JPWO2020213567A1 - - Google Patents

Info

Publication number
JPWO2020213567A1
JPWO2020213567A1 JP2021514937A JP2021514937A JPWO2020213567A1 JP WO2020213567 A1 JPWO2020213567 A1 JP WO2020213567A1 JP 2021514937 A JP2021514937 A JP 2021514937A JP 2021514937 A JP2021514937 A JP 2021514937A JP WO2020213567 A1 JPWO2020213567 A1 JP WO2020213567A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021514937A
Other versions
JPWO2020213567A5 (ja
JP7228932B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020213567A1 publication Critical patent/JPWO2020213567A1/ja
Publication of JPWO2020213567A5 publication Critical patent/JPWO2020213567A5/ja
Application granted granted Critical
Publication of JP7228932B2 publication Critical patent/JP7228932B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/088—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices with position, velocity or acceleration sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/04—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof
    • B25J15/0408—Connections means
    • B25J15/0441—Connections means having vacuum or magnetic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/04—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof
    • B25J15/0466—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof with means for checking exchange completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/12—Programme-controlled manipulators characterised by positioning means for manipulator elements electric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021514937A 2019-04-15 2020-04-13 実装装置 Active JP7228932B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019076886 2019-04-15
JP2019076886 2019-04-15
PCT/JP2020/016294 WO2020213567A1 (ja) 2019-04-15 2020-04-13 実装装置

Publications (3)

Publication Number Publication Date
JPWO2020213567A1 true JPWO2020213567A1 (ja) 2020-10-22
JPWO2020213567A5 JPWO2020213567A5 (ja) 2022-02-01
JP7228932B2 JP7228932B2 (ja) 2023-02-27

Family

ID=72837902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021514937A Active JP7228932B2 (ja) 2019-04-15 2020-04-13 実装装置

Country Status (7)

Country Link
US (1) US20220216078A1 (ja)
JP (1) JP7228932B2 (ja)
KR (1) KR102651709B1 (ja)
CN (1) CN113711340A (ja)
SG (1) SG11202111369UA (ja)
TW (1) TWI744850B (ja)
WO (1) WO2020213567A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022157830A1 (ja) * 2021-01-19 2022-07-28 株式会社新川 半導体装置の製造装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283990A (ja) * 1996-04-10 1997-10-31 Toshiba Corp マウントヘッド及びボンディング装置
JPH11297764A (ja) * 1998-04-14 1999-10-29 Ricoh Co Ltd ボンディングツール及びそれを用いた半導体チップのボンディング方法
JP2007200914A (ja) * 2005-12-26 2007-08-09 Murata Mfg Co Ltd 部品実装ヘッドおよび部品実装装置
JP2013179208A (ja) * 2012-02-29 2013-09-09 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
JP2017041532A (ja) * 2015-08-20 2017-02-23 アピックヤマダ株式会社 チップ剥離装置、およびチップ剥離方法
WO2017119217A1 (ja) * 2016-01-06 2017-07-13 株式会社新川 電子部品実装装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
WO2001030543A1 (fr) * 1999-10-29 2001-05-03 Matsushita Electric Industrial Co., Ltd. Buse d'aspiration et methode et appareil permettant d'installer des pieces au moyen de celle-ci
JP3700135B2 (ja) * 2003-04-11 2005-09-28 日本航空電子工業株式会社 ボンディング装置
JP4381866B2 (ja) * 2003-09-16 2009-12-09 Ｊｕｋｉ株式会社 電子部品搭載ヘッド
WO2007083360A1 (ja) * 2006-01-17 2007-07-26 Ueno Seiki Co., Ltd. 半導体製造装置及び製造方法
US8339445B2 (en) * 2007-06-28 2012-12-25 Yamaha Hatsudoki Kabushiki Kaisha Component placing apparatus
TWI398931B (zh) 2009-07-03 2013-06-11 Wecon Automation Corp 驅動裝置及固晶機
CN102742378A (zh) * 2009-12-30 2012-10-17 麦戴塔自动控制股份公司 部件安装机器
KR101044622B1 (ko) * 2011-01-14 2011-06-29 주식회사 아이. 피. 에스시스템 반도체 칩 본딩장치
EP2925110B1 (en) * 2012-11-21 2019-08-14 FUJI Corporation Electronic-circuit-component-mounting head
JP5912143B2 (ja) * 2014-03-04 2016-04-27 株式会社新川 ボンディング装置
CN107409490B (zh) * 2015-02-24 2019-10-01 株式会社富士 元件安装机
JP6385888B2 (ja) 2015-05-14 2018-09-05 キヤノンマシナリー株式会社 リニアモータ構造
JP6573813B2 (ja) * 2015-09-30 2019-09-11 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法
TWI632626B (zh) * 2016-01-06 2018-08-11 日商新川股份有限公司 Electronic parts processing unit
JP6868471B2 (ja) * 2017-05-31 2021-05-12 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283990A (ja) * 1996-04-10 1997-10-31 Toshiba Corp マウントヘッド及びボンディング装置
JPH11297764A (ja) * 1998-04-14 1999-10-29 Ricoh Co Ltd ボンディングツール及びそれを用いた半導体チップのボンディング方法
JP2007200914A (ja) * 2005-12-26 2007-08-09 Murata Mfg Co Ltd 部品実装ヘッドおよび部品実装装置
JP2013179208A (ja) * 2012-02-29 2013-09-09 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
JP2017041532A (ja) * 2015-08-20 2017-02-23 アピックヤマダ株式会社 チップ剥離装置、およびチップ剥離方法
WO2017119217A1 (ja) * 2016-01-06 2017-07-13 株式会社新川 電子部品実装装置

Also Published As

Publication number Publication date
US20220216078A1 (en) 2022-07-07
KR102651709B1 (ko) 2024-03-28
CN113711340A (zh) 2021-11-26
TW202040725A (zh) 2020-11-01
KR20210144899A (ko) 2021-11-30
JP7228932B2 (ja) 2023-02-27
WO2020213567A1 (ja) 2020-10-22
TWI744850B (zh) 2021-11-01
SG11202111369UA (en) 2021-11-29

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