JPWO2020183790A1 - RFID tags and articles with RFID tags - Google Patents

RFID tags and articles with RFID tags Download PDF

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JPWO2020183790A1
JPWO2020183790A1 JP2020504045A JP2020504045A JPWO2020183790A1 JP WO2020183790 A1 JPWO2020183790 A1 JP WO2020183790A1 JP 2020504045 A JP2020504045 A JP 2020504045A JP 2020504045 A JP2020504045 A JP 2020504045A JP WO2020183790 A1 JPWO2020183790 A1 JP WO2020183790A1
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conductor
rfid tag
rfid
conductors
conductive member
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JP6737418B1 (en
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侑樹 藪原
侑樹 藪原
健吾 松本
健吾 松本
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Murata Manufacturing Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0707—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement being capable of collecting energy from external energy sources, e.g. thermocouples, vibration, electromagnetic radiation
    • G06K19/0708—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement being capable of collecting energy from external energy sources, e.g. thermocouples, vibration, electromagnetic radiation the source being electromagnetic or magnetic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Near-Field Transmission Systems (AREA)
  • Details Of Aerials (AREA)

Abstract

ＲＦＩＤタグ（１０１）は、互いに接続されてコイル状又はループ状の導体の主要部又は全部を形成する第１導体（１）及び第２導体（２１，２２）と、第２導体（２１，２２）に接続される、または第２導体（２１，２２）と電磁界結合する、ＲＦＩＣ（３）と、を備える。第１導体（１）は、第２導体（２１，２２）に接続された状態で、コイル状又はループ状の周回範囲より外方へ端部が突出することで形成される端子（Ｔ１，Ｔ２）を有する。RFID tags (101) are the first conductor (1) and the second conductor (21,22) and the second conductor (21,22) which are connected to each other to form the main part or the whole of the coiled or looped conductor. ), Or an RFID (3) that is electromagnetically coupled to a second conductor (21,22). The first conductor (1) is connected to the second conductor (21, 22), and the terminals (T1, T2) formed by projecting the end portion outward from the coil-shaped or loop-shaped circuit range. ).

Description

本発明は、金属物に取り付けられて用いられるＲＦＩＤタグ、及びその金属物とＲＦＩＤタグとで構成されるＲＦＩＤタグ付き物品に関する。 The present invention relates to an RFID tag attached to a metal object and used, and an RFID-tagged article composed of the metal object and the RFID tag.

特許文献１には、金属面に取り付けられるＲＦＩＤタグ及びＲＦＩＤタグ付き物品が示されている。具体的には、ＲＦＩＤタグは、樹脂ブロックと、この樹脂ブロックに設けられた基板と、基板に実装されたＲＦＩＣ素子と、ＲＦＩＣ素子に接続されたループ状電極とを備えて構成される。このＲＦＩＤタグは例えば接着材層を介して金属面に接着される。 Patent Document 1 shows an RFID tag attached to a metal surface and an article with an RFID tag. Specifically, the RFID tag includes a resin block, a substrate provided on the resin block, an RFIC element mounted on the substrate, and a loop-shaped electrode connected to the RFIC element. The RFID tag is adhered to a metal surface, for example, via an adhesive layer.

国際公開第２０１８／０９２５８３号International Publication No. 2018/092583

特許文献１に記載のＲＦＩＤタグ付き物品においては、ＲＦＩＤタグを接着剤で金属面に接着すると、周囲の雰囲気、液質、温度変化、衝撃といった環境（外部要因）によって比較的容易に脱落してしまう懸念がある。また、例えば医療器具などの鋼製小物は滅菌処理時に高温環境下に晒される。このような高温環境では接着剤からアウトガスと呼ばれる揮発性の化学物質（放出ガス）が放出されるおそれがあるので、ＲＦＩＤタグ付き医療器具などを構成する場合には、上記ＲＦＩＤタグ付き物品の構造が適さない、といった問題もある。 In the article with an RFID tag described in Patent Document 1, when the RFID tag is adhered to a metal surface with an adhesive, it relatively easily falls off due to the environment (external factors) such as the surrounding atmosphere, liquid quality, temperature change, and impact. There is a concern that it will end up. In addition, small steel items such as medical instruments are exposed to a high temperature environment during sterilization. In such a high temperature environment, a volatile chemical substance (release gas) called outgas may be released from the adhesive. Therefore, when constructing an RFID-tagged medical device or the like, the structure of the RFID-tagged article is used. There is also a problem that it is not suitable.

そこで、本発明の目的は、耐環境性が高く、放出ガスの発生のおそれのないＲＦＩＤタグ及びＲＦＩＤタグ付き物品を提供することにある。 Therefore, an object of the present invention is to provide an RFID tag and an article with an RFID tag, which have high environmental resistance and are not likely to generate emitted gas.

本開示の一例としてのＲＦＩＤタグは、
互いに接続されてコイル状又はループ状の導体の主要部又は全部を形成する第１導体及び第２導体と、前記第２導体に接続されるＲＦＩＣとを備え、
前記第１導体は、前記第２導体に接続された状態で、前記コイル状又は前記ループ状の周回範囲より外方へ端部が突出することで形成される端子を有することを特徴とする。RFID tags as an example of the present disclosure are
A first conductor and a second conductor connected to each other to form a main part or all of a coiled or looped conductor, and an RFIC connected to the second conductor are provided.
The first conductor is characterized by having a terminal formed by projecting an end portion outward from the coil-shaped or loop-shaped circumferential range in a state of being connected to the second conductor.

また、本開示の一例としてのＲＦＩＤタグ付き物品は、導電部材を有する又は導電部材で構成される物品と、上記ＲＦＩＤタグとで構成され、前記ＲＦＩＤタグの前記端子が前記導電部材に溶接された、構造であることを特徴とする。 Further, the article with an RFID tag as an example of the present disclosure is composed of an article having or composed of a conductive member and the RFID tag, and the terminal of the RFID tag is welded to the conductive member. , It is characterized by having a structure.

