WO2017159436A1 - Coil module - Google Patents

Coil module Download PDF

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Publication number
WO2017159436A1
WO2017159436A1 PCT/JP2017/008869 JP2017008869W WO2017159436A1 WO 2017159436 A1 WO2017159436 A1 WO 2017159436A1 JP 2017008869 W JP2017008869 W JP 2017008869W WO 2017159436 A1 WO2017159436 A1 WO 2017159436A1
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WIPO (PCT)
Prior art keywords
coil
circuit board
conductor
magnetic member
rfid tag
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Application number
PCT/JP2017/008869
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French (fr)
Japanese (ja)
Inventor
番場　真一郎
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株式会社村田製作所
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Publication date
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Publication of WO2017159436A1 publication Critical patent/WO2017159436A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H04B5/48—

Definitions

  • the present invention relates to a coil module including a coil and a circuit connected to the coil.
  • an RFID tag is configured such that a rectangular spiral planar coil pattern is formed on an insulating ceramic substrate, and an RFID IC chip or the like is mounted on the base material. Since the coil pattern is formed along the outer periphery of the substrate in order to make the coil opening as large as possible, the IC chip for RFID is mounted inside the coil opening.
  • FIG. 7 is a diagram showing the structure of the RFID tag disclosed in Patent Document 1.
  • the RFID tag 91 includes a coil 92, an insulator 93, and a metal plate 94.
  • a resonance capacitor 96 and an RFID IC 97 are mounted on the core of the coil.
  • the parts such as the RFID IC partially shield the magnetic flux passing through the coil opening. Therefore, the effective coil opening is smaller than the coil opening of the planar coil pattern formed on the substrate. Further, in the RFID tag around which the metal wire is wound, the coil is only wound around the core, so that the coil opening is relatively small as compared with the size of the entire tag. Therefore, both of them have a structure in which the readable distance as an RFID tag is limited.
  • the above-mentioned problem is not limited to the RFID tag but is common to a coil module including a coil and a module circuit connected to the coil.
  • An object of the present invention is to provide a coil module capable of increasing the effective coil opening for the entire size and increasing the coupling coefficient with the coupling partner coil.
  • the coil module of the present invention includes: A circuit board having a first surface and a second surface facing the first surface, the conductor pattern being formed; An electronic component mounted on the first surface of the circuit board and constituting a module circuit with the conductor pattern; A resin layer for sealing the electronic component; A magnetic member that overlaps the first surface of the circuit board as viewed from a direction perpendicular to the first surface, A conductor coil wound around the laminate of the circuit board, the resin layer, and the magnetic member in a direction in which the laminate is bundled, and connected to the module circuit; It is characterized by providing.
  • the conductor coil is wound around the entire laminate of the circuit board, the resin layer that seals the electronic components mounted on the circuit board, and the magnetic member, so that it is effective for the overall size.
  • a coil module having a coil with a large coil opening can be obtained.
  • the circuit board has a rectangular shape and the magnetic body member has a rectangular shape when viewed from a direction perpendicular to the first surface.
  • the external shape of the laminated body by a circuit board, a resin layer, and a magnetic body member is simplified, and winding of a conductor coil becomes easy.
  • the surface of the magnetic member overlapping the first surface of the circuit board has substantially the same shape as the first surface. Therefore, the external shape of the laminated body by a circuit board, a resin layer, and a magnetic body member is simplified, and winding of a conductor coil becomes easy.
  • the conductor coil is preferably a Cu wire having an insulating film.
  • the conductor coil can be wound in close proximity, or can be wound in an overlapping manner, whereby the self-inductance inductance can be increased and a predetermined inductance can be obtained with a small number of turns.
  • the electronic component is mounted on a first surface of the circuit board, and the conductor pattern includes a terminal electrode formed on the second surface of the circuit board. Preferably, both ends of the conductor coil are connected to the terminal electrode. This structure facilitates connection and winding of the conductor coil to the module circuit.
  • a coil antenna is constituted by the conductor coil and the magnetic member, and the electronic component includes an RFID IC connected to the coil antenna. .
  • the electronic component includes an RFID IC connected to the coil antenna.
  • the conductor coil is wound around the entire laminate of the circuit board, the resin layer that seals the electronic component mounted on the circuit board, and the magnetic material member.
  • a coil module having a coil with a large effective coil opening is obtained.
  • FIG. 1 is a four-side view of an RFID tag 101 as an example of a coil module according to the first embodiment.
  • FIG. 2 is a two-side view of a circuit board provided in the RFID tag 101.
  • FIG. 3 is a diagram showing a circuit of the RFID tag 101 and a circuit of the communication partner antenna.
  • FIG. 4 is a partial plan view in a state in which individual magnetic members 3 are mounted in each circuit formation region of the collective substrate 1M.
  • FIG. 5 is a four-side view of an RFID tag 102 as an example of a coil module according to the second embodiment.
  • FIG. 6 is a four-sided view of the RFID tag 102 ⁇ / b> C in a state where a resin coating is applied around the RFID tag 102.
  • FIG. 7 is a diagram showing the structure of the RFID tag disclosed in Patent Document 1. In FIG.
  • the “coil module” shown in the following embodiments is used for near-field communication such as NFC (Near Field Communication) using magnetic field coupling with the communication partner antenna device.
  • NFC Near Field Communication
  • FIG. 1 is a four-side view of an RFID tag 101 as an example of a coil module according to the first embodiment.
  • FIG. 2 is a two-side view of a circuit board provided in the RFID tag 101.
  • the RFID tag 101 includes a circuit board 1, a resin layer 2, and a magnetic member 3.
  • the circuit board 1 includes a base material 10, a conductor pattern formed on the base material 10, and an electronic component connected to the conductor pattern.
  • the circuit board 1 is, for example, a glass / epoxy board.
  • a module circuit is constituted by the conductor pattern and the electronic component.
  • the conductor pattern 11 is formed on the first surface S1 of the circuit board 1, and the electronic components 13, C2A, C2B, and the like are mounted.
  • the joining of the electronic component to the conductor pattern of the circuit board is, for example, solder joining or Au—Au joining.
  • Terminal electrodes 12A and 12B, which are part of the conductor pattern, are formed on the second surface S2 of the circuit board 1 that faces the first surface S1.
  • the magnetic member 3 is composed of a rectangular parallelepiped magnetic ferrite.
  • the surface of the magnetic member 3 that overlaps the first surface S1 of the circuit board 1 through the resin layer 2 has substantially the same shape as the first surface S1. “Substantially the same shape” means, for example, that the area of the circuit board 1 is 90% or more and 100% or less of the area of the magnetic member 3 when viewed from the direction perpendicular to the first surface S1, for example, the first surface S1.
