JPWO2020080350A1 - 硬化性シリコーン組成物及びその硬化物、積層体及びその製造方法、並びに光学装置又は光学ディスプレイ - Google Patents
硬化性シリコーン組成物及びその硬化物、積層体及びその製造方法、並びに光学装置又は光学ディスプレイ Download PDFInfo
- Publication number
- JPWO2020080350A1 JPWO2020080350A1 JP2020553187A JP2020553187A JPWO2020080350A1 JP WO2020080350 A1 JPWO2020080350 A1 JP WO2020080350A1 JP 2020553187 A JP2020553187 A JP 2020553187A JP 2020553187 A JP2020553187 A JP 2020553187A JP WO2020080350 A1 JPWO2020080350 A1 JP WO2020080350A1
- Authority
- JP
- Japan
- Prior art keywords
- curable silicone
- silicone composition
- composition
- optical
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 272
- 230000003287 optical effect Effects 0.000 title claims abstract description 216
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 151
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 71
- 239000003054 catalyst Substances 0.000 claims abstract description 56
- 125000003118 aryl group Chemical group 0.000 claims abstract description 29
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 28
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 23
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 21
- 125000000962 organic group Chemical group 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 41
- 239000000853 adhesive Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 38
- 150000001875 compounds Chemical class 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 230000000694 effects Effects 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 17
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 16
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 11
- 230000001678 irradiating effect Effects 0.000 claims description 10
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims description 10
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 9
- 229920000570 polyether Polymers 0.000 claims description 9
- 238000010894 electron beam technology Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 150000002894 organic compounds Chemical class 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- -1 polysiloxane Polymers 0.000 abstract description 47
- 239000000047 product Substances 0.000 description 92
- 238000001723 curing Methods 0.000 description 66
- 229920005989 resin Polymers 0.000 description 42
- 239000011347 resin Substances 0.000 description 42
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 28
- 239000010410 layer Substances 0.000 description 25
- 239000000758 substrate Substances 0.000 description 24
- 239000010408 film Substances 0.000 description 23
- 229910052697 platinum Inorganic materials 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- HRGDZIGMBDGFTC-UHFFFAOYSA-N platinum(2+) Chemical compound [Pt+2] HRGDZIGMBDGFTC-UHFFFAOYSA-N 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 description 7
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- 239000012788 optical film Substances 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 3
- 230000009975 flexible effect Effects 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000006038 hexenyl group Chemical group 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 125000003944 tolyl group Chemical group 0.000 description 3
- MHNNAWXXUZQSNM-UHFFFAOYSA-N 2-methylbut-1-ene Chemical compound CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- FALJXSPLMPMHEL-UHFFFAOYSA-N C[Pt](C)C Chemical compound C[Pt](C)C FALJXSPLMPMHEL-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- HEQDCEOZBRONNB-UHFFFAOYSA-N [dimethyl(2-trimethoxysilylethyl)silyl]oxy-dimethyl-(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](C)(C)O[Si](C)(C)CC[Si](OC)(OC)OC HEQDCEOZBRONNB-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000006606 n-butoxy group Chemical group 0.000 description 2