本発明によれば、耐環境性が高く、放出ガスの発生のおそれのないＲＦＩＤタグ及びＲＦＩＤタグ付き物品が得られる。 According to the present invention, an RFID tag and an article with an RFID tag having high environmental resistance and no risk of generating emitted gas can be obtained.

図１は、第１の実施形態に係るＲＦＩＤタグ１０１の外観斜視図である。FIG. 1 is an external perspective view of the RFID tag 101 according to the first embodiment. 図２（Ａ）、図２（Ｂ）は、ＲＦＩＤタグ１０１の構造とその構成要素を示す図である。2 (A) and 2 (B) are views showing the structure of the RFID tag 101 and its components. 図３はＲＦＩＤタグ１０１の縦断面図である。FIG. 3 is a vertical sectional view of the RFID tag 101. 図４（Ａ）はＲＦＩＤタグ付き物品３０１の構成途中の状態を示す図であり、図４（Ｂ）はＲＦＩＤタグ付き物品３０１の構成を示す図である。FIG. 4A is a diagram showing a state in which the RFID-tagged article 301 is being constructed, and FIG. 4B is a diagram showing the configuration of the RFID-tagged article 301. 図５はＲＦＩＤタグ付き物品３０１の斜視図である。FIG. 5 is a perspective view of the RFID-tagged article 301. 図６はＲＦＩＤタグ付き物品３０１の等価回路図である。FIG. 6 is an equivalent circuit diagram of the RFID-tagged article 301. 図７はＲＦＩＤタグ付き物品３０２の斜視図である。FIG. 7 is a perspective view of the RFID-tagged article 302. 図８はＲＦＩＤタグ付き物品３０３の部分平面図である。FIG. 8 is a partial plan view of the RFID-tagged article 303. 図９は、第２の実施形態に係るＲＦＩＤタグ１０２の外観斜視図である。FIG. 9 is an external perspective view of the RFID tag 102 according to the second embodiment. 図１０（Ａ）、図１０（Ｂ）は、ＲＦＩＤタグ１０２の構造とその構成要素を示す図である。10 (A) and 10 (B) are views showing the structure of the RFID tag 102 and its components. 図１１はＲＦＩＤタグ付き物品３０２の斜視図である。FIG. 11 is a perspective view of the RFID-tagged article 302. 図１２は第３の実施形態に係るＲＦＩＤタグ１０３の外観斜視図である。FIG. 12 is an external perspective view of the RFID tag 103 according to the third embodiment. 図１３（Ａ）はＲＦＩＤタグ１０３の製造途中での正面図であり、図１３（Ｂ）はＲＦＩＤタグ１０３の縦断面図である。FIG. 13 (A) is a front view of the RFID tag 103 during manufacturing, and FIG. 13 (B) is a vertical sectional view of the RFID tag 103. 図１４（Ａ）は、ＲＦＩＤタグ付き物品３０４の構成途中の状態を示す図であり、図１４（Ｂ）は、ＲＦＩＤタグ付き物品３０４の構成を示す図である。FIG. 14A is a diagram showing a state in which the RFID-tagged article 304 is being constructed, and FIG. 14B is a diagram showing the configuration of the RFID-tagged article 304.

以降、図を参照して幾つかの具体的な例を挙げて、本発明を実施するための複数の形態を示す。各図中には同一箇所に同一符号を付している。要点の説明又は理解の容易性を考慮して、実施形態を説明の便宜上、複数の実施形態に分けて示すが、異なる実施形態で示した構成の部分的な置換又は組み合わせは可能である。第２の実施形態以降では第１の実施形態と共通の事柄についての記述を省略し、異なる点についてのみ説明する。特に、同様の構成による同様の作用効果については実施形態毎には逐次言及しない。 Hereinafter, a plurality of embodiments for carrying out the present invention will be shown with reference to the drawings with reference to some specific examples. The same reference numerals are given to the same parts in each figure. Although the embodiments are divided into a plurality of embodiments for convenience of explanation in consideration of the explanation of the main points or the ease of understanding, partial replacement or combination of the configurations shown in the different embodiments is possible. In the second and subsequent embodiments, the description of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, the same action and effect due to the same configuration will not be mentioned sequentially for each embodiment.

《第１の実施形態》
図１は、第１の実施形態に係るＲＦＩＤタグ１０１の外観斜視図である。図２（Ａ）、図２（Ｂ）は、ＲＦＩＤタグ１０１の構造とその構成要素を示す図である。図３はＲＦＩＤタグ１０１の縦断面図である。<< First Embodiment >>
FIG. 1 is an external perspective view of the RFID tag 101 according to the first embodiment. 2 (A) and 2 (B) are views showing the structure of the RFID tag 101 and its components. FIG. 3 is a vertical sectional view of the RFID tag 101.

図１に表れているように、第１の実施形態に係るＲＦＩＤタグ１０１は、その内部に第１導体１及び第２導体２１，２２を有し、外部に突出する金属製の端子Ｔ１，Ｔ２を有する。後に示すように、この端子Ｔ１，Ｔ２を導電部材に溶接することで、ＲＦＩＤタグ付き物品が構成される。 As shown in FIG. 1, the RFID tag 101 according to the first embodiment has the first conductor 1 and the second conductors 21 and 22 inside, and the metal terminals T1 and T2 protruding to the outside. Has. As will be shown later, the RFID-tagged article is constructed by welding the terminals T1 and T2 to the conductive member.

図２（Ｂ）に表れているように、ＲＦＩＤタグ１０１は、第１導体素子１０、絶縁性基材５及びＲＦＩＣ３で構成されている。具体的には、絶縁性基材５にＲＦＩＣ３及び第１導体素子１０が実装されることで、図１に示したＲＦＩＤタグ１０１が構成される。 As shown in FIG. 2B, the RFID tag 101 is composed of the first conductor element 10, the insulating base material 5, and the RFIC 3. Specifically, the RFID tag 101 shown in FIG. 1 is configured by mounting the RFIC 3 and the first conductor element 10 on the insulating base material 5.