  • the circuit board 1 is similar to the magnetic member 3 when viewed from the direction perpendicular to the direction, for example, the circuit board 1 and the magnetic member 3 are both rectangular when viewed from the direction perpendicular to the first surface S1. And so on.
  • the electronic component mounted on the circuit board 1 is sealed with a resin layer 2 made of a thermosetting resin such as an epoxy resin.
  • the circuit board 1, the resin layer 2, and the magnetic member 3 constitute a laminated body 123.
  • the conductor coil 4 is wound around the multilayer body 123 in a direction in which the multilayer body 123 is bundled.
  • the conductor coil 4 is a Cu wire having a polyurethane film (a Cu wire coated with polyurethane).
  • the conductor coil 4 is wound about 11 turns in this example.
  • a coil antenna 43 is constituted by the conductor coil 4 and the magnetic member 3.
  • Both ends of the conductor coil 4 are connected to the terminal electrodes 12A and 12B.
  • the terminal electrodes 12A and 12B are Cu electrode patterns, for example, and are Cu—Cu welded with Cu which is a core material of the conductor coil. Thereby, the conductor coil 4 is connected to the module circuit.
  • the magnetic member 3 acts as a magnetic core of the conductor coil 4.
  • the magnetic flux ⁇ schematically represents the magnetic flux passing through the magnetic member 3.
  • the coil opening of the conductor coil 4 there are electronic components and conductor patterns in the coil opening of the conductor coil 4, which partially shield the magnetic flux, but the coil opening has a height H, as shown in FIG.
  • the width W is larger than the cross section of the magnetic member 3. That is, a coil opening larger than the cross-sectional area of the magnetic member 3 is ensured.
  • the conductor coil 4 can be wound in close proximity or wound in an overlapping manner, whereby the self-inductance inductance can be increased and a predetermined inductance can be obtained with a small number of turns.
  • the number of turns or the conductor interval of the conductor coil 4 can be easily adjusted and set without changing the circuit board 1 and the magnetic member 3, so that the coil antenna 43 having a predetermined inductance is provided.
  • the RFID tag 101 is obtained.
  • FIG. 3 is a diagram showing a circuit of the RFID tag 101 and a circuit of the communication partner antenna.
  • the inductor L1 corresponds to the conductor coil 4 and the magnetic member 3.
  • the RFID-IC 13 and the capacitors C1A, C1B, C2A, C2B are electronic components mounted on the circuit board 1.
  • the capacitors C1A, C1B, C2A, C2B and the inductor L1 constitute an LC resonance circuit and an impedance matching circuit with the RFID-IC13.
  • the resonance frequency band of this LC resonance circuit is a frequency band used for communication. For example, in the case of NFC, it is 13.56 MHz or a frequency in the vicinity thereof.
  • the inductor L2 is an element that represents the coil antenna on the communication partner side as a lumped constant circuit.
  • a reader / writer circuit is connected to the inductor L2.
  • the inductor L1 by the conductor coil 4 of the RFID tag 101 and the inductor L2 of the communication partner antenna are magnetically coupled.
  • FIG. 4 is a partial plan view in a state in which individual magnetic members 3 are mounted in each circuit formation region of the collective substrate 1M.
  • the collective board 1M is in a state before being separated into the circuit boards 1 (pieces) shown in FIG.
  • the RFID tag 101 is manufactured by the following procedure.
  • a conductor pattern is formed in each circuit formation region of the collective substrate 1M shown in FIG. 4, and an electronic component is mounted in each circuit formation region.
  • a sealing resin such as an epoxy resin is applied to the electronic component mounting surface of the collective substrate 1M, and vacuum degassing is performed between the collective substrate 1M and the electronic component (gap on the lower surface of the electronic component). Underfill is formed.
  • the plurality of magnetic members 3 are arranged in a positioned state, transferred to a transfer sheet, and then the magnetic members 3 are collectively mounted on the collective substrate 1M.
  • the collective substrate 1M is cut by a dicer from the surface opposite to the mounting surface of the magnetic member 3 or from the mounting surface side of the magnetic member 3, and divided into individual pieces. Thereby, the some laminated body 123 is obtained.
  • a broken line extending vertically and horizontally is a cutting line by a dicer.
  • the conductor coil 4 is formed by winding an insulation coating Cu wire around each laminated body 123.
  • this coil winding machine a winding machine for manufacturing a chip-shaped winding inductor can be used.
  • the RFID tag 101 shown in FIG. 1 is dipped in a liquid resin, pulled up, and cured by heating to apply a resin coating around the RFID tag 101.
  • the RFID tag 101 is manufactured by the above procedure.
  • the completed RFID tag 101 is attached to an article such as a toy, for example.
  • the article is a resin molded product
  • the RFID tag 101 is integrated with the article so that the RFID tag 101 is embedded in the resin during injection molding of the resin.
  • Second Embodiment An example in which the configuration of the resin layer is different from that of the first embodiment is shown.
  • FIG. 5 is a four-side view of an RFID tag 102 as an example of a coil module according to the second embodiment.
  • the RFID tag 102 includes a circuit board 1, a resin layer 2, and a magnetic member 3.
  • the configurations of the circuit board 1, the magnetic member 3, and the conductor coil 4 are the same as those of the RFID tag 101 shown in the first embodiment.
  • the electronic component mounted on the circuit board 1 is first sealed with the resin layer 2A.
  • the resin layer 2A is cured before the magnetic member 3 is mounted.
  • the sealing resin 2B is applied to the upper surface of the circuit board 1 including the surface of the resin layer 2A or the lower surface of the magnetic body member 3, the magnetic body member 3 is laminated on the circuit board 1, and the sealing resin 2B is applied. Harden. Thereby, the laminated body 123 is comprised.
  • FIG. 6 is a four-side view of the RFID tag 102C in a state in which a resin coating is applied around the RFID tag 102.
  • the coating resin 5 is coated on the outer surface (six surfaces) of the RFID tag 102.
  • the coating resin 5 is formed by immersing the RFID tag 102 shown in FIG. 5 in a liquid resin, pulling it up, and curing it by heating.
  • the magnetic member 3 has a curved cross section or a straight line and a curved line in a plane perpendicular to the winding axis of the conductor coil.
  • the shape comprised by may be sufficient. For example, it may be cylindrical. Further, a “kamaboko shape” in which the surface facing the circuit board is a flat surface may be used.
  • the configuration example in which the resin layer 2 on which the electronic component is mounted is formed on the circuit board 1 and the magnetic member 3 is mounted on the resin layer 2 is shown.
  • the magnetic member 3 may be mounted on the surface of the circuit board 1 opposite to the component mounting surface. In this case, there is an advantage that it is not necessary to provide a through hole in the circuit board 1 and connect the component and the coil.
