embodiment of the present invention.

Fig. 18 is a plan view of the pickup unit of fig. 17 with the cover removed.

Fig. 19 is a diagram showing a schematic configuration of a head holding drive mechanism according to an embodiment of the present invention.

Fig. 20 is a side view showing a schematic configuration of the pickup unit in a state where the component holding head facing downward is connected to the first moving piece according to the embodiment of the present invention.

Fig. 21 is a side view showing a schematic configuration of a retention head changer according to the embodiment of the present invention.

Fig. 22 is a plan view showing a schematic configuration of a retention head changer according to the embodiment of the present invention.

Fig. 23 is a plan view showing a schematic configuration of a retention head changer according to the embodiment of the present invention.

Fig. 24A is a schematic diagram showing a state before the component holding head is attached to the head holding portion according to the embodiment of the present invention.

Fig. 24B is a schematic diagram showing a state in which the component holding head is attached to the head holding portion according to the embodiment of the present invention.

Fig. 25A is a cross-sectional view of a holding head changer showing an operation of removing a component holding head from a head holding portion according to the embodiment of the present invention.

Fig. 25B is a cross-sectional view of the holding head changer showing the operation of removing the component holding head from the head holding portion according to the embodiment of the present invention.

Fig. 25C is a sectional view of the holding head changer showing the operation of removing the component holding head from the head holding portion according to the embodiment of the present invention.

Fig. 25D is a sectional view of the holding head changer showing the operation of removing the component holding head from the head holding portion according to the embodiment of the present invention.

Fig. 26A is a cross-sectional view of a holding head changer showing an operation of attaching the component holding head to the head holding portion according to the embodiment of the present invention.

Fig. 26B is a cross-sectional view of the holding head changer showing the operation of attaching the component holding head to the head holding portion according to the embodiment of the present invention.

Fig. 26C is a cross-sectional view of the holding head changer showing the operation of attaching the component holding head to the head holding portion according to the embodiment of the present invention.

Fig. 26D is a cross-sectional view of the holding head changer showing the operation of attaching the component holding head to the head holding portion according to the embodiment of the present invention.

Fig. 27 is a plan view showing a schematic structure of the ejector according to the embodiment of the present invention.

Fig. 28 is a plan view showing a schematic structure of the ejector according to the embodiment of the present invention.

Fig. 29 is a schematic block diagram of a control unit of the component mounting apparatus according to the embodiment of the present invention.

Fig. 30 is a cross-sectional view showing a correcting operation of the position of the ejector in a case where the carrier holding portion holds the carrier according to the embodiment of the present invention.

Fig. 31 is a sectional view showing a correcting action of the position of the ejector in a case where the carrier holding portion does not hold the carrier according to the embodiment of the present invention.

Fig. 32 is a schematic configuration diagram showing a relative positional relationship among the component holding head, the relay component holding head, and the component imaging unit according to the embodiment of the present invention.

Fig. 33 is a schematic configuration diagram showing a relative positional relationship among the component holding head, the relay component holding head, and the component imaging unit according to the embodiment of the present invention.

Fig. 34 is an image of the component holding head and the component held by the component holding head captured by the substrate recognition camera according to the embodiment of the present invention.

Fig. 35A is a schematic diagram showing a pickup operation and a transfer operation in the case of flip-chip mounting according to the embodiment of the present invention.

Fig. 35B is a schematic diagram showing a pickup operation and a transfer operation in the case of flip-chip mounting according to the embodiment of the present invention.

Fig. 35C is a schematic diagram showing a pickup operation and a transfer operation in the case of flip-chip mounting according to the embodiment of the present invention.

Fig. 35D is a schematic diagram showing a pickup operation and a transfer operation in the case of flip-chip mounting according to the embodiment of the present invention.

Fig. 35E is a schematic diagram showing a pickup operation and a transfer operation in the case of flip-chip mounting according to the embodiment of the present invention.

Fig. 35F is a schematic diagram showing a pickup operation and a transfer operation in the case of flip-chip mounting according to the embodiment of the present invention.

Fig. 36A is a schematic diagram showing a pickup operation and a transfer operation in the case of bare chip mounting according to the embodiment of the present invention.

Fig. 36B is a schematic diagram showing a pickup operation and a transfer operation in the case of bare chip mounting according to the embodiment of the present invention.

Fig. 36C is a schematic diagram showing a pickup operation and a transfer operation in the case of bare chip mounting according to the embodiment of the present invention.

Fig. 36D is a schematic diagram showing a pickup operation and a transfer operation in the case of bare chip mounting according to the embodiment of the present invention.

Fig. 36E is a schematic diagram showing a pickup operation and a transfer operation in the case of bare chip mounting according to the embodiment of the present invention.

Fig. 36F is a schematic diagram showing a pickup operation and a transfer operation in the case of bare chip mounting according to the embodiment of the present invention.

Fig. 36G is a schematic diagram showing a pickup operation and a transfer operation in the case of bare chip mounting according to the embodiment of the present invention.

Fig. 36H is a schematic diagram showing a pickup operation and a transfer operation in the case of bare chip mounting according to the embodiment of the present invention.

Detailed Description

A component supply device according to a first aspect of the present invention is a component supply device that supplies a component having a first surface and a second surface opposite to the first surface to a mounting head that mounts the component on a substrate, the component supply device including: a pickup unit including a component holding head that holds a component, the first component being picked up by the component holding head facing downward in a state where a first surface of the first component faces upward, the component holding head picked up by the first component being turned upward, and the first component being delivered to the mounting head in a state where a second surface of the first component faces upward; and a relay unit that receives the second component from the component holding head and transfers the second component to the mounting head while the component holding head that has picked up the second component is tilted upward while the component holding head is tilted downward and upward.

The relay unit receives the second component in a state where the component holding head is directed obliquely upward, and thus the path length of the relay unit from the reception of the second component to the transfer of the second component to the mounting head can be shortened as compared with a state where the component holding head is directed horizontally or obliquely downward. This makes it possible to reduce the size of the component supply device.

In the component supply device according to the second aspect of the present invention, the component supply device may include: a first rotating shaft that rotates the component holding head in the vertical direction so that the component holding head that picks up the first component in a downward state is turned upward and transfers the first component to the mounting head; and a second rotating shaft that rotates the relay unit in the vertical direction so that the relay unit that receives the second component in a state in which the component holding head faces obliquely downward is turned upward and delivers the second component to the mounting head.

By rotating the component holding head and the relay unit in the vertical direction about the rotation axis, the component can be received and delivered more easily.

In the component supplying device according to the third aspect of the present invention, the turning radius of the relay unit around the second turning axis may be smaller than the turning radius of the component holding head around the first turning axis.

Since the distance between the first turning shaft and the second turning shaft can be shortened, the component feeding device can be further downsized.

In the component supplying device according to the fourth aspect of the present invention, the center of the second turning shaft may be located above the center of the first turning shaft.

By disposing the center of the second rotating shaft above the center of the first rotating shaft, the difference between the height at which the pickup unit transfers the first component to the mounting head and the height at which the relay unit transfers the second component to the mounting head can be reduced. This makes it possible to more easily transfer the component to the mounting head by the pickup unit and the relay unit.

In the component supplying apparatus according to the fifth aspect of the present invention, a first transfer position where the pickup unit transfers the first component to the mounting head and a second transfer position where the relay unit transfers the second component to the mounting head may be located at the same height.

By arranging the first transfer position and the second transfer position at a height within the movable range of the mounting head in the vertical direction, the transfer of the component to the mounting head by the pickup unit and the relay unit can be performed more easily.

In the component supplying apparatus according to the sixth aspect of the present invention, the first and second transfer positions may be horizontally separated from each other.

By separating the first transfer position and the second transfer position from each other in the horizontal direction, transfer of components from the pickup unit and the relay unit to the mounting head can be performed more easily.

In the component supplying device according to the seventh aspect of the present invention, the pickup unit may include a holding head driving mechanism that moves the component holding head in a radial direction away from the center of the first rotation axis.

By moving the component holding head by the holding head driving mechanism, the component can be received and delivered by the pickup portion more easily.

In the component supplying device according to the eighth aspect of the present invention, the relay unit may include a relay component holding head that receives the second component from the component holding head and transfers the second component to the mounting head, and a distance between the relay component holding head and a center of the second rotating shaft may be constant.

The distance between the relay member holding head and the center of the second rotating shaft is configured to be constant, and a driving mechanism for moving the relay member holding head in a radial direction away from the center of the second rotating shaft is not required, so that the component supply device can be further miniaturized.