第１導体素子１０は、第１導体１、磁石４及びこれらを覆う成型樹脂６によって構成されている。つまり、第１導体１の一部及び磁石４の全体は成型樹脂６によって樹脂モールドされて一体化されている。磁石４は直方体形状であり、その三面が第１導体１で囲まれる状態で、成型樹脂６で覆われている。第１導体１は、例えば、鉄、銅、黄銅、ステンレススチール、チタン、アルミニウム等の金属板の成形体である。磁石４は、例えばフェライト磁石、サマリウム・コバルト磁石、ネオジム磁石等である。絶縁性基材５は例えばガラス・エポキシ基材であり、第２導体２１，２２は例えば銅箔パターンである。成型樹脂６は例えばエポキシ樹脂等の硬質な樹脂材料の成形体である。 The first conductor element 10 is composed of a first conductor 1, a magnet 4, and a molding resin 6 that covers them. That is, a part of the first conductor 1 and the whole magnet 4 are resin-molded by the molding resin 6 and integrated. The magnet 4 has a rectangular parallelepiped shape, and its three surfaces are surrounded by the first conductor 1 and covered with the molding resin 6. The first conductor 1 is a molded body of a metal plate such as iron, copper, brass, stainless steel, titanium, or aluminum. The magnet 4 is, for example, a ferrite magnet, a samarium-cobalt magnet, a neodymium magnet, or the like. The insulating base material 5 is, for example, a glass / epoxy base material, and the second conductors 21 and 22 are, for example, a copper foil pattern. The molding resin 6 is a molded body of a hard resin material such as an epoxy resin.

絶縁性基材５には第２導体２１，２２が形成されている。第２導体２１，２２上には、はんだペーストパターンＳＰ１，ＳＰ３が塗布形成される。ＲＦＩＣ３は、はんだペーストパターンＳＰ３，ＳＰ３上に載置され、第１導体素子１０の端子Ｔ１，Ｔ２の根元部は、はんだペーストパターンＳＰ１，ＳＰ１上に載置され、その後のはんだリフロー工程によって、絶縁性基材５上にＲＦＩＣ３及び第１導体素子１０が実装される。つまり、ＲＦＩＣ３及び第１導体１は第２導体２１，２２に電気的に接続される。 Second conductors 21 and 22 are formed on the insulating base material 5. Solder paste patterns SP1 and SP3 are coated and formed on the second conductors 21 and 22. The RFIC3 is placed on the solder paste patterns SP3 and SP3, and the roots of the terminals T1 and T2 of the first conductor element 10 are placed on the solder paste patterns SP1 and SP1 and insulated by the subsequent solder reflow step. The RFIC 3 and the first conductor element 10 are mounted on the sex substrate 5. That is, the RFIC 3 and the first conductor 1 are electrically connected to the second conductors 21 and 22.

上記はんだペーストパターンＳＰ１，ＳＰ１上には、第１導体素子１０の下面に露出する端子Ｔ１，Ｔ２が接し、上記はんだリフロー工程によって、第２導体２１，２２に端子Ｔ１，Ｔ２がはんだ付けされる。 The terminals T1 and T2 exposed on the lower surface of the first conductor element 10 are in contact with the solder paste patterns SP1 and SP1, and the terminals T1 and T2 are soldered to the second conductors 21 and 22 by the solder reflow process. ..

図２（Ａ）に表れているように、第１導体１は金属板が４箇所で直角に折り曲げ加工されることで成形された部材である。図２（Ａ）、図２（Ｂ）等の各図において、第１導体１の折り曲げ部を、その内面も外面も丸みが無いように描いているが、折り曲げ部は丸みを帯びた形状であってもよい。この第１導体１が第２導体２１，２２に接続された状態で、第１導体１及び第２導体２１，２２によってループ状の導体が形成される。そして、このループ状の周回範囲より外方へ端子Ｔ１，Ｔ２が突出する構造となる。上記ＲＦＩＣ３は、第１導体１及び第２導体２１，２２によるループ状の導体の途中に挿入されるので、つまり、第１導体１、第２導体２１，２２及びＲＦＩＣ３によって電気的なループが構成される。 As shown in FIG. 2A, the first conductor 1 is a member formed by bending a metal plate at four points at right angles. In each of the drawings shown in FIGS. 2 (A) and 2 (B), the bent portion of the first conductor 1 is drawn so that neither the inner surface nor the outer surface thereof is rounded, but the bent portion has a rounded shape. There may be. A loop-shaped conductor is formed by the first conductor 1 and the second conductors 21 and 22 in a state where the first conductor 1 is connected to the second conductors 21 and 22. Then, the terminals T1 and T2 have a structure in which the terminals T1 and T2 protrude outward from the loop-shaped circuit range. Since the RFIC 3 is inserted in the middle of the loop-shaped conductor formed by the first conductor 1 and the second conductors 21 and 22, that is, the first conductor 1, the second conductors 21 and 22 and the RFIC 3 form an electric loop. Will be done.

上記ループ状の導体は、図１、図２（Ａ）、図２（Ｂ）に示す直交ＸＹＺ座標において、Ｙ軸に平行な方向がループ状導体の巻回軸方向である。このループ状導体は巻回軸方向に視て矩形であり、第１導体１は矩形の三辺を形成し、第２導体２１，２２は矩形の残る一辺を形成する。 In the orthogonal XYZ coordinates shown in FIGS. 1, 2 (A), and 2 (B), the direction parallel to the Y axis is the winding axis direction of the loop conductor. The loop-shaped conductor is rectangular when viewed in the winding axis direction, the first conductor 1 forms three sides of the rectangle, and the second conductors 21 and 22 form the remaining side of the rectangle.