  • the insulating film of the conductor coil 4 is not limited to polyurethane, but may be a conductor wire coated with, for example, polyester, polyimide, polyamide, or the like, depending on the temperature applied during embedding in an article, such as resin injection molding.
  • a part or all of the base material of the circuit board 1 may be a magnetic material. If it is a magnetic body, since the circuit board 1 also functions as a part of the magnetic body core together with the magnetic body member 3, an effective coil opening becomes large.
  • the RFID tag is taken as an example in the embodiment described above, it can be similarly applied to a coil module having a coil having a large effective coil opening and a magnetic member.
  • the present invention can be applied to a communication module including a coil antenna and a high-frequency circuit connected to the coil antenna.
  • Capacitors (electronic components) L1, L2 ... inductor S1 ... first surface S2 ... second surface 1 ... circuit board 1M ... collective substrate 2 ... resin layer 2A ... resin layer 2B ... sealing resin 3 ... magnetic member 4 ... conductor coil 5 ... coating resin 10 ... Substrate 11 ... Conductor patterns 12A, 12B ... Terminal electrode 13 ... RFID-IC (electronic component) 43 ... Coil antennas 101, 102, 102C ... RFID tag 123 ... Laminate

Abstract

An RFID tag (101) is provided with: a circuit board (1) having a first surface (S1) and a second surface (S2) facing the first surface, a conductor pattern being formed on the circuit board (1); an electronic component mounted on the first surface (S1) of the circuit board (1), the electronic component constituting a module circuit with the conductor pattern; a resin layer (2) for sealing the electronic component; and a magnetic body member (3) overlapping on the first surface (S1) of the circuit board (1). A laminate (123) is constituted from the circuit board (1), the resin layer (2), and the magnetic body member (3), and a conductor coil (4) connected to the module circuit is wound in a direction bundling the laminate (123) around the laminate (123).

Description

コイルモジュールCoil module
　本発明は、コイルと、そのコイルに接続された回路とを備えるコイルモジュールに関する。 The present invention relates to a coil module including a coil and a circuit connected to the coil.
　従来、例えばＲＦＩＤタグは、絶縁セラミックス基板に矩形スパイラル状の平面コイルパターンが形成され、その基材に、ＲＦＩＤ用ＩＣチップ等が搭載されることで構成されている。コイルパターンは、そのコイル開口を極力大きくするために、基材の外周に沿って形成されるので、上記ＲＦＩＤ用ＩＣチップはコイル開口の内部に搭載される。 Conventionally, for example, an RFID tag is configured such that a rectangular spiral planar coil pattern is formed on an insulating ceramic substrate, and an RFID IC chip or the like is mounted on the base material. Since the coil pattern is formed along the outer periphery of the substrate in order to make the coil opening as large as possible, the IC chip for RFID is mounted inside the coil opening.
　また、金属ワイヤーのコイルを備えるＲＦＩＤタグは、例えば特許文献１に示されている。図７は特許文献１に示されているＲＦＩＤタグの構造を示す図である。図７において、ＲＦＩＤタグ９１は、コイル９２、絶縁物９３および金属板９４を備える。また、コイルのコアに共振用のコンデンサ９６およびＲＦＩＤ用ＩＣ９７が搭載されている。 Further, an RFID tag including a metal wire coil is disclosed in Patent Document 1, for example. FIG. 7 is a diagram showing the structure of the RFID tag disclosed in Patent Document 1. In FIG. In FIG. 7, the RFID tag 91 includes a coil 92, an insulator 93, and a metal plate 94. A resonance capacitor 96 and an RFID IC 97 are mounted on the core of the coil.
特開２００５－１９２１２４号公報JP 2005-192124 A
　上記平面コイルパターンを備えるＲＦＩＤタグにおいては、ＲＦＩＤ用ＩＣやその他のチップ部品はコイル開口内に配置されるので、ＲＦＩＤ用ＩＣ等の部品はコイル開口を通過する磁束を部分的に遮蔽する。そのため、基材に形成されている平面コイルパターンのコイル開口より実効的なコイル開口は小さい。また、上記金属ワイヤーが巻回されたＲＦＩＤタグにおいては、コイルはコア（芯）に巻回されているだけであるので、タグ全体のサイズに比べてコイル開口は比較的小さい。したがって、いずれも、ＲＦＩＤタグとしての読み取り可能距離が制限を受ける構造であった。 In the RFID tag having the planar coil pattern, since the RFID IC and other chip parts are arranged in the coil opening, the parts such as the RFID IC partially shield the magnetic flux passing through the coil opening. Therefore, the effective coil opening is smaller than the coil opening of the planar coil pattern formed on the substrate. Further, in the RFID tag around which the metal wire is wound, the coil is only wound around the core, so that the coil opening is relatively small as compared with the size of the entire tag. Therefore, both of them have a structure in which the readable distance as an RFID tag is limited.
　上述の課題はＲＦＩＤタグに限らず、コイルとそれに接続されたモジュール用回路とを備えるコイルモジュールに共通の課題である。 The above-mentioned problem is not limited to the RFID tag but is common to a coil module including a coil and a module circuit connected to the coil.
　本発明の目的は、全体のサイズの割には実効的なコイル開口を大きくして、結合相手のコイルとの結合係数を高めることのできる、コイルモジュールを提供することにある。 An object of the present invention is to provide a coil module capable of increasing the effective coil opening for the entire size and increasing the coupling coefficient with the coupling partner coil.
（１）本発明のコイルモジュールは、
　第１面と当該第１面に対向する第２面を有し、導体パターンが形成された回路基板と、
　前記回路基板の第１面に実装され、前記導体パターンとでモジュール用回路を構成する電子部品と、
　前記電子部品を封止する樹脂層と、
　前記第１面に垂直な方向から視て、前記回路基板の第１面に重なる磁性体部材と、を備え、
　前記回路基板、前記樹脂層および前記磁性体部材による積層体の周囲に、前記積層体を束ねる方向に巻回され、前記モジュール用回路に接続された導体コイルと、
　を備えることを特徴とする。 (1) The coil module of the present invention includes:
A circuit board having a first surface and a second surface facing the first surface, the conductor pattern being formed;
An electronic component mounted on the first surface of the circuit board and constituting a module circuit with the conductor pattern;
A resin layer for sealing the electronic component;
A magnetic member that overlaps the first surface of the circuit board as viewed from a direction perpendicular to the first surface,
A conductor coil wound around the laminate of the circuit board, the resin layer, and the magnetic member in a direction in which the laminate is bundled, and connected to the module circuit;
It is characterized by providing.