In the component supplying device according to the ninth aspect of the present invention, the pickup unit may include a plurality of component holding heads, and at least one set of the component holding heads among the plurality of component holding heads may be configured to face in opposite directions to each other.

When one component holding head of the set of component holding heads picks up the supplied component, the other component holding head that has picked up the first component can transfer the first component to the mounting head. This can improve the component transfer efficiency.

In the component supplying apparatus according to the tenth aspect of the present invention, the pickup unit may be constituted by the pickup unit and the relay unit, and the component supplying apparatus may further include a unit moving mechanism that adjusts a position of the pickup unit.

By adjusting the position of the pickup unit by the unit moving mechanism, the first component can be received more accurately by the component holding head. In addition, by providing the pickup unit and the relay unit as a single unit, the relative positions of the pickup unit and the relay unit can be made constant, and the second component can be handed over from the pickup unit to the relay unit more accurately.

In the component supplying apparatus according to the eleventh aspect of the present invention, the component supplying apparatus may further include a component imaging section that has a lens barrel extending in the vertical direction and that images a component picked up by the pickup section, wherein the lens barrel is disposed above the component holding head in a downward state.

By disposing the lens barrel of the component imaging section above the component holding head in a downward state, the component supply device can be further downsized in the horizontal direction.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, elements are shown exaggerated for convenience of explanation. The present invention is not limited to the embodiment.

(embodiment mode)

First, a schematic configuration of the component mounting device 1 according to the present embodiment will be described with reference to fig. 1. Fig. 1 is a plan view showing a schematic configuration of a component mounting device 1 according to an embodiment of the present invention.

As shown in fig. 1, the component mounting device 1 includes a component supply device 2 and a component mounting unit 7. The component supply device 2 is a device that supplies various components to the component mounting section 7. The component mounting portion 7 is a mechanism that receives the component supplied from the component supply device 2 and mounts the component on the substrate 9. Hereinafter, in the drawings, the X direction and the Y direction are directions orthogonal to each other in a horizontal plane, and the Z direction is a height direction (vertical direction) orthogonal to the X direction and the Y direction.

The component supply device 2 of the present embodiment includes a plurality of component supply devices according to the types of components. The component feeder 2 includes, for example, a first component feeder 3 and a second component feeder 5.

In the first component supplying device 3, for example, components (bare chips) cut out from the wafer W1 are supplied. The component supplied by the first component supply device 3 has a first surface and a second surface on the opposite side of the first surface. The member is formed in a rectangular parallelepiped or a cubic shape, for example. The second component feeding device 5 is, for example, a tray feeder, a bar feeder, a tape feeder, or the like. The second component supply device 5 may be a component supply device other than the feeder. The second component supply device 5 may not be provided in the component mounting device 1.

The component mounting unit 7 includes a mounting head 11 for mounting components on the board 9 and a head moving mechanism 13 for moving the mounting head 11. The mounting head 11 is provided so as to be movable in a horizontal plane (XY plane) by a head moving mechanism 13. The head moving mechanism 13 is, for example, an orthogonal coordinate table having an X-axis table 13A and a Y-axis table 13B. The X-axis table 13A and the Y-axis table 13B move the mounting head 11 in the X direction and the Y direction, respectively.

In the present embodiment, the component mounting device 1 is provided with a component recognition camera 15 that recognizes a component mounted on the board 9 and a board recognition camera 17 that recognizes the board 9. The component recognition camera 15 is provided, for example, between the substrate 9 and the component supply device 2. The component received by the mounting head 11 is mounted on the board 9 after being recognized by the component recognition camera 15. At this time, the mounting head 11 carries the components by recognizing the position of the substrate 9 by the substrate recognition camera 17. The board recognition camera 17 of the present embodiment is provided so as to be movable in a horizontal plane together with the mounting head 11. For example, the substrate recognition camera 17 is provided on the X-axis table 13A together with the mounting head 11.

Next, the structure of the first component supply device 3 will be described with reference to fig. 2 and 3. Fig. 2 is a plan view showing a schematic configuration of the first component supply device 3. Fig. 3 is a cross-sectional view taken along the X direction, showing the schematic configuration of the first component supply device 3. In fig. 2, a part of the top plate 19 is omitted for convenience of explanation.

As shown in fig. 2 or 3, the first component supply device 3 of the present embodiment includes a carrier holding portion 21, a pickup unit 23, and an ejector 25. The carrier holding portion 21 holds a carrier 27 that supports the component-cut wafer. The pickup unit 23 picks up the components held by the carriers 27 of the carrier holding portion 21. The pickup unit 23 of the present embodiment adsorbs and holds a component. The ejector 25 pushes the bare chip held by the carrier holding portion 21 from below toward the pickup unit 23. The ejector 25 of the present embodiment ejects the bare chip upward. Here, the carrier 27 is a sheet having stretchability in a stretching operation described later. For example, the carrier 27 is an adhesive sheet that holds the wafer W1 with adhesive force.

In the first component supplying apparatus 3 of the present embodiment, the wafers W1 with cut components are stored in the magazine (magazine)29 while being held in the carrier 27. The magazine 29 is provided, for example, outside (+ Y direction) of the carrier holding portion 21. The carriers 27 in the magazine 29 are conveyed toward the carrier holding portion 21 by the carrier conveying portion 31. The conveyed carriers 27 are held by the carrier holding portion 21.

< Carrier holder >

Fig. 4 is a plan view showing a schematic structure of the carrier holding portion 21. Fig. 5 is a plan view showing a schematic structure of the carrier holding portion 21 in a state where the carrier 27 is not held. As shown in fig. 4 and 5, the carrier holding portion 21 of the present embodiment is provided to be movable in a horizontal plane. The carrier holding portion 21 includes a holding portion moving mechanism (moving portion) 33 that moves the carrier holding portion 21 (a moving base 37 described later).

The holder moving mechanism 33 of the present embodiment moves the carrier holder 21 in one direction (Y direction). The holding portion moving mechanism 33 includes, for example, a motor 33a, a feed screw 33b, and a guide rail 33 c. The feed screw 33b linearly moves the carrier holding portion 21 in the Y direction by a rotational movement based on the motor 33 a. The feed screw 33b is provided so as to extend in the Y direction. The guide rail 33c supports the carrier holding portion 21 so as to be slidable in the Y direction. The guide rails 33c are provided to extend in the Y direction, for example, and support both ends of the carrier holding portion 21 in the X direction.

The carrier holding portion 21 includes a holding portion main body 35 that holds the carrier 27, and a moving base (holding table) 37 that supports the holding portion main body 35. The moving base 37 is a base member connected to the feed screw 33b and provided to be movable in the Y direction.

Fig. 6 is a plan view showing a schematic configuration of the holding portion main body 35. Fig. 7 is a plan view showing a schematic structure of the carrier 27 held by the carrier holding portion 21.

As shown in fig. 6, the holding portion main body 35 is provided with an opening 45 penetrating in the vertical direction. The holding portion main body 35 holds the carrier 27 so as to cover the opening 45. The holding portion main body 35 of the present embodiment includes a pressing member 39 and a support base 41. The opening 45 of the present embodiment is formed in accordance with the shape of the wafer W1 held by the carrier 27, and is formed larger than the wafer W1. The opening 45 is formed in a circular shape larger than the circular wafer W1, for example.

The pressing member 39 is a member that presses the annular member 43 (fig. 7) holding the carrier 27. The carrier 27 is held by the carrier holding portion 21 by pressing the annular member 43 with the pressing member 39.

The support base 41 is connected to the pressing member 39 below the pressing member 39. The support base 41 is provided with a carrier guide 41a that guides the movement of the carriers 27 conveyed by the carrier conveying portion 31 (fig. 2). The carrier guides 41a are formed at both ends of the support base 41 in the X direction so as to extend in the Y direction, for example, and regulate the movement of the carrier 27 in the X direction. Further, a support portion 41b extending upward and supporting the carrier 27 is formed on the support base 41. An opening 45 is formed inside the support portion 41 b. The support portion 41b of the present embodiment is formed in a ring shape.

As shown in fig. 7, the carrier 27 held by the holding portion main body 35 holds the cut-out wafer W1. The outer edge portion of the carrier 27 of the present embodiment is held by an annular member (ring) 43.