図４（Ａ）はＲＦＩＤタグ付き物品３０１の構成途中の状態を示す図であり、図４（Ｂ）はＲＦＩＤタグ付き物品３０１の構成を示す図である。このＲＦＩＤタグ付き物品３０１は、導電部材２０１とＲＦＩＤタグ１０１とで構成される。まず、図４（Ａ）に示すように、導電部材２０１上にＲＦＩＤタグ１０１を載置し、ＲＦＩＤタグ１０１の端子Ｔ１，Ｔ２を導電部材２０１の表面に近接させる。その後、ＲＦＩＤタグ１０１の端子Ｔ１，Ｔ２を導電部材２０１に溶接することで、図４（Ｂ）に示すＲＦＩＤタグ付き物品３０１が構成される。 FIG. 4A is a diagram showing a state in which the RFID-tagged article 301 is being constructed, and FIG. 4B is a diagram showing the configuration of the RFID-tagged article 301. The RFID-tagged article 301 is composed of a conductive member 201 and an RFID tag 101. First, as shown in FIG. 4A, the RFID tag 101 is placed on the conductive member 201, and the terminals T1 and T2 of the RFID tag 101 are brought close to the surface of the conductive member 201. After that, the terminals T1 and T2 of the RFID tag 101 are welded to the conductive member 201 to form the article 301 with the RFID tag shown in FIG. 4 (B).

上記導電部材２０１は、例えば鉄（鋼）性の部材であり、図４（Ａ）に示すように、導電部材２０１上にＲＦＩＤタグ１０１を載置した際、磁石４が導電部材２０１を吸引するので、ＲＦＩＤタグ１０１は導電部材２０１に吸着された状態となる。したがって、導電部材２０１の表面からＲＦＩＤタグ１０１が脱落するおそれが低減される。また、上記溶接時にＲＦＩＤタグ１０１の位置ずれや傾きが防止でき、定まった位置に容易に取り付けることができる。 The conductive member 201 is, for example, an iron (steel) member, and as shown in FIG. 4A, when the RFID tag 101 is placed on the conductive member 201, the magnet 4 attracts the conductive member 201. Therefore, the RFID tag 101 is in a state of being attracted to the conductive member 201. Therefore, the possibility that the RFID tag 101 will fall off from the surface of the conductive member 201 is reduced. In addition, the RFID tag 101 can be prevented from being displaced or tilted during the welding, and can be easily attached to a fixed position.

上記溶接の方式としては、例えばアーク溶接やレーザ溶接のような「融接」、抵抗スポット溶接のような「圧接」が挙げられる。 Examples of the welding method include "fusion welding" such as arc welding and laser welding, and "pressure welding" such as resistance spot welding.

図５はＲＦＩＤタグ付き物品３０１の斜視図である。このＲＦＩＤタグ付き物品３０１は、導電部材２０１及びＲＦＩＤタグ１０１によって構成される。ＲＦＩＤタグ１０１は、その端子Ｔ１，Ｔ２が導電部材２０１に溶接されている。この状態で、ＲＦＩＤタグ付き物品３０１が構成される。 FIG. 5 is a perspective view of the RFID-tagged article 301. The RFID-tagged article 301 is composed of a conductive member 201 and an RFID tag 101. The terminals T1 and T2 of the RFID tag 101 are welded to the conductive member 201. In this state, the RFID-tagged article 301 is configured.

ＲＦＩＤタグ１０１は、ＲＦＩＤタグリーダ（ライタ）と磁界結合する状態で通信する。つまり、ＲＦＩＤタグリーダ（ライタ）から発生される磁束が、第１導体１、第２導体２１，２２及びＲＦＩＣ３によって形成される電気的なループの開口面を鎖交する状態で通信が行われる。 The RFID tag 101 communicates with the RFID tag reader (writer) in a magnetic field coupled state. That is, communication is performed in a state where the magnetic flux generated from the RFID tag reader (writer) interlinks the opening surface of the electrical loop formed by the first conductor 1, the second conductors 21 and 22, and the RFIC 3.

なお、第１導体１及び第２導体２１，２２は導電部材２０１に電気的に導通する。このことにより、導電部材２０１を放射体の一部として利用してもよい。 The first conductor 1 and the second conductors 21 and 22 are electrically conductive on the conductive member 201. As a result, the conductive member 201 may be used as a part of the radiator.

図６はＲＦＩＤタグ付き物品３０１の等価回路図である。図６において、インダクタＬ１は、第１導体１及び第２導体２１，２２によるループで構成されるインダクタである。また、この例では、ＲＦＩＣ３をキャパシタＣ３及び抵抗素子Ｒ３の並列回路で表している。 FIG. 6 is an equivalent circuit diagram of the RFID-tagged article 301. In FIG. 6, the inductor L1 is an inductor composed of a loop composed of a first conductor 1 and a second conductor 21 and 22. Further, in this example, the RFIC3 is represented by a parallel circuit of the capacitor C3 and the resistance element R3.

第１導体１及び第２導体２１，２２によるループの内側には磁石４が存在するので、この磁石４は磁芯として作用する。そのため、実質的に１ターンのループでありながら、所定のインダクタンスが容易に得られる。また、全体に小型でありながら、所定の共振周波数に定めることができる。 Since the magnet 4 exists inside the loop formed by the first conductor 1 and the second conductors 21 and 22, the magnet 4 acts as a magnetic core. Therefore, a predetermined inductance can be easily obtained even though the loop is substantially one turn. Further, although the overall size is small, the resonance frequency can be set to a predetermined value.

図６において、キャパシタＣ３及びインダクタＬ１によってＬＣ並列共振回路が構成されている。このＬＣ並列共振回路の共振周波数はＲＦＩＤタグとして用いる周波数帯内の周波数又はその近傍の周波数である。 In FIG. 6, an LC parallel resonant circuit is configured by the capacitor C3 and the inductor L1. The resonance frequency of this LC parallel resonance circuit is a frequency within or near the frequency band used as the RFID tag.