　上記構成により、回路基板、この回路基板に実装された電子部品を封止する樹脂層および磁性体部材による積層体の全体に導体コイルが巻回されるので、全体のサイズの割には実効的なコイル開口の大きなコイルを有するコイルモジュールが得られる。 With the above configuration, the conductor coil is wound around the entire laminate of the circuit board, the resin layer that seals the electronic components mounted on the circuit board, and the magnetic member, so that it is effective for the overall size. A coil module having a coil with a large coil opening can be obtained.
（２）上記（１）において、前記第１面に垂直な方向から視て、前記回路基板は矩形状であり、且つ、前記磁性体部材は矩形状であることが好ましい。これにより、回路基板、樹脂層および磁性体部材による積層体の外形形状は単純化され、導体コイルの巻回が容易となる。 (2) In the above (1), it is preferable that the circuit board has a rectangular shape and the magnetic body member has a rectangular shape when viewed from a direction perpendicular to the first surface. Thereby, the external shape of the laminated body by a circuit board, a resin layer, and a magnetic body member is simplified, and winding of a conductor coil becomes easy.
（３）上記（１）または（２）において、前記回路基板の第１面に重なる前記磁性体部材の面は前記第１面と略同形状であることが好ましい。これにより、回路基板、樹脂層および磁性体部材による積層体の外形形状は単純化され、導体コイルの巻回が容易となる。 (3) In the above (1) or (2), it is preferable that the surface of the magnetic member overlapping the first surface of the circuit board has substantially the same shape as the first surface. Thereby, the external shape of the laminated body by a circuit board, a resin layer, and a magnetic body member is simplified, and winding of a conductor coil becomes easy.
（４）上記（１）から（３）のいずれかにおいて、前記導体コイルは絶縁皮膜を有するCu線であることが好ましい。これにより、導体コイルを極近接して巻回、または重ねて巻回することができ、そのことで、自己誘導インダクタンスを大きくでき、少ないターン数で所定のインダクタンスを得ることができる。 (4) In any one of (1) to (3), the conductor coil is preferably a Cu wire having an insulating film. As a result, the conductor coil can be wound in close proximity, or can be wound in an overlapping manner, whereby the self-inductance inductance can be increased and a predetermined inductance can be obtained with a small number of turns.
（５）上記（１）から（４）のいずれかにおいて、前記電子部品は前記回路基板の第１面に実装され、前記導体パターンは、前記回路基板の第２面に形成された端子電極を含み、前記導体コイルの両端は前記端子電極に接続されることが好ましい。この構造により、モジュール用回路に対する導体コイルの接続および巻回が容易となる。 (5) In any one of (1) to (4), the electronic component is mounted on a first surface of the circuit board, and the conductor pattern includes a terminal electrode formed on the second surface of the circuit board. Preferably, both ends of the conductor coil are connected to the terminal electrode. This structure facilitates connection and winding of the conductor coil to the module circuit.
（６）上記（１）から（５）のいずれかにおいて、例えば、前記導体コイルと前記磁性体部材とでコイルアンテナが構成され、前記電子部品は前記コイルアンテナに接続されるＲＦＩＤ用ＩＣを含む。これにより、小型でありながら通信可能距離の大きなＲＦＩＤタグが構成される。 (6) In any one of the above (1) to (5), for example, a coil antenna is constituted by the conductor coil and the magnetic member, and the electronic component includes an RFID IC connected to the coil antenna. . As a result, a small RFID tag having a large communicable distance is configured.
　本発明によれば、回路基板、この回路基板に実装された電子部品を封止する樹脂層および磁性体部材による積層体の全体に導体コイルが巻回されるので、全体のサイズの割には実効的なコイル開口の大きなコイルを有するコイルモジュールが得られる。 According to the present invention, the conductor coil is wound around the entire laminate of the circuit board, the resin layer that seals the electronic component mounted on the circuit board, and the magnetic material member. A coil module having a coil with a large effective coil opening is obtained.
図１は第１の実施形態に係るコイルモジュールの一例としてのＲＦＩＤタグ１０１の四面図である。FIG. 1 is a four-side view of an RFID tag 101 as an example of a coil module according to the first embodiment. 図２はＲＦＩＤタグ１０１が備える回路基板の二面図である。FIG. 2 is a two-side view of a circuit board provided in the RFID tag 101. 図３はＲＦＩＤタグ１０１の回路および通信相手側アンテナの回路を示す図である。FIG. 3 is a diagram showing a circuit of the RFID tag 101 and a circuit of the communication partner antenna. 図４は集合基板１Ｍの各回路形成領域にそれぞれ個別の磁性体部材３を搭載した状態での部分平面図である。FIG. 4 is a partial plan view in a state in which individual magnetic members 3 are mounted in each circuit formation region of the collective substrate 1M. 図５は第２の実施形態に係るコイルモジュールの一例としてのＲＦＩＤタグ１０２の四面図である。FIG. 5 is a four-side view of an RFID tag 102 as an example of a coil module according to the second embodiment. 図６は、ＲＦＩＤタグ１０２の周囲に樹脂コーティングを施した状態のＲＦＩＤタグ１０２Ｃの四面図である。FIG. 6 is a four-sided view of the RFID tag 102 </ b> C in a state where a resin coating is applied around the RFID tag 102. 図７は特許文献１に示されているＲＦＩＤタグの構造を示す図である。FIG. 7 is a diagram showing the structure of the RFID tag disclosed in Patent Document 1. In FIG.
　以降、図を参照して幾つかの具体的な例を挙げて、本発明を実施するための複数の形態を示す。各図中には同一箇所に同一符号を付している。要点の説明または理解の容易性を考慮して、便宜上実施形態を分けて示すが、異なる実施形態で示した構成の部分的な置換または組み合わせは可能である。第２の実施形態以降では第１の実施形態と共通の事柄についての記述を省略し、異なる点についてのみ説明する。特に、同様の構成による同様の作用効果については実施形態毎には逐次言及しない。 Hereinafter, several specific examples will be given with reference to the drawings to show a plurality of modes for carrying out the present invention. In each figure, the same reference numerals are assigned to the same portions. In consideration of ease of explanation or understanding of the main points, the embodiments are shown separately for convenience, but partial replacement or combination of configurations shown in different embodiments is possible. In the second and subsequent embodiments, description of matters common to the first embodiment is omitted, and only different points will be described. In particular, the same operation effect by the same configuration will not be sequentially described for each embodiment.
　以降に示す各実施形態に示す「コイルモジュール」は、通信相手側アンテナ装置と磁界結合を用いた、例えばＮＦＣ（Near field communication）等の近傍界通信のために用いられる。 The “coil module” shown in the following embodiments is used for near-field communication such as NFC (Near Field Communication) using magnetic field coupling with the communication partner antenna device.