Fig. 8 is a sectional view taken along line a-a of fig. 5 showing a state before the carrier 27 is held by the carrier holding portion 21. Fig. 9 is a sectional view taken along line a-a of fig. 5 showing a state where the carrier 27 is held by the carrier holding portion 21.

The carriers 27 in the magazine 29 shown in fig. 2 are conveyed toward the carrier holding portion 21 by the carrier conveying portion 31, and are inserted into a space between the pressing member 39 and the support base 41 as shown in fig. 8. Thereby, the ring-shaped member 43 of the carrier 27 is supported by the support base 41 so as to cover the opening 45.

As shown in fig. 8 and 9, the support base 41 is connected to a driving unit 47 that moves the support base 41 in the vertical direction via a rod 49. The driving unit 47 is driven from the state shown in fig. 8, and the support base 41 moves downward together with the rod 49. As shown in fig. 9, the pressing member 39 moves downward from the upper end of the support portion 41b, and the carrier 27 is held by the carrier holding portion 21 in a state where the supported portion 41b is expanded (expanded) in the planar direction. By expanding the carrier 27, the distance between the components cut out of the wafer W1 is increased, and the components can be easily picked up.

Fig. 10 is a plan view showing a schematic structure of the movable base 37. Fig. 11 is a sectional view taken along line B-B of fig. 5 showing a state where the carrier 27 is held by the carrier holding portion 21. Fig. 12 is a cross-sectional view taken along line C-C of fig. 5 showing a state where the carrier 27 is held by the carrier holding portion 21.

As shown in fig. 10, in the moving base 37, an opening 51 penetrating in the vertical direction is provided below the opening 45 of the holding portion main body 35. The size of the opening 51 is, for example, equal to or larger than the opening 45 of the holding portion main body 35. Through the opening 51, the ejector 25 pushes out the components in the carrier 27 arranged above the moving base 37 from below toward the pickup unit 23 (fig. 3).

In the moving base 37 of the present embodiment, a penetrating portion 52 penetrating in the vertical direction is provided at a position outside the opening on the outer side in the horizontal direction than the opening 51. The position of the pickup unit 23 and the ejector 25 in the horizontal direction is corrected (calibrated) by the through portion 52. The through portion 52 is, for example, an opening provided in the moving base 37. The through portion 52 is not limited to the opening, and may be formed by cutting out an edge of the moving base 37. The penetrating portion 52 is provided at the inner end portion (-Y direction end portion) of the moving base 37.

The moving base 37 is provided so as to be able to swivel the holding portion main body 35 (fig. 6) in a horizontal plane. The moving base 37 is provided with a turning gear 53 for turning the holding portion main body 35. As shown in fig. 11, the motor 54 connected to the turning gear 53 rotates, and the turning gear 53 is engaged with the driven gear 55 provided in the holding portion main body 35 and rotates, whereby the holding portion main body 35 turns.

The moving base 37 is provided with a plurality of support rollers 57 (for example, at four corners) for rotatably supporting the holding portion main body 35 (fig. 6) in a horizontal plane. The support roller 57 is a roller that extends upward on the moving base 37 and rotates the holding portion main body 35. As shown in fig. 12, the support roller 57 supports a turning guide 59 formed to extend downward in the holding portion body 35 so as to be turnable. As shown in fig. 5 and 12, the support roller 57 is provided outside a turning guide 59 extending in the circumferential direction in the outer peripheral portion of the opening 45.

The penetrating portion 52 is formed such that at least a part of the penetrating portion 52 penetrates in the vertical direction even in a state where the holding portion main body 35 is rotated by the rotation gear 53. Specifically, the outer edge of the through portion 52 is formed at a position outside the rotation locus of the outer edge of the holding portion main body 35 in the horizontal direction. This enables the pickup unit 23 and the ejector 25 to be corrected even in a state where the holding portion body 35 is rotated.

The moving base 37 of the present embodiment is provided with a holding head changer 61. The holding head changer 61 is provided to exchange a component holding head 77, which will be described later, in the pickup unit 23. The detailed structure of the head changer 61 will be described later.

< pickup Unit >

Fig. 13 is a sectional view showing a schematic structure of the pickup unit 23. As shown in fig. 3 or 13, the pickup unit 23 is provided to be movable on the top plate 19 by a unit moving mechanism (pickup moving section) 63. The pickup unit 23 of the present embodiment is provided to be movable in one direction (X direction).

The unit moving mechanism 63 (fig. 1) includes, for example, a motor 63a, a feed screw 63b, and a guide rail 63 c. The feed screw 63b linearly moves the pickup unit 23 in the X direction by a rotational motion based on the motor 63 a. The feed screw 63b is provided so as to extend in the X direction. The guide rail 63c supports the pickup unit 23 to be slidably movable in the X direction. The guide rails 63c are provided on the top plate 19 so as to extend in the X direction, for example, and support both ends of the pickup unit 23 in the Y direction.

An opening 65 penetrating in the vertical direction is formed in the top plate 19 so as to extend in the X direction. As shown in fig. 13, the pickup unit 23 picks up the component (bare chip) held by the carrier 27 through the opening portion 65. An opening 69 that penetrates in the vertical direction is provided on the upper surface of the cover 67 that forms the outer shell of the pickup unit 23 in the present embodiment. The pickup unit 23 delivers the picked-up component to the mounting head 11 (fig. 3) through the opening 69. At this time, the mounting head 11 recognizes the component by, for example, the substrate recognition camera 17 (fig. 1) and receives the component from the pickup unit 23.

As shown in fig. 3, the pickup unit 23 includes a pickup portion 71, a relay portion 73, and a component imaging portion (component detection portion) 75 (fig. 13).

< pickup section >

As shown in fig. 13, the pickup portion 71 picks up the components held by the carrier 27. Specifically, the pickup portion 71 picks up the component ejected by the ejector 25. The pickup portion 71 has a component holding head 77 that holds a component, and the component is picked up by the component holding head 77. Specifically, the component holding head 77 sucks and holds the components in the carrier 27 at the front end portion (lower end portion) to separate the components from the carrier 27.

The component holding head 77 is configured such that the head orientation can be changed by the first movement mechanism 79. In the present embodiment, the head direction is the direction of the distal end portion of the component holding head 77. The component holding head 77 is configured to repeat the following operations: after the first component is picked up in the downward state, the component is reversed by the first moving mechanism 79 to be transferred to the mounting head 11 (fig. 3) in the upward state. Specifically, the downward component holding head 77 picks up the first component in a state where the first face of the first component is upward. Then, the component holding head 77 that has picked up the first component is turned upward, and the component is transferred to the mounting head 11 with the second surface of the first component facing upward. Here, the component held by the carrier 27 is in a state where the first surface faces upward.

The first component is picked up from the carrier 27 with the first surface facing upward by the component holding head 77, and is handed over to the mounting head 11 after the orientation is changed so that the second surface faces upward. Further, the first component is held with its first surface facing downward (with its second surface facing upward) by the mounting head 11, and is mounted on the substrate 9 with its first surface facing downward. That is, the first component is a component supplied in the case of flip-chip mounting.

The first moving mechanism 79 of the present embodiment is a turning mechanism that turns the component holding head 77. The first moving mechanism 79 includes a first rotating shaft 81 rotated by the motor 80 and a revolving member 83 revolving in accordance with the rotation of the first rotating shaft 81. The first rotating shaft 81 rotates the component holding head 77 in the up-down direction. The turning member 83 is, for example, a plate-like member extending in the vertical direction.

The component holding head 77 is provided at a position closer to an outer end (end on the radially outer side) than the center axis of the first rotating shaft 81, for example, in the swivel member 83. The pickup portion 71 of the present embodiment has a plurality of component holding heads 77. At least one set of the component holding heads 77 among the plurality of component holding heads 77 is configured such that the directions of the heads are directed in opposite directions to each other. For example, the pickup portion 71 includes two component holding heads 77, and one component holding head 77 and the other component holding head 77 face in opposite directions to each other. Specifically, the distal end portion of one member holding head 77 is oriented 180 ° opposite to the distal end portion of the other member holding head 77. While one component holding head 77 faces downward and picks up the first component, the other component holding head 77 faces upward and hands over the component to the mounting head 11.

The component holding head 77 of the present embodiment is provided to be detachable from the head holding portion 85. Thus, the component holding head 77 can be replaced according to the type of component to be mounted. The component holding head 77 is connected to the swiveling member 83 via the head holding portion 85, and swivels together with the swiveling member 83.