次に、ＲＦＩＤタグ付き物品について示す。図７はＲＦＩＤタグ付き物品３０２の斜視図である。このＲＦＩＤタグ付き物品３０２は、物品本体２１０、導電部材２０１及びＲＦＩＤタグ１０１で構成される。ＲＦＩＤタグ１０１は、ＲＦＩＤタグ付き物品３０２の一部である導電部材２０１にねじ留めされている。この例では、物品本体２１０は電気的には絶縁体で構成されている。 Next, the RFID-tagged article will be described. FIG. 7 is a perspective view of the RFID-tagged article 302. The RFID-tagged article 302 is composed of an article body 210, a conductive member 201, and an RFID tag 101. The RFID tag 101 is screwed to the conductive member 201 that is a part of the RFID-tagged article 302. In this example, the article body 210 is electrically composed of an insulator.

このように、ＲＦＩＤタグ付き物品３０２の一部である導電部材２０１にＲＦＩＤタグ１０１を取り付けることにより、ＲＦＩＤタグ付き物品を構成してもよい。 In this way, the RFID-tagged article may be configured by attaching the RFID tag 101 to the conductive member 201 that is a part of the RFID-tagged article 302.

図８はＲＦＩＤタグ付き物品３０３の部分平面図である。このＲＦＩＤタグ付き物品３０３は、止血用鉗子や医療用はさみ等の鋼製小物２０２にＲＦＩＤタグ１０１を取り付けた物品である。この鋼製小物２０２にＲＦＩＤタグ１０１の端子が溶接されている。 FIG. 8 is a partial plan view of the RFID-tagged article 303. The RFID-tagged article 303 is an article in which the RFID tag 101 is attached to a steel accessory 202 such as hemostatic forceps or medical scissors. The terminal of the RFID tag 101 is welded to the small steel item 202.

図８に示す鋼製小物２０２のように、ＲＦＩＤタグ１０１を取り付ける鋼製小物２０２が医療器具である場合、滅菌処理のために高温環境下に晒されることがある。鋼製小物２０２に対してＲＦＩＤタグ１０１を接着剤により取り付けた場合には、当該接着剤からアウトガスが発生するおそれがある。また、鋼製小物２０２に対してＲＦＩＤタグ１０１をゴムチューブにより取り付けた場合には、当該ゴムチューブ内を滅菌することができないので、十分に滅菌処理を行うことができない。 When the steel accessory 202 to which the RFID tag 101 is attached is a medical device like the steel accessory 202 shown in FIG. 8, it may be exposed to a high temperature environment for sterilization. When the RFID tag 101 is attached to the small steel item 202 with an adhesive, outgas may be generated from the adhesive. Further, when the RFID tag 101 is attached to the steel accessory 202 by a rubber tube, the inside of the rubber tube cannot be sterilized, so that the sterilization process cannot be sufficiently performed.

これに対して、本実施形態によれば、鋼製小物２０２に対してＲＦＩＤタグ１０１を、接着剤やゴムチューブを用いることなく、溶接することにより取り付けることができる。 On the other hand, according to the present embodiment, the RFID tag 101 can be attached to the small steel item 202 by welding without using an adhesive or a rubber tube.

《第２の実施形態》
第２の実施形態では、第１の実施形態とは第１導体及び第２導体の構成が異なるＲＦＩＤタグ及びＲＦＩＤタグ付き物品について例示する。<< Second Embodiment >>
In the second embodiment, an RFID tag and an article with an RFID tag having different configurations of the first conductor and the second conductor from the first embodiment will be illustrated.

図９は、第２の実施形態に係るＲＦＩＤタグ１０２の外観斜視図である。図１０（Ａ）、図１０（Ｂ）は、ＲＦＩＤタグ１０２の構造とその構成要素を示す図である。 FIG. 9 is an external perspective view of the RFID tag 102 according to the second embodiment. 10 (A) and 10 (B) are views showing the structure of the RFID tag 102 and its components.

図９に表れているように、第２の実施形態に係るＲＦＩＤタグ１０２は、その内部に第１導体１Ａ，１Ｂ及び第２導体２１，２２を有し、外部に突出する金属製の端子Ｔ１，Ｔ２を有する。第１の実施形態で示したＲＦＩＤタグ付き物品と同様に、この端子Ｔ１，Ｔ２を導電部材に溶接することで、ＲＦＩＤタグ付き物品が構成される。 As shown in FIG. 9, the RFID tag 102 according to the second embodiment has the first conductors 1A and 1B and the second conductors 21 and 22 inside, and the metal terminal T1 protruding to the outside. , T2. Similar to the RFID-tagged article shown in the first embodiment, the RFID-tagged article is formed by welding the terminals T1 and T2 to the conductive member.

ＲＦＩＤタグ１０２は、図１０（Ｂ）に表れているように、第１導体素子１０、絶縁性基材５及びＲＦＩＣ３で構成されている。具体的には、絶縁性基材５にＲＦＩＣ３及び第１導体素子１０が実装されることで、図９に示したＲＦＩＤタグ１０２が構成される。 As shown in FIG. 10B, the RFID tag 102 is composed of the first conductor element 10, the insulating base material 5, and the RFIC 3. Specifically, the RFID tag 102 shown in FIG. 9 is configured by mounting the RFIC 3 and the first conductor element 10 on the insulating base material 5.

第１導体素子１０は、第１導体１Ａ，１Ｂ、磁石４及びこれらを覆う成型樹脂６によって構成されている。つまり、第１導体１Ａ，１Ｂの一部及び磁石４の全体は成型樹脂６によって樹脂モールドされて一体化されている。磁石４は直方体形状であり、その三面が第１導体１Ａ，１Ｂで囲まれる状態で、成型樹脂６で覆われている。第１導体１Ａ，１Ｂの材料及び磁石４の材料は第１の実施形態で示したものと同様である。 The first conductor element 10 is composed of the first conductors 1A and 1B, the magnet 4, and the molding resin 6 covering them. That is, a part of the first conductors 1A and 1B and the whole magnet 4 are resin-molded by the molding resin 6 and integrated. The magnet 4 has a rectangular parallelepiped shape, and its three surfaces are surrounded by the first conductors 1A and 1B, and are covered with the molding resin 6. The materials of the first conductors 1A and 1B and the material of the magnet 4 are the same as those shown in the first embodiment.