《第１の実施形態》
　図１は第１の実施形態に係るコイルモジュールの一例としてのＲＦＩＤタグ１０１の四面図である。図２はＲＦＩＤタグ１０１が備える回路基板の二面図である。 << First Embodiment >>
FIG. 1 is a four-side view of an RFID tag 101 as an example of a coil module according to the first embodiment. FIG. 2 is a two-side view of a circuit board provided in the RFID tag 101.
　図１に表れているように、ＲＦＩＤタグ１０１は、回路基板１、樹脂層２および磁性体部材３を備える。 As shown in FIG. 1, the RFID tag 101 includes a circuit board 1, a resin layer 2, and a magnetic member 3.
　回路基板１は、図２に表れているように、基材１０、基材１０に形成された導体パターン、およびその導体パターンに接続された電子部品を備える。回路基板１は例えばガラス・エポキシ基板である。上記導体パターンおよび電子部品によってモジュール用回路が構成されている。具体的には、回路基板１の第１面Ｓ１に導体パターン１１が形成され、電子部品１３，Ｃ２Ａ，Ｃ２Ｂ等が実装されている。この回路基板の導体パターンへの電子部品の接合は、例えばはんだ接合やＡｕ－Ａｕ接合である。回路基板１の、第１面Ｓ１に対向する第２面Ｓ２には、導体パターンの一部である端子電極１２Ａ，１２Ｂが形成されている。 As shown in FIG. 2, the circuit board 1 includes a base material 10, a conductor pattern formed on the base material 10, and an electronic component connected to the conductor pattern. The circuit board 1 is, for example, a glass / epoxy board. A module circuit is constituted by the conductor pattern and the electronic component. Specifically, the conductor pattern 11 is formed on the first surface S1 of the circuit board 1, and the electronic components 13, C2A, C2B, and the like are mounted. The joining of the electronic component to the conductor pattern of the circuit board is, for example, solder joining or Au—Au joining. Terminal electrodes 12A and 12B, which are part of the conductor pattern, are formed on the second surface S2 of the circuit board 1 that faces the first surface S1.
　磁性体部材３は直方体状の磁性フェライトで構成されている。磁性体部材３は、樹脂層２を介して回路基板１の第１面Ｓ１に重なる面が当該第１面Ｓ１と略同形状である。「略同一形状」とは、例えば、第１面Ｓ１に垂直な方向から視て、回路基板１の面積が磁性体部材３の面積の９０％以上１００％以下のこと、例えば、第１面Ｓ１に垂直な方向から視て、回路基板１が磁性体部材３と相似形であること、例えば、第１面Ｓ１に垂直な方向から視て、回路基板１および磁性体部材３はいずれも矩形状であること、等である。 The magnetic member 3 is composed of a rectangular parallelepiped magnetic ferrite. The surface of the magnetic member 3 that overlaps the first surface S1 of the circuit board 1 through the resin layer 2 has substantially the same shape as the first surface S1. “Substantially the same shape” means, for example, that the area of the circuit board 1 is 90% or more and 100% or less of the area of the magnetic member 3 when viewed from the direction perpendicular to the first surface S1, for example, the first surface S1. The circuit board 1 is similar to the magnetic member 3 when viewed from the direction perpendicular to the direction, for example, the circuit board 1 and the magnetic member 3 are both rectangular when viewed from the direction perpendicular to the first surface S1. And so on.
　図１に表れているように、回路基板１に実装されている電子部品は、例えばエポキシ樹脂等の熱硬化性樹脂による樹脂層２で封止されている。回路基板１、樹脂層２および磁性体部材３によって、積層体１２３が構成されている。この積層体１２３の周囲に、積層体１２３を束ねる方向に導体コイル４が巻回されている。この導体コイル４はポリウレタン皮膜を有するＣｕ線（ポリウレタンが被覆されたＣｕ線）である。導体コイル４は、この例では約１１ターン巻回されている。導体コイル４と磁性体部材３とでコイルアンテナ４３が構成される。 As shown in FIG. 1, the electronic component mounted on the circuit board 1 is sealed with a resin layer 2 made of a thermosetting resin such as an epoxy resin. The circuit board 1, the resin layer 2, and the magnetic member 3 constitute a laminated body 123. The conductor coil 4 is wound around the multilayer body 123 in a direction in which the multilayer body 123 is bundled. The conductor coil 4 is a Cu wire having a polyurethane film (a Cu wire coated with polyurethane). The conductor coil 4 is wound about 11 turns in this example. A coil antenna 43 is constituted by the conductor coil 4 and the magnetic member 3.
　上記導体コイル４の両端は端子電極１２Ａ，１２Ｂに接続されている。端子電極１２Ａ，１２Ｂは例えばＣｕ電極パターンであり、導体コイルの芯材であるＣｕとで、Ｃｕ－Ｃｕ溶接される。これにより、導体コイル４は上記モジュール用回路に接続される。 Both ends of the conductor coil 4 are connected to the terminal electrodes 12A and 12B. The terminal electrodes 12A and 12B are Cu electrode patterns, for example, and are Cu—Cu welded with Cu which is a core material of the conductor coil. Thereby, the conductor coil 4 is connected to the module circuit.
　上記磁性体部材３は導体コイル４の磁芯として作用する。図１において磁束φは磁性体部材３を通過する磁束を概略的に表している。 The magnetic member 3 acts as a magnetic core of the conductor coil 4. In FIG. 1, the magnetic flux φ schematically represents the magnetic flux passing through the magnetic member 3.
　本実施形態によれば、導体コイル４のコイル開口内に電子部品や導体パターンが存在し、これらが磁束を部分的に遮蔽するが、コイル開口は、図１に示すように、高さＨ、幅Ｗであり、磁性体部材３の断面より大きい。すなわち、磁性体部材３の断面積以上のコイル開口は確保される。例えばW=2.3mm、H=5mmである。このように、外形サイズの割に大きなコイル開口のコイルを備えるため、結合相手のコイルとの結合係数の高いＲＦＩＤタグが得られる。 According to the present embodiment, there are electronic components and conductor patterns in the coil opening of the conductor coil 4, which partially shield the magnetic flux, but the coil opening has a height H, as shown in FIG. The width W is larger than the cross section of the magnetic member 3. That is, a coil opening larger than the cross-sectional area of the magnetic member 3 is ensured. For example, W = 2.3 mm and H = 5 mm. As described above, since the coil having a large coil opening is provided for the outer size, an RFID tag having a high coupling coefficient with the coupling partner coil can be obtained.
　また、導体コイル４を極近接して巻回、または重ねて巻回することができ、そのことで、自己誘導インダクタンスを大きくでき、少ないターン数で所定のインダクタンスを得ることができる。 Also, the conductor coil 4 can be wound in close proximity or wound in an overlapping manner, whereby the self-inductance inductance can be increased and a predetermined inductance can be obtained with a small number of turns.