The component holding head 77 of the present embodiment includes a holding head driving mechanism 87 that moves the component holding head 77 in a radial direction away from the center of the first rotation axis 81. The specific structure of the holding head driving mechanism 87 will be described later.

< Relay section >

Fig. 14 to 16 are side views showing the schematic configuration of the pickup unit 71 and the relay unit 73. The relay unit 73 shown in fig. 14 to 16 receives the second component picked up by the pickup unit 71 (component holding head 77) in the first face-up state from the component holding head 77, and hands over the second component to the mounting head 11 in the first face-up state. The relay unit 73 has a relay member holding head 89 for holding a member, and receives the second member by the relay member holding head 89 and delivers the second member to the mounting head 11.

The second component is picked up from the carrier 27 by the component holding head 77 with the first surface facing upward, and handed over to the relay portion 73 with the orientation of the first surface changed (in the present embodiment, with the first surface facing obliquely downward). The second member is held on the second surface by the relay unit 73, and is handed over to the mounting head 11 after the orientation is changed so that the first surface faces upward. Further, the second component is held by the mounting head 11 with the first surface facing upward (with the second surface facing downward), and is mounted on the substrate 9 with the first surface facing upward. That is, the second component is a component supplied in the case of bare chip mount mounting.

The relay unit 73 is configured to be able to change the head direction by the second movement mechanism 91. Specifically, the relay unit 73 receives the second component while the component holding head 77 is inverted from the downward position to the upward position. The relay unit 73 of the present embodiment receives the second member with the member holding head 77 directed obliquely upward (fig. 16).

The second moving mechanism 91 of the present embodiment is a turning mechanism that turns the relay member holding head 89. The second moving mechanism 91 has a second rotating shaft 93 rotated by a motor 92 (fig. 18) and a turning member 95 that turns in accordance with the rotation of the second rotating shaft 93. The second rotation shaft 93 rotates the relay unit 73 in the vertical direction. The whirl member 95 is formed in a disk shape, for example.

In the present embodiment, the center O2 of the second rotating shaft 93 is disposed above the center O1 of the first rotating shaft 81. As shown in fig. 15, the turning radius R2 of the relay unit 73 about the second turning shaft 93 is smaller than the turning radius R1 of the member holding head 77 about the first turning shaft 81. The radius R2 of rotation of the relay section 73 is constant. That is, the distance between the relay member holding head 89 and the center O2 of the second rotating shaft 93 is constant. In the present embodiment, the relay unit 73 does not have a mechanism corresponding to the head holding drive mechanism 87 in the pickup unit 71. That is, the relay member holding head 89 does not move in the radial direction away from the center O2 of the second rotating shaft 93.

In the present embodiment, the first transfer position TP1 where the pickup 71 transfers the first component to the mount head 11 and the second transfer position TP2 where the relay 73 transfers the second component to the mount head 11 are located at a height within the movable range in the up-down direction of the mount head 11. The transfer positions TP1 and TP2 are arranged within the range of the focal length of the board recognition camera 17 (fig. 1). The heights of the handover positions TP1, TP2 may be, for example, the same height (approximately the same). The first handover position TP1 and the second handover position TP2 are horizontally separated from each other.

< part imaging Unit >

As shown in fig. 13, the component imaging section 75 images the components held by the carrier 27. The component imaging unit 75 of the present embodiment is configured to be movable together with the pickup unit 23 by the unit moving mechanism 63. A lens barrel 99 extending in the vertical direction is connected to the component imaging section 75 with respect to an imaging section main body 97 extending in the horizontal direction. The lens barrel 99 is disposed above the component holding head 77 in the downward state. The lens barrel 99 is provided with an illumination portion 101, a half mirror 103, and a lens (objective lens) 105. The light irradiated by the illumination portion 101 irradiates a lower member through the half mirror 103. The half mirror 103 is configured to transmit light from the upper illumination unit 101 and reflect light from the lower side toward the imaging unit main body 97.

< holding head drive mechanism >

Fig. 17 is a plan view of the pickup unit 23. Fig. 18 is a plan view of the pickup unit 23 in a state where the cover 67 is removed in fig. 17. Fig. 19 is a diagram showing a schematic configuration of the holding head driving mechanism 87.

As shown in fig. 18, the pickup unit 23 has a retaining head drive mechanism 87 inside the cover 67 (fig. 17). The holding head driving mechanism 87 of the present embodiment is a cam mechanism. As shown in fig. 18 and 19, the head holding drive mechanism 87 includes a cam drive motor 107, a first cam 109, and a second cam 111.

The cam drive motor 107 rotates the first cam 109 and the second cam 111. The first lever 113 rotates about the first support shaft 115 by the rotation of the first cam 109. The second lever 117 rotates about the second support shaft 119 by the rotation of the second cam 111. By the rotation of the first lever 113, the first moving member 121 moves in the radial direction. Thereby, the first moving piece 123 connected to the first moving member 121 moves in the radial direction together with the first moving member 121. By the rotation of the second lever 117, the second moving member 125 moves in the radial direction. Thereby, the second moving piece 127 connected to the second moving member 125 moves together with the second moving member 125 in the radial direction.

As shown in fig. 15, the first moving piece 123 of the present embodiment is disposed at a position connected to the component holding head 77 when the component holding head 77 is in a downward state. Thus, the component holding head 77 facing downward is provided so as to be movable in the vertical direction together with the first moving piece 123.

As shown in fig. 16, the second moving piece 127 of the present embodiment is disposed at a position connected to the component holding head 77 when the component holding head 77 is in an obliquely upward state. Thus, the component holding head 77 facing obliquely upward is provided so as to be movable together with the second moving piece 127 in an oblique direction oblique to the vertical direction.

Fig. 20 is a side view showing a schematic configuration of the pickup portion 71 in a state where the component holding head 77 facing downward is connected to the first moving piece 123. As shown in fig. 20, the head holding portion 85 is provided with a guide member 129 that guides the movement of the component holding head 77 in the radial direction. The guide member 129 is provided with a cam follower 131 which engages with the first moving piece 123 and the second moving piece 127 in the radial direction. The cam follower 131 moves along the cylinder cam 132 upon the revolution of the revolution member 83.

The guide member 129 of the present embodiment is provided to bias the component holding head 77 radially inward by an elastic member 133 such as a spring, for example. The rotation radius of the component holding head 77 is constantly R1 in cases other than when picking up a component and when transferring a component to the component holding head 89 for relay.

When the component holding head 77 is in the downward state, the cam follower 131 is connected to the first moving piece 123, and the component holding head 77 is moved in the vertical direction together with the first moving piece 123. When the component holding head 77 is in the obliquely upward state (fig. 16), the cam follower 131 is connected to the second moving piece 127, and the component holding head 77 is moved in the radial direction together with the second moving piece 127.

< holding head changer >

Fig. 21 is a side view showing a schematic configuration of the head changer 61. Fig. 22 and 23 are plan views showing a schematic configuration of the holding head changer 61. As shown in fig. 21 to 23, the holding head changer 61 includes a housing section 135 for housing the member holding head 77 and a stopper 137.

The storage section 135 stores, for example, a plurality of types of component holding heads 77. The housing section 135 of the present embodiment has a longitudinal direction (X direction), and houses the component holding head 77 along the longitudinal direction. The housing 135 has an opening 141 that opens upward. The component holding head 77 is housed through the opening 141.

The stopper 137 covers a part of the opening 141 of the housing 135. The stopper 137 has an opening 143 penetrating in the vertical direction. The opening 143 has a diameter-enlarged portion 143a larger than the component holding head 77 and a small-diameter portion 143b smaller than the component holding head 77 in a plan view. In the present embodiment, the diameter-enlarged portions 143a and the small diameter portions 143b are alternately arranged in the longitudinal direction.

The stopper 137 is moved by the stopper driving portion 139 so that the diameter-enlarged portion 143a or the small diameter portion 143b is positioned above the component holding head 77 stored in the storage portion 135. When the stopper 137 moves, the stopper 137 is engaged with the engaging portion 78a of the component holding head 77 in the vertical direction in a state where the small diameter portion 143b is positioned above the component holding head 77 stored in the storage portion 135.

The head changer 61 of the present embodiment includes an elevating portion 145 that moves the storage portion 135 in the vertical direction. When the component holding head 77 is replaced, the storage section 135 is moved closer to the head holding section 85 by the raising and lowering section 145 (fig. 24B).

Fig. 24A is a schematic diagram showing a state before the component holding head 77 is attached to the head holding portion 85. Fig. 24B is a schematic diagram showing a state in which the component holding head 77 is attached to the head holding portion 85.