絶縁性基材５には、第２導体２１，２２及び第１導体実装用電極２３，２４が形成されている。ＲＦＩＣ３及び第１導体素子１０は、はんだリフロー工程によって、絶縁性基材５上に実装される。なお、図１０（Ａ）、図１０（Ｂ）はでははんだペーストの図示は省略している。 The insulating base material 5 is formed with the second conductors 21 and 22, and the electrodes 23 and 24 for mounting the first conductor. The RFIC 3 and the first conductor element 10 are mounted on the insulating base material 5 by a solder reflow step. Note that the solder paste is not shown in FIGS. 10 (A) and 10 (B).

図１０（Ａ）に表れているように、第１導体１Ａ，１Ｂは、それぞれ金属板が４箇所で直角に屈折されることで成形された部材である。第１導体１Ａの一端は第２導体２１の端部に接続され、第１導体１Ａの他端は第１導体実装用電極２３に接続される。また、第１導体１Ｂの一端は第２導体２２の端部に接続され、第１導体１Ｂの他端は第１導体実装用電極２４に接続される。 As shown in FIG. 10A, the first conductors 1A and 1B are members formed by refracting a metal plate at four points at right angles. One end of the first conductor 1A is connected to the end of the second conductor 21, and the other end of the first conductor 1A is connected to the electrode 23 for mounting the first conductor. Further, one end of the first conductor 1B is connected to the end portion of the second conductor 22, and the other end of the first conductor 1B is connected to the electrode 24 for mounting the first conductor.

第１導体１Ａ，１Ｂが第２導体２１，２２に接続され、さらに、後に示すように、端子Ｔ１，Ｔ２が導電部材２０１に接続された状態で、第１導体１Ａ，１Ｂ、第２導体２１，２２及び導電部材によって、約２ターンのコイル状の導体が形成される。そして、このコイル状の周回範囲より外方へ端子Ｔ１，Ｔ２が突出する構造となる。上記ＲＦＩＣ３は、第１導体１Ａ，１Ｂ及び第２導体２１，２２によるコイル状の導体の途中に挿入されるので、つまり、第１導体１Ａ，１Ｂ、第２導体２１，２２及びＲＦＩＣ３によって電気的なループが構成される。 The first conductors 1A and 1B are connected to the second conductors 21 and 22, and as will be described later, the first conductors 1A and 1B and the second conductor 21 are connected to the conductive member 201. , 22 and the conductive member form a coiled conductor of about 2 turns. Then, the terminals T1 and T2 have a structure in which the terminals T1 and T2 protrude outward from the coil-shaped circuit range. Since the RFIC3 is inserted in the middle of the coiled conductor formed by the first conductors 1A and 1B and the second conductors 21 and 22, that is, it is electrically operated by the first conductors 1A and 1B, the second conductors 21 and 22 and the RFIC3. Loop is constructed.

上記コイル状の導体は、図９、図１０（Ａ）、図１０（Ｂ）に示す直交ＸＹＺ座標において、Ｙ軸に平行な方向がコイル状導体の巻回軸方向である。このコイル状導体は巻回軸方向に視て矩形であり、第１導体１Ａ，１Ｂは矩形の三辺を形成し、第２導体２１，２２は矩形の残る一辺を形成する。 In the orthogonal XYZ coordinates shown in FIGS. 9, 10 (A) and 10 (B), the direction parallel to the Y axis is the winding axis direction of the coiled conductor. This coiled conductor is rectangular when viewed in the winding axis direction, the first conductors 1A and 1B form three sides of a rectangle, and the second conductors 21 and 22 form the remaining one side of the rectangle.

図１１はＲＦＩＤタグ付き物品３０２の斜視図である。このＲＦＩＤタグ付き物品３０２は、導電部材２０１及びＲＦＩＤタグ１０２によって構成される。ＲＦＩＤタグ１０２は、その端子Ｔ１，Ｔ２が導電部材２０１に溶接されている。上述のとおり、この状態で、第１導体１Ａ，１Ｂ、第２導体２１，２２及び導電部材２０１によって、約２ターンのコイル状の導体が形成され、このコイル状の導体経路の途中にＲＦＩＣ３が挿入された構造となる。このようにして、ＲＦＩＤタグ付き物品３０２が構成される。 FIG. 11 is a perspective view of the RFID-tagged article 302. The RFID-tagged article 302 is composed of a conductive member 201 and an RFID tag 102. The terminals T1 and T2 of the RFID tag 102 are welded to the conductive member 201. As described above, in this state, the first conductors 1A and 1B, the second conductors 21 and 22, and the conductive member 201 form a coiled conductor of about two turns, and the RFIC3 is formed in the middle of the coiled conductor path. It becomes the inserted structure. In this way, the RFID-tagged article 302 is configured.

第２の実施形態では、導電部材２０１をコイル状導体の一部として利用できるので、つまり、導電部材２０１が第２導体２１，２２に対して並列されないので、ＲＦＩＤタグの設計が容易となり、安定した特性を得やすい。 In the second embodiment, the conductive member 201 can be used as a part of the coiled conductor, that is, the conductive member 201 is not parallel to the second conductors 21 and 22, so that the RFID tag can be designed easily and stably. It is easy to obtain the characteristics.

《第３の実施形態》
第３の実施形態では、樹脂成型を行う領域が第１、第２の実施形態とは異なるＲＦＩＤタグ及びＲＦＩＤタグ付き物品の例を示す。<< Third Embodiment >>
In the third embodiment, an example of an RFID tag and an article with an RFID tag whose resin molding region is different from that of the first and second embodiments is shown.