　また、本実施形態によれば、回路基板１および磁性体部材３を変更することなく、導体コイル４の巻回数または導体間隔を容易に調整・設定できるので、所定のインダクタンスを有するコイルアンテナ４３を有するＲＦＩＤタグ１０１が得られる。 In addition, according to the present embodiment, the number of turns or the conductor interval of the conductor coil 4 can be easily adjusted and set without changing the circuit board 1 and the magnetic member 3, so that the coil antenna 43 having a predetermined inductance is provided. The RFID tag 101 is obtained.
　図３はＲＦＩＤタグ１０１の回路および通信相手側アンテナの回路を示す図である。図３において、インダクタＬ１は導体コイル４および磁性体部材３に対応する。ＲＦＩＤ－ＩＣ１３、キャパシタＣ１Ａ，Ｃ１Ｂ，Ｃ２Ａ，Ｃ２Ｂは回路基板１に実装されている電子部品である。 FIG. 3 is a diagram showing a circuit of the RFID tag 101 and a circuit of the communication partner antenna. In FIG. 3, the inductor L1 corresponds to the conductor coil 4 and the magnetic member 3. The RFID-IC 13 and the capacitors C1A, C1B, C2A, C2B are electronic components mounted on the circuit board 1.
　キャパシタＣ１Ａ，Ｃ１Ｂ，Ｃ２Ａ，Ｃ２ＢおよびインダクタＬ１は、ＬＣ共振回路を構成するとともに、ＲＦＩＤ－ＩＣ１３とのインピーダンス整合回路を構成している。このＬＣ共振回路の共振周波数帯は、通信に利用される周波数帯である。例えばＮＦＣの場合、13.56MHzまたはその近傍の周波数である。 The capacitors C1A, C1B, C2A, C2B and the inductor L1 constitute an LC resonance circuit and an impedance matching circuit with the RFID-IC13. The resonance frequency band of this LC resonance circuit is a frequency band used for communication. For example, in the case of NFC, it is 13.56 MHz or a frequency in the vicinity thereof.
　インダクタＬ２は通信相手側のコイルアンテナを集中定数回路として表した素子である。インダクタＬ２にはリーダ・ライター回路が接続されている。ＲＦＩＤタグ１０１の導体コイル４によるインダクタＬ１と通信相手側アンテナのインダクタＬ２とは磁界結合する。 The inductor L2 is an element that represents the coil antenna on the communication partner side as a lumped constant circuit. A reader / writer circuit is connected to the inductor L2. The inductor L1 by the conductor coil 4 of the RFID tag 101 and the inductor L2 of the communication partner antenna are magnetically coupled.
　次に、本実施形態のＲＦＩＤタグ１０１の製造方法の一例を示す。図４は集合基板１Ｍの各回路形成領域にそれぞれ個別の磁性体部材３を搭載した状態での部分平面図である。集合基板１Ｍは図２に示した回路基板１（個片）への分離前の状態である。 Next, an example of a method for manufacturing the RFID tag 101 of this embodiment will be described. FIG. 4 is a partial plan view in a state in which individual magnetic members 3 are mounted in each circuit formation region of the collective substrate 1M. The collective board 1M is in a state before being separated into the circuit boards 1 (pieces) shown in FIG.
　ＲＦＩＤタグ１０１は次の手順で製造する。 The RFID tag 101 is manufactured by the following procedure.
（１）先ず、図４に示す集合基板１Ｍの各回路形成領域に導体パターンを形成し、各回路形成領域に電子部品を実装する。 (1) First, a conductor pattern is formed in each circuit formation region of the collective substrate 1M shown in FIG. 4, and an electronic component is mounted in each circuit formation region.
（２）集合基板１Ｍの電子部品実装面に、例えばエポキシ樹脂等の封止樹脂を塗布し、真空脱泡することで、集合基板１Ｍと電子部品との間（電子部品の下面の間隙）にアンダーフィルを形成する。 (2) A sealing resin such as an epoxy resin is applied to the electronic component mounting surface of the collective substrate 1M, and vacuum degassing is performed between the collective substrate 1M and the electronic component (gap on the lower surface of the electronic component). Underfill is formed.
（３）複数の磁性体部材３を位置決めした状態に配置し、転写シートに転写した後、磁性体部材３を集合基板１Ｍ上に一括搭載する。 (3) The plurality of magnetic members 3 are arranged in a positioned state, transferred to a transfer sheet, and then the magnetic members 3 are collectively mounted on the collective substrate 1M.
（４）上記封止樹脂を硬化させることによって、集合基板１Ｍに複数の磁性体部材３を搭載した状態で固定する。 (4) By fixing the sealing resin, the plurality of magnetic members 3 are fixed on the collective substrate 1M.
（５）集合基板１Ｍを、磁性体部材３の搭載面とは反対面側から、または磁性体部材３の搭載面側から、ダイサーで切削し、個片に分割する。これにより、複数の積層体１２３を得る。図４において縦横に延びる破線はダイサーによる切削線である。 (5) The collective substrate 1M is cut by a dicer from the surface opposite to the mounting surface of the magnetic member 3 or from the mounting surface side of the magnetic member 3, and divided into individual pieces. Thereby, the some laminated body 123 is obtained. In FIG. 4, a broken line extending vertically and horizontally is a cutting line by a dicer.
（６）コイル巻回マシンを用いて、各積層体１２３に絶縁被覆Ｃｕ線を巻回することによって、導体コイル４を形成する。このコイル巻回マシンには、チップ状の巻線インダクタを製造する巻回マシンを利用できる。 (6) Using a coil winding machine, the conductor coil 4 is formed by winding an insulation coating Cu wire around each laminated body 123. As this coil winding machine, a winding machine for manufacturing a chip-shaped winding inductor can be used.
（７）その後、必要に応じて、図１に示したＲＦＩＤタグ１０１を液状樹脂に浸漬し、引き上げ、加熱硬化させることによって、ＲＦＩＤタグ１０１の周囲に樹脂コーティングを施す。 (7) Thereafter, if necessary, the RFID tag 101 shown in FIG. 1 is dipped in a liquid resin, pulled up, and cured by heating to apply a resin coating around the RFID tag 101.
　以上の手順によってＲＦＩＤタグ１０１を製造する。なお、完成したＲＦＩＤタグ１０１は、例えば玩具等の物品に装着する。物品が樹脂成形品である場合には、樹脂の射出成型時に、その樹脂中にＲＦＩＤタグ１０１が埋設されるようにＲＦＩＤタグ１０１を物品に一体化させる。 The RFID tag 101 is manufactured by the above procedure. The completed RFID tag 101 is attached to an article such as a toy, for example. When the article is a resin molded product, the RFID tag 101 is integrated with the article so that the RFID tag 101 is embedded in the resin during injection molding of the resin.