As shown in fig. 24A, in a state before the component holding head 77 is mounted on the head holding portion 85, the housing portion 135 is disposed below the level of the carrier 27 holding the wafer W1. In the present embodiment, the upper end portion of the component holding head 77 housed in the housing portion 135 is disposed below the height of the carrier 27.

When the component holding head 77 is detached or attached, the storage section 135 is moved upward by the elevating section 145 as shown in fig. 24B. At this time, the head holding portion 85 is moved downward by the holding head driving mechanism 87. In the present embodiment, the amount of movement in the vertical direction of the head holding portion 85 is smaller than the amount of movement in the vertical direction of the housing portion 135. By moving the housing section 135 upward by the lifting section 145, the amount of movement of the head holding section 85 in the vertical direction can be reduced. This can simplify the driving structure of the head holding driving mechanism 87.

In the state of fig. 24B, the claw portion 85a of the head holding portion 85 is engaged with the recessed portion 78B of the component holding head 77 in the vertical direction. The claw portion 85a is biased inward by, for example, an elastic member 85 b. Thereby, the head holding portion 85 holds the member holding head 77. The claw portion 85a is formed in the head holding portion 85 so as to protrude toward the holding member holding head 77. The concave portion 78b is formed so as to be recessed inward at a position above the engaging portion 78a of the component holding head 77.

The operation when the component holding head 77 is detached from the head holding portion 85 will be described with reference to fig. 25A to 25D. Fig. 25A to 25D are sectional views of the holding head changer 61 showing the operation of detaching the component holding head 77 from the head holding portion 85.

As shown in fig. 25A, the component holding head 77 moves to be positioned above the opening 141 of the holding head changer 61.

In the present embodiment, the position adjustment of the opening 141 in the Y direction with respect to the relative position of the component holding head 77 is performed by the holding portion moving mechanism 33 (fig. 2) of the carrier holding portion 21 that holds the head changer 61. Further, the position adjustment of the opening 141 in the X direction with respect to the relative position of the component holding head 77 is performed by the unit moving mechanism 63 that moves the pickup unit 23.

From the state shown in fig. 25A, the component holding head 77 moves downward and the housing section 135 moves upward, thereby bringing about the state shown in fig. 25B. As shown in fig. 25B, the tip end portion of the member holding head 77 is inserted into the first opening portion 141a (fig. 25A) of the holding head changer 61. In addition, the engaging portion 78a of the component holding head 77 is disposed in the second opening 141b (fig. 25A) of the holding head changer 61.

The stopper driving unit 139 is driven so that the stopper 137 is brought from the state of fig. 23 to the state of fig. 22. That is, the stopper 137 is moved from a state in which the diameter-enlarged portion 143a is located outside the outer edge of the engaging portion 78a to a state in which the small diameter portion 143b is located inside the outer edge of the engaging portion 78 a. Thus, as shown in fig. 25C, the engagement portion 78a can be engaged with the small diameter portion 143b in the vertical direction.

From the state of fig. 25C, the head holding portion 85 is moved upward and the storage portion 135 is moved downward. At this time, the engagement portion 78a is engaged with the small diameter portion 143b in the vertical direction, and the component holding head 77 is detached from the head holding portion 85 as shown in fig. 25D. This completes the operation of detaching the component holding head 77 from the head holding portion 85.

The operation of attaching the component holding head 77 to the head holding portion 85 will be described with reference to fig. 26A to 26D. Fig. 26A to 26D are cross-sectional views of the holding head changer 61 showing the operation of attaching the component holding head 77 to the head holding portion 85.

As shown in fig. 26A, the head holding portion 85 moves to be positioned above the component holding head 77.

From the state shown in fig. 26A, the head holding portion 85 moves downward and the housing portion 135 moves upward, and the state shown in fig. 26B is obtained. As shown in fig. 26B, the claw portion 85a is engaged with the concave portion 78B in the vertical direction, and the component holding head 77 is held by the head holding portion 85.

The stopper driving unit 139 is driven so that the stopper 137 is brought from the state of fig. 22 to the state of fig. 23. That is, the stopper 137 is moved so that the state in which the small diameter portion 143b is located inward of the outer edge of the engaging portion 78a is the state in which the enlarged diameter portion 143a is located outward of the outer edge of the engaging portion 78 a. Thus, as shown in fig. 26C, the engagement portion 78a is not engaged with the small diameter portion 143b in the vertical direction.

From the state of fig. 26C, the head holding portion 85 is moved upward and the storage portion 135 is moved downward. This completes the operation of attaching the component holding head 77 to the head holding portion 85.

< ejector >

Fig. 27 and 28 are plan views showing a schematic configuration of the ejector 25 of the present embodiment. As shown in fig. 27 and 28, in the present embodiment, the ejector 25 includes a first ejector (first ejector) 25a and a second ejector (second ejector) 25 b. The first ejector 25a and the second ejector 25b are selectively used according to, for example, the type of component carried on the carrier 27. The first ejector 25a and the second ejector 25b of the present embodiment are configured to be movable in the Y direction by the selector 155.

The ejector 25 is formed to extend in the vertical direction, and is configured to be movable up and down by the elevating portion 156. In the present embodiment, the first ejector 25a is moved up and down by the elevating portion 156a, and the second ejector 25b is moved up and down by the elevating portion 156 b.

The first ejector 25a and the second ejector 25b are provided together to the base member 157. In the present embodiment, the base member 157 is configured to be movable in the X direction by an ejector moving mechanism (moving section) 159. The ejector moving mechanism 159 moves the base member 157 in one direction (X direction). The ejector moving mechanism 159 includes, for example, a motor 159a, a feed screw 159b, and a guide rail 159 c. The feed screw 159b linearly moves the base member 157 in the X direction by a rotational motion based on the motor 159 a. The feed screw 159b is provided so as to extend in the X direction. The guide rail 159c supports the base member 157 to be slidable in the X direction. The guide rails 159c are provided to extend in the X direction, for example, and support both ends of the base member 157 in the Y direction.

Next, the operation of the component mounting apparatus 1 will be described. Fig. 29 is a schematic block diagram of the control unit C1 of the component mounting apparatus 1.

As shown in fig. 29, the control section C1 includes a pickup control section C2 that controls the pickup unit 23, a mounting head control section C3 that controls the mounting head 11, a calculation section C4, and a storage section M1 that stores information relating to component mounting. The calculation unit C4 calculates the positions of the pickup unit 23 and the mounting head 11. The storage unit M1 of the present embodiment also stores information captured by the component capture unit 75 and the board recognition camera 17.

The controller C1 may execute a program stored in a memory by a processor (processing circuit) to mount components in predetermined steps based on the mounting information of the memory M1. Note that, the installation information may be stored in a server or the like, and the installation information may be provided to the control unit C1 by communication.

The control unit C1 drives the substrate transfer unit 8 (fig. 1) to transfer the substrate 9 in the X direction (substrate transfer direction), thereby disposing the substrate 9 at a predetermined position (substrate transfer step).

The component is supplied by the component supply device 2, and the component is mounted (mounted) on the substrate 9 by the mounting head 11. Hereinafter, the component supplying operation by the first component supplying apparatus 3 will be specifically described. The component supplying operation by the second component supplying device 5 is the same as the conventional component supplying operation, and therefore, the description thereof is omitted here.

The control unit C1 drives the carrier transport unit 31 (fig. 2) of the first component supply device 3 to transport the carriers 27 stored in the magazine 29 to the carrier holding unit 21 (carrier transport step). When being conveyed to the carrier holding portion 21, the carrier 27 is inserted into a space between the pressing member 39 and the support base 41.

After being conveyed to the carrier holding portion 21, the carriers 27 are expanded by the pressing members 39 (fig. 8), and the carriers 27 are held by the carrier holding portion 21 (carrier holding step). Specifically, the controller C1 drives the driving unit 47 to move the pressing member 39 downward, thereby expanding the carrier 27. Thereby, the carrier 27 is held by the carrier holding portion 21.

The pickup control section C2 drives the pickup unit 23 to pick up the component carried on the carrier 27 from above the carrier 27 (pickup step). At this time, the control unit C1 drives the ejector 25 to eject the component carried on the carrier 27 from below the carrier 27 toward the pickup unit 23 (ejection step). The correction operation of the position of the pickup unit 23 and the position of the ejector 25 is performed in a stage before the pickup step and the ejection step. By this correction operation, the position in the horizontal direction of the pickup unit 23 and the position in the horizontal direction of the ejector 25 can be made to coincide, and the pickup operation can be performed more accurately.