図１２は第３の実施形態に係るＲＦＩＤタグ１０３の外観斜視図である。図１３（Ａ）はＲＦＩＤタグ１０３の製造途中での正面図であり、図１３（Ｂ）はＲＦＩＤタグ１０３の縦断面図である。 FIG. 12 is an external perspective view of the RFID tag 103 according to the third embodiment. FIG. 13 (A) is a front view of the RFID tag 103 during manufacturing, and FIG. 13 (B) is a vertical sectional view of the RFID tag 103.

図１２に表れているように、第３の実施形態に係るＲＦＩＤタグ１０３は、その内部に第１導体１及び第２導体２１，２２を有し、外部に突出する金属製の端子Ｔ１，Ｔ２を有する。第２導体２１，２２は絶縁性基材５に形成されていて、この絶縁性基材５にＲＦＩＣ３が実装されている。磁石４は第１導体１に嵌合されている。 As shown in FIG. 12, the RFID tag 103 according to the third embodiment has the first conductor 1 and the second conductors 21 and 22 inside, and the metal terminals T1 and T2 protruding to the outside. Has. The second conductors 21 and 22 are formed on the insulating base material 5, and the RFIC 3 is mounted on the insulating base material 5. The magnet 4 is fitted to the first conductor 1.

第３の実施形態に係るＲＦＩＤタグ１０３は、図１３（Ａ）に示すように、まず絶縁性基材５にＲＦＩＣ３を実装し、続いて絶縁性基材５に第１導体１を実装する。磁石４は第１導体１に嵌合されているので、絶縁性基材５と磁石４との間に間隙が形成される。その後、図１３（Ｂ）に示すように、絶縁性基材５の上部に成型樹脂６を覆う。つまり、第１導体１の一部及び磁石４の全体は成型樹脂６によって樹脂モールドされて一体化される。 As shown in FIG. 13A, the RFID tag 103 according to the third embodiment first mounts the RFIC 3 on the insulating base material 5, and then mounts the first conductor 1 on the insulating base material 5. Since the magnet 4 is fitted to the first conductor 1, a gap is formed between the insulating base material 5 and the magnet 4. Then, as shown in FIG. 13B, the molding resin 6 is covered on the upper part of the insulating base material 5. That is, a part of the first conductor 1 and the whole magnet 4 are resin-molded by the molding resin 6 and integrated.

なお、第１導体１が鉄や鉄合金等の強磁性体金属である場合には、上記「嵌合」によらずとも、磁石４は第１導体１に吸着するので、その状態で上記樹脂モールドを行ってもよい。 When the first conductor 1 is a ferromagnetic metal such as iron or an iron alloy, the magnet 4 is attracted to the first conductor 1 even if the "fitting" is not performed. Therefore, the resin in that state. Molding may be performed.

図１４（Ａ）は、ＲＦＩＤタグ付き物品３０４の構成途中の状態を示す図であり、図１４（Ｂ）は、ＲＦＩＤタグ付き物品３０４の構成を示す図である。このＲＦＩＤタグ付き物品３０４は、導電部材２０１とＲＦＩＤタグ１０３とで構成される。まず、図１４（Ａ）に示すように、導電部材２０１上にＲＦＩＤタグ１０３を載置し、ＲＦＩＤタグ１０３の端子Ｔ１，Ｔ２を導電部材２０１の表面に近接させる。その後、ＲＦＩＤタグ１０３の端子Ｔ１，Ｔ２を導電部材２０１に溶接することで、図１４（Ｂ）に示すＲＦＩＤタグ付き物品３０４が構成される。 FIG. 14A is a diagram showing a state in which the RFID-tagged article 304 is being constructed, and FIG. 14B is a diagram showing the configuration of the RFID-tagged article 304. The RFID-tagged article 304 is composed of a conductive member 201 and an RFID tag 103. First, as shown in FIG. 14A, the RFID tag 103 is placed on the conductive member 201, and the terminals T1 and T2 of the RFID tag 103 are brought close to the surface of the conductive member 201. After that, the terminals T1 and T2 of the RFID tag 103 are welded to the conductive member 201 to form the article 304 with the RFID tag shown in FIG. 14 (B).

《その他の実施形態》
以上に示した例では、製造工程のどの段階でも、図面ではＲＦＩＤタグ単体での状態を示したが、連続する多数のＲＦＩＤタグを同時に製造し、最終工程で個々のＲＦＩＤタグに分離してもよい。例えば、個々の第１導体１が、それらの端子Ｔ１，Ｔ２を介して、Ｙ軸方向に延びるフープ材に繋がった状態で製造し、最終段階で、各ＲＦＩＤタグをフープ材から切断分離してもよい。<< Other Embodiments >>
In the above examples, the state of the RFID tag alone is shown in the drawings at any stage of the manufacturing process, but even if a large number of continuous RFID tags are manufactured at the same time and separated into individual RFID tags in the final process. Good. For example, each first conductor 1 is manufactured in a state of being connected to a hoop material extending in the Y-axis direction via their terminals T1 and T2, and at the final stage, each RFID tag is cut and separated from the hoop material. May be good.

また、絶縁性基材５についても、マザーボード状態で各工程での製造を行い、最後にマザーボードを分割することで、多数の絶縁性基材５を同時に製造してもよい。 Further, the insulating base material 5 may also be manufactured in each step in the state of the motherboard, and finally the motherboard may be divided to manufacture a large number of the insulating base materials 5 at the same time.

また、以上に示した例では、ＲＦＩＣ３内に設けられた容量成分をＬＣ共振回路のキャパシタとして用いる構成を示したが、ＲＦＩＣ３に並列接続されるチップキャパシタを絶縁性基材５に実装してもよい。また、絶縁性基材５に、導体パターンによって共振回路のキャパシタを構成してもよい。 Further, in the above-mentioned example, the configuration in which the capacitance component provided in the RFIC 3 is used as the capacitor of the LC resonance circuit is shown, but even if the chip capacitor connected in parallel with the RFIC 3 is mounted on the insulating base material 5. Good. Further, a capacitor of a resonance circuit may be formed on the insulating base material 5 by a conductor pattern.