《第２の実施形態》
　第２の実施形態では、樹脂層の構成が第１の実施形態とは異なる例を示す。 << Second Embodiment >>
In the second embodiment, an example in which the configuration of the resin layer is different from that of the first embodiment is shown.
　図５は第２の実施形態に係るコイルモジュールの一例としてのＲＦＩＤタグ１０２の四面図である。 FIG. 5 is a four-side view of an RFID tag 102 as an example of a coil module according to the second embodiment.
　図５に表れているように、ＲＦＩＤタグ１０２は、回路基板１、樹脂層２および磁性体部材３を備える。回路基板１、磁性体部材３、導体コイル４の構成は第１の実施形態で示したＲＦＩＤタグ１０１と同様である。 As shown in FIG. 5, the RFID tag 102 includes a circuit board 1, a resin layer 2, and a magnetic member 3. The configurations of the circuit board 1, the magnetic member 3, and the conductor coil 4 are the same as those of the RFID tag 101 shown in the first embodiment.
　本実施形態では、回路基板１に実装された電子部品は先ず樹脂層２Ａで封止される。この樹脂層２Ａは磁性体部材３が搭載される前に硬化される。その後、樹脂層２Ａの表面を含む回路基板１の上面、または磁性体部材３の下面に、封止樹脂２Ｂを塗布し、回路基板１上に磁性体部材３を積層し、封止樹脂２Ｂを硬化させる。これにより積層体１２３を構成する。 In the present embodiment, the electronic component mounted on the circuit board 1 is first sealed with the resin layer 2A. The resin layer 2A is cured before the magnetic member 3 is mounted. Thereafter, the sealing resin 2B is applied to the upper surface of the circuit board 1 including the surface of the resin layer 2A or the lower surface of the magnetic body member 3, the magnetic body member 3 is laminated on the circuit board 1, and the sealing resin 2B is applied. Harden. Thereby, the laminated body 123 is comprised.
　図６は、上記ＲＦＩＤタグ１０２の周囲に樹脂コーティングを施した状態のＲＦＩＤタグ１０２Ｃの四面図である。図６に表れているように、ＲＦＩＤタグ１０２の外面（六面）に被覆樹脂５が被覆されている。この被覆樹脂５は、図５に示したＲＦＩＤタグ１０２を液状樹脂に浸漬し、引き上げ、加熱硬化させることによって形成する。 FIG. 6 is a four-side view of the RFID tag 102C in a state in which a resin coating is applied around the RFID tag 102. As shown in FIG. 6, the coating resin 5 is coated on the outer surface (six surfaces) of the RFID tag 102. The coating resin 5 is formed by immersing the RFID tag 102 shown in FIG. 5 in a liquid resin, pulling it up, and curing it by heating.
《その他の実施形態》
　以上に示した各実施形態では、直方体形状の磁性体部材３を搭載した例を示したが、磁性体部材３は導体コイルの巻回軸に直交する面での断面形状が曲線または直線と曲線で構成される形状であってもよい。例えば円柱状であってもよい。また、回路基板に対面する面が平面である「かまぼこ形状」であってもよい。 << Other Embodiments >>
In each of the embodiments described above, the example in which the rectangular parallelepiped magnetic member 3 is mounted has been described. However, the magnetic member 3 has a curved cross section or a straight line and a curved line in a plane perpendicular to the winding axis of the conductor coil. The shape comprised by may be sufficient. For example, it may be cylindrical. Further, a “kamaboko shape” in which the surface facing the circuit board is a flat surface may be used.
　また、上記の実施形態では、回路基板１の上に、電子部品が実装される樹脂層２が形成され、樹脂層２の上に磁性体部材３が搭載されている構成例を示した。本発明においては、回路基板１の部品実装面とは反対側の面に磁性体部材３が搭載されていてもよい。この場合、回路基板１にスルーホールを設けて部品とコイルとを接続する必要がないという利点がある。 In the above embodiment, the configuration example in which the resin layer 2 on which the electronic component is mounted is formed on the circuit board 1 and the magnetic member 3 is mounted on the resin layer 2 is shown. In the present invention, the magnetic member 3 may be mounted on the surface of the circuit board 1 opposite to the component mounting surface. In this case, there is an advantage that it is not necessary to provide a through hole in the circuit board 1 and connect the component and the coil.
　導体コイル４の絶縁皮膜はポリウレタンに限らず、樹脂の射出成型等、物品への埋設時に加わる温度に応じて、例えばポリエステル、ポリイミド、ポリアミド等で被覆された導体線であってもよい。 The insulating film of the conductor coil 4 is not limited to polyurethane, but may be a conductor wire coated with, for example, polyester, polyimide, polyamide, or the like, depending on the temperature applied during embedding in an article, such as resin injection molding.
　回路基板１の基材の一部または全部は磁性体であってもよい。磁性体であれば、磁性体部材３と共に、回路基板１も磁性体コアの一部として作用するので、実効的なコイル開口が大きくなる。 A part or all of the base material of the circuit board 1 may be a magnetic material. If it is a magnetic body, since the circuit board 1 also functions as a part of the magnetic body core together with the magnetic body member 3, an effective coil opening becomes large.
　また、以上に示した例では、コイル導体を単層巻きした例を挙げたが、複数層に重ね巻きすることも可能であり、そのことで、小型でありながら所定の高いインダクタンスを有するコイルアンテナが構成できる。 Moreover, in the example shown above, although the example which wound the coil conductor in the single layer was given, it is also possible to overlap and wind in a plurality of layers, so that the coil antenna having a predetermined high inductance while being small in size. Can be configured.
　さらに、以上に示した実施形態ではＲＦＩＤタグを例に挙げたが、実効的なコイル開口が大きなコイルおよび磁性体部材を有するコイルモジュールに同様に適用できる。例えばコイルアンテナとそのコイルアンテナに接続される高周波回路を備える通信モジュールにも適用できる。 Furthermore, although the RFID tag is taken as an example in the embodiment described above, it can be similarly applied to a coil module having a coil having a large effective coil opening and a magnetic member. For example, the present invention can be applied to a communication module including a coil antenna and a high-frequency circuit connected to the coil antenna.
　最後に、上述の実施形態の説明は、すべての点で例示であって、制限的なものではない。当業者にとって変形および変更が適宜可能である。本発明の範囲は、上述の実施形態ではなく、特許請求の範囲によって示される。さらに、本発明の範囲には、特許請求の範囲内と均等の範囲内での実施形態からの変更が含まれる。 Finally, the description of the above embodiment is illustrative in all respects and not restrictive. Modifications and changes can be made as appropriate by those skilled in the art. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention includes modifications from the embodiments within the scope equivalent to the claims.