The component picked up by the pickup unit 23 is handed over to the mounting head 11 (a handover step). The correction operation of the position of the mounting head 11 and the position of the pickup unit 23 is performed in a stage before the handover step. By this correcting operation, the position in the horizontal direction of the mounting head 11 and the position in the horizontal direction of the pickup unit 23 can be grasped more accurately, and therefore the component transfer operation can be performed more accurately. In the present embodiment, the ejector 25 is imaged by the component imaging section 75 of the pickup unit 23, and a position correction operation is performed.

The mounting head control unit C3 drives the mounting head 11 (head moving mechanism 13), moves the mounting head 11 that has received the component from the pickup unit 23 to the board 9, and mounts the component on the board 9 (component mounting step). In the component mounting step, for example, components are mounted using information from the board recognition camera 17 (for example, information such as the position of the mounted component).

Next, the correcting operation of the position of the pickup unit 23 and the position of the ejector 25 will be specifically described. Fig. 30 is a sectional view showing a correcting operation of the position of the ejector 25 in a case where the carrier holding portion 21 holds the carrier 27. Fig. 31 is a sectional view showing a correcting action of the position of the ejector 25 in a case where the carrier 27 is not held by the carrier holding portion 21.

The control unit C1 of the present embodiment selectively performs a first mode in which the operation of correcting the position of the ejector 25 is performed by the position outside the opening on the outer side in the horizontal direction than the

openings

45 and 51, and a second mode in which the operation of correcting the position of the ejector 25 is performed by the position inside the

opening

45 and 51.

In the first mode, as shown in fig. 30, when the carrier 27 is held by the carrier holding portion 21, the correction operation of the position of the pickup unit 23 and the position of the ejector 25 is performed by the through portion 52.

The control unit C1 drives the unit moving mechanism 63 (fig. 1) and the ejector 25 to move the pickup unit 23 and the ejector 25. As a result, the pickup unit 23 (the component imaging section 75) is positioned above the through section 52, and the ejector 25 is positioned below the through section 52. Further, the control unit C1 drives the ejector 25 (the elevating unit 156) to move the ejector 25 upward.

In the present embodiment, the ejector 25 is raised until the upper end portion of the ejector 25 is higher than the height of the carrier 27. In a state where the ejector 25 is lifted up, the component imaging section 75 images the ejector 25 (a first detection step). The first detection (photographing) step is performed after the carrier holding step. The position is corrected using the position of the ejector 25 in the horizontal direction that is photographed (first correction step). The component imaging unit 75 of the present embodiment also functions as a detection unit that detects the position of the ejector 25 in the horizontal direction.

In the second mode, as shown in fig. 31, in a case where the carrier 27 is not held by the carrier holding portion 21, the correcting action of the position of the pickup unit 23 and the position of the ejector 25 is performed through the opening 45 of the carrier holding portion 21.

The control unit C1 drives the unit moving mechanism 63 (fig. 1) and the ejector 25 to move the pickup unit 23 and the ejector 25. Thereby, the pickup unit 23 (the component imaging section 75) is positioned above the opening 45 and the ejector 25 is positioned below the opening 45. Further, the controller C1 drives the ejector 25 to move the ejector 25 upward.

In the present embodiment, the ejector 25 is raised until the upper end portion of the ejector 25 is higher than the height of the carrier 27 in the case where the carrier 27 is held. In the state where the ejector 25 is lifted up, the component imaging section 75 images the ejector 25 (second detection step). The second detection (photographing) step is performed before the carrier holding step. The position is corrected using the photographed position of the ejector 25 (second correction step).

Next, a correction operation of the position of the mounting head 11 and the position of the pickup unit 23 will be specifically described. Fig. 32 is a schematic configuration diagram of the carrier holding portion 21 when the position of the mounting head 11 and the position of the pickup unit 23 are corrected.

As shown in fig. 32, when the position of the mounting head 11 and the position of the pickup unit 23 are corrected, the correction jig 147 is attached to the carrier holding portion 21. The correction jig 147 is a jig for performing a correction operation of the position of the mounting head 11 and the position of the pickup unit 23. The correction jig 147 is supported by the support portion 41b, for example, in a state where the carrier 27 is not held by the carrier holding portion 21. The correction jig 147 is formed in a flat plate shape, for example.

The calibration jig 147 has a first reference mark 149 and a second reference mark 151. The first reference mark 149 is a mark detected by the component imaging unit (first imaging unit) 75. The second reference mark 151 is a mark detected by the substrate recognition camera (second imaging unit) 17. The second reference mark 151 of the present embodiment is formed on a column 153 extending in the vertical direction. By detecting the first reference mark 149 and the second reference mark 151, the coordinate system of the mounting head 11 and the coordinate system of the pickup unit 23 are corrected. Specifically, coordinate transformation of the coordinate system of the mounting head 11 and the coordinate system of the pickup unit 23 is performed using the relative positional relationship (distance D1 in the horizontal direction in the present embodiment) of the first reference mark 149 and the second reference mark 151.

Next, the pickup step and the handover step will be described in detail. Fig. 33 is a schematic configuration diagram showing a relative positional relationship among the component holding head 77, the relay component holding head 89, and the component imaging unit 75.

As shown in fig. 33, as a stage before the pickup step and the transfer step, the relative inter-head horizontal position relationship between the one downward component holding head 77 and the other upward component holding head 77 is obtained. The inter-head horizontal position relationship is stored in the storage section M1. In the present embodiment, the relative optical axis-head horizontal position relationship between the optical axis L1 of the component imaging unit 75 and the downward component holding head 77 is obtained. Specifically, offset amounts (offsets) OF1 and OF2 OF the head 77 from the optical axis L1 OF the component imaging unit 75 are measured. The OF1 is the horizontal distance between the component holding head 77 in the downward state and the optical axis L1, and the OF2 is the horizontal distance between the component holding head 77 in the upward state and the optical axis L1.

Then, the offset amount (offset) OF3 from the estimated position EP1 at which the center OF the upward facing relay component holding head 89 is estimated is measured from the position OF the upward facing relay component holding head 89 recognized by the board recognition camera 17. The OF3 is the horizontal distance between the estimated position EP1 and the position OF the upward relay member holding head 89. OF1, OF2, and OF3 are stored in the storage unit M1 (fig. 29).

Fig. 34 shows an image obtained by imaging the component holding head 77 and the component held by the component holding head 77 with the substrate recognition camera 17. As shown in fig. 34, in the present embodiment, OF1 is measured by the substrate recognition camera 17. The board recognition camera 17 takes an image of the component position P1 of the component held by the component holding head 77 in a state where the component holding head 77 facing downward picks up the component and is turned upside down. Then, the board recognition camera 17 takes an image of the head position P2 of the component holding head 77 in the state where no component is held. Thereby, the amount OF horizontal deviation OF the part position P1 from the head position P2 is measured, and is set to OF 1. For example, the component position P1 is the center position of the component photographed by the substrate recognition camera 17, and the head position P2 is the center position of the head photographed by the substrate recognition camera 17.

OF2 is measured by the substrate recognition camera 17. The board recognition camera 17 moves on the optical axis L1, and takes an image of the component holding head 77 in an upward state. The OF2 is, for example, the distance in the horizontal direction between the center position OF the member holding head 77 and the optical axis L1.

The board recognition camera 17 moves to the estimated position EP1, and takes an image OF the upward relay component holding head 89 to measure OF 3. Here, the estimated position EP1 is, for example, a position apart from the optical axis L1 by a predetermined distance D2. The predetermined distance D2 is a design value of the horizontal distance between the optical axis L1 and the upward relay member holding head 89, for example.

Among the plurality of component holding heads 77, one component holding head will be described as a first component holding head 77a and the other component holding head will be described as a second component holding head 77 b. Here, OF1 when the component holding head 77a is facing downward is OFa1, OF2 when the component holding head 77a is facing upward is OFa2, OF1 when the component holding head 77b is facing downward is OFb1, and OF2 when the component holding head 77b is facing upward is OFb 2.

Using the measured OF1, the calculating section C4 calculates a target position OP1 at which the component holding head 77 can pick up a component from the carrier 27 facing downward. The target position OPa1 of the component holding head 77a is calculated using the following equation (1), and the target position OPb1 of the component holding head 77b is calculated using the following equation (2).