また、絶縁性基材５として、複数の基材を積層した多層基板を用いて、内層に導体パターンを形成してもよい。また、樹脂材料ではなく、セラミック材料による基板を用いてもよい。また、第１面側導体パターン、第２面側導体パターンは金属箔ではなく、導電性材料の印刷によって形成してもよい。 Further, as the insulating base material 5, a multilayer substrate in which a plurality of base materials are laminated may be used to form a conductor pattern in the inner layer. Further, a substrate made of a ceramic material may be used instead of the resin material. Further, the first surface side conductor pattern and the second surface side conductor pattern may be formed by printing a conductive material instead of the metal foil.

最後に、上述の実施形態の説明は、すべての点で例示であって、制限的なものではない。当業者にとって変形及び変更が適宜可能である。本発明の範囲は、上述の実施形態ではなく、特許請求の範囲によって示される。さらに、本発明の範囲には、特許請求の範囲内と均等の範囲内での実施形態からの変更が含まれる。 Finally, the description of the embodiments described above is exemplary in all respects and is not restrictive. Modifications and changes can be made as appropriate for those skilled in the art. The scope of the present invention is shown not by the above-described embodiment but by the scope of claims. Further, the scope of the present invention includes modifications from the embodiment within the scope of the claims and within the scope of the claims.

Ｃ３…キャパシタ
Ｌ１…インダクタ
Ｒ３…抵抗素子
ＳＰ１，ＳＰ３…はんだペーストパターン
Ｔ１，Ｔ２…端子
Ｗ１，Ｗ２…溶接部
１，１Ａ，１Ｂ…第１導体
３…ＲＦＩＣ
４…磁石
５…絶縁性基材
６…成型樹脂
１０…第１導体素子
２１，２２…第２導体
２３，２４…第１導体実装用電極
１０１．１０２，１０３…ＲＦＩＤタグ
２０１…導電部材
２０２…鋼製小物
２１０…物品本体
３０１，３０２，３０３，３０４…ＲＦＩＤタグ付き物品C3 ... Capacitor L1 ... Inductor R3 ... Resistor elements SP1, SP3 ... Solder paste pattern T1, T2 ... Terminals W1, W2 ... Welded parts 1, 1A, 1B ... First conductor 3 ... RFIC
4 ... Magnet 5 ... Insulating base material 6 ... Molded resin 10 ... First conductor elements 21 and 22 ... Second conductors 23, 24 ... Electrodes for mounting the first conductor 101.102, 103 ... RFID tag 201 ... Conductive member 202 ... Small steel items 210 ... Article body 301, 302, 303, 304 ... Articles with RFID tags

本開示の一例としてのＲＦＩＤタグは、
互いに接続されてコイル状又はループ状の導体の主要部又は全部を形成する第１導体及び第２導体と、前記第２導体に接続されて、前記コイル状又は前記ループ状の導体に電気的に接続されるＲＦＩＣとを備え、
前記第１導体は、前記第２導体に接続された状態で、前記コイル状又は前記ループ状の周回範囲より外方へ端部が突出することで形成される端子を有することを特徴とする。 RFID tags as an example of the present disclosure are
The first and second conductors, which are connected to each other to form the main part or all of the coiled or looped conductor, and the second conductor, electrically connected to the coiled or looped conductor. a RFIC that will be connected,
The first conductor is characterized by having a terminal formed by projecting an end portion outward from the coil-shaped or loop-shaped circumferential range in a state of being connected to the second conductor.

Claims (4)

互いに接続されてコイル状又はループ状の導体の主要部又は全部を形成する第１導体及び第２導体と、前記第２導体に接続されるＲＦＩＣとを備え、
前記第１導体は、前記第２導体に接続された状態で、前記コイル状又は前記ループ状の周回範囲より外方へ端部が突出することで形成される端子を有することを特徴とする、
ＲＦＩＤタグ。A first conductor and a second conductor connected to each other to form a main part or all of a coiled or looped conductor, and an RFIC connected to the second conductor are provided.
The first conductor is characterized by having a terminal formed by projecting an end portion outward from the coil-shaped or loop-shaped circular range in a state of being connected to the second conductor.
RFID tag. 前記第１導体の周囲を覆う成型樹脂と、前記第２導体が形成される絶縁性基材とを備え、
前記第１導体は前記成型樹脂と共に一体化され、前記第１導体及び前記成型樹脂によって第１導体素子が構成され、
前記ＲＦＩＣ及び前記第１導体素子は前記絶縁性基材に実装され、
前記コイル状又は前記ループ状の導体は、前記コイル状又は前記ループ状の導体の巻回軸方向に視て矩形であり、
前記第１導体は前記矩形の三辺を形成し、前記第２導体は前記矩形の残る一辺を形成する、
請求項１に記載のＲＦＩＤタグ。A molded resin that covers the periphery of the first conductor and an insulating base material on which the second conductor is formed are provided.
The first conductor is integrated with the molding resin, and the first conductor and the molding resin form a first conductor element.
The RFIC and the first conductor element are mounted on the insulating base material, and the RFIC and the first conductor element are mounted on the insulating base material.
The coiled or looped conductor is rectangular when viewed in the winding axis direction of the coiled or looped conductor.
The first conductor forms the three sides of the rectangle, and the second conductor forms the remaining side of the rectangle.
The RFID tag according to claim 1. 前記成型樹脂で覆われ、前記第１導体で三面が囲まれる位置に配置される磁石を備える、
請求項２に記載のＲＦＩＤタグ。A magnet provided with a magnet covered with the molding resin and arranged at a position surrounded by the first conductor on three sides.
The RFID tag according to claim 2. 導電部材を有する又は導電部材で構成される物品と、請求項１から３のいずれかに記載のＲＦＩＤタグとで構成され、
前記ＲＦＩＤタグの前記端子が前記導電部材に溶接された、
ＲＦＩＤタグ付き物品。It is composed of an article having or composed of a conductive member and the RFID tag according to any one of claims 1 to 3.
The terminal of the RFID tag is welded to the conductive member.
Goods with RFID tags.
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