Ｃ１Ａ，Ｃ１Ｂ，Ｃ２Ａ，Ｃ２Ｂ…キャパシタ（電子部品）
Ｌ１，Ｌ２…インダクタ
Ｓ１…第１面
Ｓ２…第２面
１…回路基板
１Ｍ…集合基板
２…樹脂層
２Ａ…樹脂層
２Ｂ…封止樹脂
３…磁性体部材
４…導体コイル
５…被覆樹脂
１０…基材
１１…導体パターン
１２Ａ，１２Ｂ…端子電極
１３…ＲＦＩＤ－ＩＣ（電子部品）
４３…コイルアンテナ
１０１，１０２，１０２Ｃ…ＲＦＩＤタグ
１２３…積層体 C1A, C1B, C2A, C2B ... Capacitors (electronic components)
L1, L2 ... inductor S1 ... first surface S2 ... second surface 1 ... circuit board 1M ... collective substrate 2 ... resin layer 2A ... resin layer 2B ... sealing resin 3 ... magnetic member 4 ... conductor coil 5 ... coating resin 10 ... Substrate 11 ... Conductor patterns 12A, 12B ... Terminal electrode 13 ... RFID-IC (electronic component)
43 ... Coil antennas 101, 102, 102C ... RFID tag 123 ... Laminate

Claims (6)

  1. 　第１面と当該第１面に対向する第２面を有し、導体パターンが形成された回路基板と、
    　前記回路基板の前記第１面に実装され、前記導体パターンとでモジュール用回路を構成する電子部品と、
    　前記電子部品を封止する樹脂層と、
    　前記第１面に垂直な方向から視て、前記回路基板の前記第１面に重なる磁性体部材と、を備え、
    　前記回路基板、前記樹脂層および前記磁性体部材による積層体の周囲に、前記積層体を束ねる方向に巻回され、前記モジュール用回路に接続された導体コイルと、
    　を備える、コイルモジュール。     A circuit board having a first surface and a second surface facing the first surface, the conductor pattern being formed;
    An electronic component mounted on the first surface of the circuit board and constituting a module circuit with the conductor pattern;
    A resin layer for sealing the electronic component;
    A magnetic member that overlaps the first surface of the circuit board as viewed from a direction perpendicular to the first surface,
    A conductor coil wound around the laminate of the circuit board, the resin layer, and the magnetic member in a direction in which the laminate is bundled, and connected to the module circuit;
    A coil module comprising:
  2. 　前記第１面に垂直な方向から視て、前記回路基板は矩形状であり、且つ、前記磁性体部材は矩形状である、請求項１に記載のコイルモジュール。 The coil module according to claim 1, wherein the circuit board has a rectangular shape and the magnetic member has a rectangular shape when viewed from a direction perpendicular to the first surface.
  3. 　前記回路基板の前記第１面に重なる前記磁性体部材の面は前記第１面と略同形状である、請求項１または２に記載のコイルモジュール。 The coil module according to claim 1 or 2, wherein the surface of the magnetic member that overlaps the first surface of the circuit board has substantially the same shape as the first surface.
  4. 　前記導体コイルは絶縁皮膜を有するCu線である、請求項１から３のいずれかに記載のコイルモジュール。 The coil module according to any one of claims 1 to 3, wherein the conductor coil is a Cu wire having an insulating film.
  5. 　前記電子部品は前記回路基板の前記第１面に実装され、
    　前記導体パターンは、前記回路基板の第２面に形成された端子電極を含み、
    　前記導体コイルの両端は前記端子電極に接続される、請求項１から４のいずれかに記載のコイルモジュール。     The electronic component is mounted on the first surface of the circuit board;
    The conductor pattern includes a terminal electrode formed on the second surface of the circuit board,
    The coil module according to claim 1, wherein both ends of the conductor coil are connected to the terminal electrode.
  6. 　前記導体コイルと前記磁性体部材とでコイルアンテナが構成され、前記電子部品は前記コイルアンテナに接続されるＲＦＩＤ用ＩＣを含む、請求項１から５のいずれかに記載のコイルモジュール。 The coil module according to any one of claims 1 to 5, wherein a coil antenna is configured by the conductor coil and the magnetic member, and the electronic component includes an RFID IC connected to the coil antenna.
PCT/JP2017/008869 2016-03-18 2017-03-07 Coil module WO2017159436A1 (en)

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JP6562193B1 (en) * 2018-01-23 2019-08-21 株式会社村田製作所 RFID tag, article provided with RFID tag, and method of manufacturing article
WO2019202817A1 (en) * 2018-04-17 2019-10-24 株式会社村田製作所 Rfid tag
EP3767748A1 (en) 2019-07-17 2021-01-20 Aug. Winkhaus GmbH & Co. KG Identification means for locking system

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JP2002157565A (en) * 2000-07-19 2002-05-31 Hanex Co Ltd Structure and method for mounting rfid tag
US20060086804A1 (en) * 2002-04-01 2006-04-27 Toshiharu Takayama Communication device and package thereof
US20080309446A1 (en) * 2005-06-08 2008-12-18 Wulf Guenther Arrangement Comprising an Inductive Component
JP2016506102A (en) * 2012-11-15 2016-02-25 Smk株式会社 Non-stationary magnetic field emitter and its connection and data modulation method in a system
WO2016031408A1 (en) * 2014-08-27 2016-03-03 株式会社村田製作所 Coil antenna, wireless ic device, resin molded body, and coil antenna manufacturing method

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Publication number Priority date Publication date Assignee Title
JP2002157565A (en) * 2000-07-19 2002-05-31 Hanex Co Ltd Structure and method for mounting rfid tag
US20060086804A1 (en) * 2002-04-01 2006-04-27 Toshiharu Takayama Communication device and package thereof
US20080309446A1 (en) * 2005-06-08 2008-12-18 Wulf Guenther Arrangement Comprising an Inductive Component
JP2016506102A (en) * 2012-11-15 2016-02-25 Smk株式会社 Non-stationary magnetic field emitter and its connection and data modulation method in a system
WO2016031408A1 (en) * 2014-08-27 2016-03-03 株式会社村田製作所 Coil antenna, wireless ic device, resin molded body, and coil antenna manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6562193B1 (en) * 2018-01-23 2019-08-21 株式会社村田製作所 RFID tag, article provided with RFID tag, and method of manufacturing article
WO2019202817A1 (en) * 2018-04-17 2019-10-24 株式会社村田製作所 Rfid tag
EP3767748A1 (en) 2019-07-17 2021-01-20 Aug. Winkhaus GmbH & Co. KG Identification means for locking system

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