[ mathematical formula 1 ]

OPa1 ═ position + OFa1 on optical axis L1 (1)

[ mathematical formula 2 ]

OPb1 ═ position + OFb1 on the optical axis L1 (2)

Using the measured OF1 and OF2, the calculating unit C4 calculates the stop position TP1 OF the upward component holding head 77 when the pickup unit 71 (the downward component holding head 77) is located at the target position OP 1. The stop position TPb1 of the component holding head 77b facing upward when the component holding head 77a faces downward is calculated using the following formula (3). The stop position TPa1 of the component holding head 77a facing upward when the component holding head 77b faces downward is calculated using the following formula (4).

[ mathematical formula 3 ]

TPb1＝OPa1-OFa1+OFb2 (3)

[ mathematical formula 4 ]

TPa1＝OPb1-OFb1+OFa2 (4)

Using the measured OF1 and OF3, the calculating unit C4 calculates the stop position TP2 OF the upward relay component holding head 89 when the pickup unit 71 is located at the target position OP 1. The upward stop position TPa2 of the relay component holding head 89 when the relay component holding head 89 receives the component picked up by the component holding head 77a is calculated using the following formula (5). The upward stop position TPb2 of the relay component holding head 89 when the relay component holding head 89 receives the component picked up by the component holding head 77b is calculated using the following formula (6).

[ math figure 5 ]

TPa2＝OPb1-OFb1+D2+OF3 (5)

[ mathematical formula 6 ]

TPb2＝OPa1-OFa1+D2+OF3 (6)

A pickup step and a transfer step in the case of flip chip mounting will be described. Fig. 35A to 35F are schematic diagrams showing a pickup operation and a transfer operation in the case of flip chip mounting.

First, as shown in fig. 35A, the component mounted on the carrier 27 is imaged by the component imaging unit 75. The component imaging section 75 images the component in a state where the component holding head 77 is not positioned below the component imaging section 75 (first component imaging step).

After the first component imaging step, as shown in fig. 35B, the turning member 83 (fig. 13) is turned so that the component holding head 77a faces downward. At this time, the drive unit moving mechanism 63 moves the pickup unit 23 so that the component holding head 77a facing downward is positioned at the target position OPa 1. Specifically, the pickup unit 23 is moved OFa1 from the position captured by the component capturing section 75.

Then, the holding head driving mechanism 87 is driven to move the component holding head 77a facing downward and pick up the component. After the component is picked up, the holding head driving mechanism 87 is driven to move the component holding head 77a facing downward upward.

As shown in fig. 35C, the swivel member 83 is swiveled to change the posture of the component holding head 77a which picks up the component and faces downward to the upward direction. While the component holding head 77a is being rotated, the next component picked up by the component holding head 77b is moved.

The component picked up next is photographed by the component photographing section 75. The component imaging section 75 images the component in a state where the component holding head 77 is not positioned below the component imaging section 75 (second component imaging step).

After the second component imaging step, as shown in fig. 35D, the turning member 83 (fig. 13) is turned so that the component holding head 77b faces downward. At this time, the drive unit moving mechanism 63 moves the pickup unit 23 so that the component holding head 77b facing downward is positioned at the target position OPb 1. Specifically, the pickup unit 23 is moved OFb1 from the position captured by the component capturing section 75.

The calculating unit C4 calculates the stop position TPa1 of the upward component holding head 77a using the above equation (4). The mounting head 11 is moved to the stop position TPa1 calculated by the calculating unit C4, and receives the component. At this time, the holding head driving mechanism 87 is driven to move the component holding head 77b facing downward and pick up the component. After the component is picked up, the holding head driving mechanism 87 is driven to move the component holding head 77b facing downward upward. In this way, an operation (first operation) of picking up a component by the component holding head 77b and transferring the component to the mounting head 11 by the component holding head 77a is performed.

Next, as shown in fig. 35E, the swivel member 83 is swiveled, and the posture of the component holding head 77b which has picked up the component and faces downward is changed to face upward. The component picked up by the component holding head 77a is moved while the component holding head 77b is rotated.

The component picked up next is photographed by the component photographing section 75. The component imaging section 75 images the component in a state where the component holding head 77 is not positioned below the component imaging section 75 (third component imaging step).

After the third component imaging step, as shown in fig. 35F, the turning member 83 (fig. 13) is turned so that the component holding head 77a faces downward. At this time, the drive unit moving mechanism 63 moves the pickup unit 23 so that the component holding head 77a facing downward is positioned at the target position OPa 1. Specifically, the pickup unit 23 is moved OFa1 from the position captured by the component capturing section 75.

The calculating unit C4 calculates the stop position TPb1 of the upward component holding head 77b using the above equation (3). The mounting head 11 is moved to the stop position TPb1 calculated by the calculating unit C4 and receives the component. At this time, the holding head driving mechanism 87 is driven to move the component holding head 77a facing downward and pick up the component. After the component is picked up, the holding head driving mechanism 87 is driven to move the component holding head 77a facing downward upward. In this way, an operation (second operation) of picking up a component by the component holding head 77a and delivering the component to the mounting head 11 by the component holding head 77b is performed.

As described above, in the case of flip-chip mounting, the first operation and the second operation are alternately repeated to supply components from the carrier 27 to the mounting head 11.

A pickup step and a transfer step in the case of bare chip mounting and mounting will be described. Fig. 36A to 36H are schematic diagrams showing a pick-up operation and a transfer operation in the case of bare chip mounting.

First, as shown in fig. 36A, the component mounted on the carrier 27 is imaged by the component imaging unit 75. The component imaging section 75 images the component in a state where the component holding head 77 is not positioned below the component imaging section 75 (fourth component imaging step).

After the fourth component imaging step, as shown in fig. 36B, the turning member 83 (fig. 13) is turned so that the component holding head 77a faces downward. At this time, the drive unit moving mechanism 63 moves the pickup unit 23 so that the component holding head 77a facing downward is positioned at the target position OPa 1. Specifically, the pickup unit 23 is moved OFa1 from the position captured by the component capturing section 75.

As shown in fig. 36C, the swivel member 83 is swiveled, and the posture of the component holding head 77a which has picked up the component and faces downward is changed to face upward. The component picked up by the component holding head 77b is moved while the component holding head 77a is rotated.

The component picked up next is photographed by the component photographing section 75. The component imaging section 75 images the component in a state where the component holding head 77 is not positioned below the component imaging section 75 (fifth component imaging step).

As shown in fig. 36D, the turning member 83 (fig. 13) is turned so that the component holding head 77a is directed obliquely upward. At this time, the relay member holding head 89 is oriented obliquely downward by the driving of the second moving mechanism 91 (fig. 14). Specifically, the component holding head 77a and the relay component holding head 89 are in a state of facing each other on the same straight line.

Further, the holding head driving mechanism 87 is driven to move the diagonally upward component holding head 77a diagonally upward (toward the relay component holding head 89) and to transfer the component to the relay component holding head 89. After the component transfer, the holding head driving mechanism 87 is driven to move the obliquely upward component holding head 77a obliquely downward.

Next, as shown in fig. 36E, the relay member holding head 89 is turned upward, and the member holding head 77b is turned downward. At this time, the drive unit moving mechanism 63 moves the pickup unit 23 so that the component holding head 77b facing downward is positioned at the target position OPb 1. Specifically, the pickup unit 23 is moved OFb1 from the position captured by the component capturing section 75.

The calculating unit C4 calculates the stop position TPa2 of the upward relay member holding head 89 by using the above equation (5). The mounting head 11 is moved to the stop position TPa2 calculated by the calculating unit C4, and receives the component. At this time, the holding head driving mechanism 87 is driven to move the component holding head 77b facing downward and pick up the component. After the component is picked up, the holding head driving mechanism 87 is driven to move the component holding head 77b facing downward upward. In this way, an operation (third operation) of picking up a component by the component holding head 77b and transferring the component to the mounting head 11 by the component holding head 89 for relay is performed.

Next, as shown in fig. 36F, the component holding head 77b is rotated, and the component imaging unit 75 images the component to be picked up next. The component imaging section 75 images the component in a state where the component holding head 77 is not positioned below the component imaging section 75 (sixth component imaging step).

Next, as shown in fig. 36G, the turning member 83 (fig. 13) is turned so that the component holding head 77b is directed obliquely upward. At this time, the relay member holding head 89 is oriented obliquely downward by the driving of the second moving mechanism 91 (fig. 14). Specifically, the component holding head 77b and the relay component holding head 89 are in a state of facing each other on the same straight line.