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 125000005920 sec-butoxy group Chemical group 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 description 2
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 2
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- KNDTWGMCUPQWPQ-UHFFFAOYSA-N 1-[diethoxy(methyl)silyl]ethyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)C(C)[Si](C)(OCC)OCC KNDTWGMCUPQWPQ-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- KUMMBDBTERQYCG-UHFFFAOYSA-N 2,6-bis(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CO)=C1 KUMMBDBTERQYCG-UHFFFAOYSA-N 0.000 description 1
- FEXBEKLLSUWSIM-UHFFFAOYSA-N 2-Butyl-4-methylphenol Chemical compound CCCCC1=CC(C)=CC=C1O FEXBEKLLSUWSIM-UHFFFAOYSA-N 0.000 description 1
- UTJOKVDTJFBVPH-UHFFFAOYSA-N 2-[diethoxy(methyl)silyl]ethyl-[2-[diethoxy(methyl)silyl]ethyl-dimethylsilyl]oxy-dimethylsilane Chemical compound CCO[Si](C)(OCC)CC[Si](C)(C)O[Si](C)(C)CC[Si](C)(OCC)OCC UTJOKVDTJFBVPH-UHFFFAOYSA-N 0.000 description 1
- KFGSXJLKKLOVNP-UHFFFAOYSA-N 2-[dimethoxy(methyl)silyl]ethyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CC[Si](C)(OC)OC KFGSXJLKKLOVNP-UHFFFAOYSA-N 0.000 description 1
- PBCCQGWBHTXOSW-UHFFFAOYSA-N 2-butyl-4-(hydroxymethyl)phenol Chemical compound CCCCC1=CC(CO)=CC=C1O PBCCQGWBHTXOSW-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NBTPLJIGKXRDCD-UHFFFAOYSA-N 4-[diethoxy(methyl)silyl]butyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)CCCC[Si](C)(OCC)OCC NBTPLJIGKXRDCD-UHFFFAOYSA-N 0.000 description 1
- SWIWVYUDWDVRPX-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]butyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCC[Si](C)(OC)OC SWIWVYUDWDVRPX-UHFFFAOYSA-N 0.000 description 1
- 125000000590 4-methylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- QIOCAKLWNDZXKH-UHFFFAOYSA-N 5-[diethoxy(methyl)silyl]pentyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)CCCCC[Si](C)(OCC)OCC QIOCAKLWNDZXKH-UHFFFAOYSA-N 0.000 description 1
- UBBNKENBCRDMOY-UHFFFAOYSA-N 5-[dimethoxy(methyl)silyl]pentyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCC[Si](C)(OC)OC UBBNKENBCRDMOY-UHFFFAOYSA-N 0.000 description 1
- PFGDZDUDTMKJHK-UHFFFAOYSA-N 6-[dimethoxy(methyl)silyl]hexyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCCC[Si](C)(OC)OC PFGDZDUDTMKJHK-UHFFFAOYSA-N 0.000 description 1
- XMJOCRXNMXIMSW-UHFFFAOYSA-N 8-[dimethoxy(methyl)silyl]octyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCCCCC[Si](C)(OC)OC XMJOCRXNMXIMSW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- DQEYHSVSMPJXLJ-UHFFFAOYSA-N C1(C=CC=C1)[Pt](CC)(C)C Chemical compound C1(C=CC=C1)[Pt](CC)(C)C DQEYHSVSMPJXLJ-UHFFFAOYSA-N 0.000 description 1
- PXTSDMMNNJFRNA-UHFFFAOYSA-N CC(=C[SiH2]O[Si](O[Si](O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C)C Chemical compound CC(=C[SiH2]O[Si](O[Si](O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C)C PXTSDMMNNJFRNA-UHFFFAOYSA-N 0.000 description 1
- BEKXPGRNVUOUEE-UHFFFAOYSA-N CC(C(=O)[Pt]C1C=CC=C1)C Chemical compound CC(C(=O)[Pt]C1C=CC=C1)C BEKXPGRNVUOUEE-UHFFFAOYSA-N 0.000 description 1
- XVERKWJDUIFVRN-UHFFFAOYSA-N CC1=C(C(C=C1)([SiH2]C1=CC=CC=C1)C1(C=CC=C1)[Pt](C)(C)C)C Chemical compound CC1=C(C(C=C1)([SiH2]C1=CC=CC=C1)C1(C=CC=C1)[Pt](C)(C)C)C XVERKWJDUIFVRN-UHFFFAOYSA-N 0.000 description 1
- YGBYJRVGNBVTCQ-UHFFFAOYSA-N C[Pt](C)C.[CH]1C=CC=C1 Chemical compound C[Pt](C)C.[CH]1C=CC=C1 YGBYJRVGNBVTCQ-UHFFFAOYSA-N 0.000 description 1
- DODHYCGLWKOXCD-UHFFFAOYSA-N C[Pt](C1(C=CC=C1)C)(C)C Chemical compound C[Pt](C1(C=CC=C1)C)(C)C DODHYCGLWKOXCD-UHFFFAOYSA-N 0.000 description 1