Further, the holding head driving mechanism 87 is driven to move the obliquely upward component holding head 77b obliquely upward (toward the relay component holding head 89) and to transfer the component to the relay component holding head 89. After the component transfer, the holding head driving mechanism 87 is driven to move the obliquely upward component holding head 77b obliquely downward.

Next, as shown in fig. 36H, the relay component holding head 89 is turned upward, and the component holding head 77a is turned downward. The drive unit moving mechanism 63 moves the pickup unit 23 so that the component holding head 77a facing downward is positioned at the target position OPa 1. Specifically, the pickup unit 23 is moved OFa1 from the position captured by the component capturing section 75.

The calculating unit C4 calculates the stop position TPb2 of the upward relay member holding head 89 using the above equation (6). The mounting head 11 is moved to the stop position TPb2 calculated by the calculating unit C4 and receives the component. At this time, the holding head driving mechanism 87 is driven to move the component holding head 77a facing downward and pick up the component. After the component is picked up, the holding head driving mechanism 87 is driven to move the component holding head 77a facing downward upward. In this way, an operation (fourth operation) of picking up a component by the component holding head 77a and transferring the component to the mounting head 11 by the component holding head 89 for relay is performed.

As described above, in the case of die mounting, the third operation and the fourth operation are alternately repeated to supply components from the carrier 27 to the mounting head 11.

The present invention is not limited to the above embodiments, and can be implemented in various other embodiments. In the above embodiment, the amount OF horizontal deviation between the head position P2 and the part position P1 was measured, and the amount OF deviation was set to OF 1. For example, the head position OF the component holding head 77 in a state where the downward one OF the component holding heads 77 is turned upward may be imaged, and the relative horizontal positional relationship between the optical axis L1 and the head position may be regarded as OF 1.

The OF1 is measured by the substrate recognition camera 17, but is not limited thereto. OF1 can also be measured by a camera disposed below the component holding head 77, for example.

In addition, although an example of correcting the position of the pickup portion 71 in the horizontal direction and the position of the ejector 25 in the horizontal direction captured by the component capture portion 75 has been described, the correction may not be performed. For example, the component imaging unit 75 may check only the state of the ejector 25 (the state of attachment of foreign matter) without performing the correction.

Further, the description has been given of the configuration in which the component holding head 77 is rotated by the first moving mechanism 79 and the relay component holding head 89 is rotated by the second moving mechanism 91, but the present invention is not limited to this. That is, the member holding head 77 and the relay member holding head 89 may not be configured to rotate (revolve) around the first rotation shaft 81 and the second rotation shaft 93. The component holding head 77 and the relay component holding head 89 may be configured such that the head orientation can be changed by a robot arm or the like, for example.

It is to be noted that any of the above various embodiments can be appropriately combined to provide the respective effects.

The present invention has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, but various modifications and alterations will be apparent to those skilled in the art. Such variations and modifications are to be understood as being included within the scope of the present invention based on the appended claims. Further, combinations of elements and changes in the order of the elements of the embodiments may be implemented without departing from the scope and spirit of the present disclosure.

Industrial applicability

The component supply device of the present invention is useful, for example, when picking up a component mounted on a carrier and supplying the component to a mounting head for mounting the component on a substrate.

Description of the reference numerals

1: component mounting device, 2: component supply device, 3: first component supply device, 5: second component supply device, 7: component mounting section, 8: substrate conveying section, 9: substrate, 11: mounting head, 13: head moving mechanism, 13A: x-axis table, 13B: y-axis table, 15: component recognition camera, 17: substrate recognition camera, 19: top plate, 21: carrier holding portion, 23: pickup unit, 25: ejector, 25 a: first ejector, 25 b: second ejector, 27: a carrier, 29: bin, 31: carrier transport portion, 33: holding portion moving mechanism, 33 a: motor, 33 b: feed screw, 33 c: guide rail, 35: holding portion main body, 37: moving base, 39: pressing member, 41: support base, 41 a: carrier guide, 41 b: support portion, 43: annular member, 45: opening, 47: drive unit, 49: rod, 51: opening, 52: through portion, 53: circling gear, 54: motor, 55: driven gear, 57: supporting roller, 59: turning guide, 61: head holding changer, 63: unit moving mechanism, 63 a: motor, 63 b: feed screw, 63 c: guide rail, 65: opening, 67: cover, 69: opening, 71: pickup, 73: relay unit, 75: part imaging unit, 77a, 77 b: component holding head, 78 a: engaging portion, 78 b: recess, 79: first moving mechanism, 80: motor, 81: first rotation shaft, 83: swivel member, 85: head holding portion, 85 a: claw portion, 85 b: elastic member, 87: holding head drive mechanism, 89: relay member holding head, 91: second moving mechanism, 92: motor, 93: second rotation shaft, 95: swivel member, 97: imaging unit main body, 99: lens barrel, 101: illumination unit, 103: half mirror, 105: lens, 107: cam drive motor, 109: first cam, 111: second cam, 113: first lever, 115: first support shaft, 117: second lever, 119: second support shaft, 121: first moving member, 123: first moving piece, 125: second moving member, 127: second moving plate, 129: guide member, 131: cam followers, 132: cylinder cam, 133: elastic member, 135: storage section, 137: stopper, 139: stopper drive portion, 141: opening, 141 a: first opening, 141 b: second opening, 143: opening, 143 a: diameter-enlarged portion, 143 b: small diameter portion, 145: lifting unit, 147: correction jig, 149: first fiducial mark, 151: second fiducial mark, 153: column, 155: selection unit, 156a, 156 b: elevating section, 157: base member, 159: ejector moving mechanism, 159 a: motor, 159 b: feed screw, 159 c: guide rail, C1: control unit, C2: pickup control unit, C3: mounting head control unit, M1: storage unit, W1: a wafer.

Claims

1. A component supply device for supplying a component having a first surface and a second surface opposite to the first surface to a mounting head for mounting the component on a substrate,

the component supply device includes:

a pickup unit including a component holding head that holds a component, the first component being picked up by the component holding head facing downward in a state where a first surface of the first component faces upward, the component holding head that has picked up the first component being turned upward, and the first component being delivered to the mounting head in a state where a second surface of the first component faces upward; and

and a relay unit that receives a second component from the component holding head and transfers the second component to the mounting head while the component holding head that has picked up the second component is tilted upward while the component holding head is tilted downward and upward.

2. The component supplying apparatus according to claim 1,

the component supply device includes:

a first rotating shaft that rotates the component holding head in an up-down direction so that the component holding head that picks up the first component in a downward state is turned upward and delivers the first component to the mounting head; and

and a second rotating shaft that rotates the relay unit in the vertical direction so that the relay unit that receives the second component from the component holding head in a state of being oriented obliquely downward is turned upward and delivers the second component to the mounting head.

3. The component supplying apparatus according to claim 2,

a turning radius of the relay portion around the second turning axis is smaller than a turning radius of the component holding head around the first turning axis.

4. The component supplying apparatus according to claim 3,

the center of the second rotating shaft is located above the center of the first rotating shaft.

5. The component supplying apparatus according to claim 4,

a first transfer position where the pickup unit transfers the first component to the mounting head and a second transfer position where the relay unit transfers the second component to the mounting head are located at the same height.

6. The component supplying apparatus according to claim 5,

the first and second handover positions are horizontally separated from each other.

7. The component supplying apparatus according to any one of claims 2 to 6,

the pickup unit includes a holding head driving mechanism for moving the component holding head in a radial direction away from the center of the first rotation axis.

8. The component supplying apparatus according to any one of claims 2 to 7,

the relay unit includes a relay component holding head configured to receive the second component from the component holding head and to transfer the second component to the mounting head,

the distance between the relay member holding head and the center of the second turning shaft is constant.

9. The component supplying apparatus according to any one of claims 1 to 8,

the pickup portion has a plurality of the component holding heads,

at least one set of the component holding heads among the plurality of component holding heads is configured to face in opposite directions to each other.

10. The component supplying apparatus according to any one of claims 1 to 9,

the pickup portion and the relay portion constitute a pickup unit,

the component supplying apparatus further includes a unit moving mechanism that adjusts a position of the pickup unit.

11. The component supplying apparatus according to any one of claims 1 to 10,

the component supplying apparatus further includes a component imaging section having a barrel extending in a vertical direction and imaging the component picked up by the pickup section,

the lens barrel is disposed above the component holding head in a downward state.