- BPMGYFSWCJZSBA-UHFFFAOYSA-N C[SiH](C)O[SiH3] Chemical compound C[SiH](C)O[SiH3] BPMGYFSWCJZSBA-UHFFFAOYSA-N 0.000 description 1
- XZXJVONANSQPKV-UHFFFAOYSA-N C[Si](C)(C)C1(C=CC=C1)[Pt](C)(C)C Chemical compound C[Si](C)(C)C1(C=CC=C1)[Pt](C)(C)C XZXJVONANSQPKV-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 229910003849 O-Si Inorganic materials 0.000 description 1
- 229910003872 O—Si Inorganic materials 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- YTEISYFNYGDBRV-UHFFFAOYSA-N [(dimethyl-$l^{3}-silanyl)oxy-dimethylsilyl]oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)(C)O[Si](C)C YTEISYFNYGDBRV-UHFFFAOYSA-N 0.000 description 1
- BGISVIDNIBCUTN-UHFFFAOYSA-N [bis[(dimethyl-$l^{3}-silanyl)oxy]-methylsilyl]oxy-dimethylsilicon Chemical group C[Si](C)O[Si](C)(O[Si](C)C)O[Si](C)C BGISVIDNIBCUTN-UHFFFAOYSA-N 0.000 description 1
- JQCCEDUTYZNWDO-UHFFFAOYSA-N [dimethyl(2-triethoxysilylethyl)silyl]oxy-dimethyl-(2-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC[Si](C)(C)O[Si](C)(C)CC[Si](OCC)(OCC)OCC JQCCEDUTYZNWDO-UHFFFAOYSA-N 0.000 description 1
- PPGFUNOEXFJQKD-UHFFFAOYSA-N [dimethyl(6-triethoxysilylhexyl)silyl]oxy-dimethyl-(6-triethoxysilylhexyl)silane Chemical compound C(C)O[Si](CCCCCC[Si](O[Si](C)(C)CCCCCC[Si](OCC)(OCC)OCC)(C)C)(OCC)OCC PPGFUNOEXFJQKD-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- YYYYODAPGRLAHC-UHFFFAOYSA-N bis[[dimethyl(2-trimethoxysilylethyl)silyl]oxy]-methyl-(2-trimethoxysilylethyl)silane Chemical group CO[Si](CC[Si](C)(C)O[Si](C)(CC[Si](OC)(OC)OC)O[Si](C)(C)CC[Si](OC)(OC)OC)(OC)OC YYYYODAPGRLAHC-UHFFFAOYSA-N 0.000 description 1
- GKPOMITUDGXOSB-UHFFFAOYSA-N but-3-yn-2-ol Chemical compound CC(O)C#C GKPOMITUDGXOSB-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- WNCWUCSNEKCAAI-UHFFFAOYSA-N carbanide;2-methylcyclopenta-1,3-diene;platinum(4+) Chemical compound [CH3-].[CH3-].[CH3-].[Pt+4].CC1=[C-]CC=C1 WNCWUCSNEKCAAI-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000003493 decenyl group Chemical group [H]C([*])=C([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- SLQTWNAJXFHMHM-UHFFFAOYSA-N dimethoxy-methyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(OC)OC)CCC2OC21 SLQTWNAJXFHMHM-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 125000005066 dodecenyl group Chemical group C(=CCCCCCCCCCC)* 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- KPWVUBSQUODFPP-UHFFFAOYSA-N ethenyl-(ethenyl-methyl-phenylsilyl)oxy-methyl-phenylsilane Chemical compound C=1C=CC=CC=1[Si](C)(C=C)O[Si](C)(C=C)C1=CC=CC=C1 KPWVUBSQUODFPP-UHFFFAOYSA-N 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- HOMYFVKFSFMSFF-UHFFFAOYSA-N ethenyl-[ethenyl(diphenyl)silyl]oxy-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=C)O[Si](C=C)(C=1C=CC=CC=1)C1=CC=CC=C1 HOMYFVKFSFMSFF-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 230000003100 immobilizing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- ACXIAEKDVUJRSK-UHFFFAOYSA-N methyl(silyloxy)silane Chemical group C[SiH2]O[SiH3] ACXIAEKDVUJRSK-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000005187 nonenyl group Chemical group C(=CCCCCCCC)* 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 230000002186 photoactivation Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- IENQTDRUPBYCHN-UHFFFAOYSA-N tetrakis(2-methylprop-1-enylsilyl) silicate Chemical compound CC(=C[SiH2]O[Si](O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C)C IENQTDRUPBYCHN-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- IZRJPHXTEXTLHY-UHFFFAOYSA-N triethoxy(2-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC[Si](OCC)(OCC)OCC IZRJPHXTEXTLHY-UHFFFAOYSA-N 0.000 description 1
- PQVPWZHUJMEZSA-UHFFFAOYSA-N triethoxy(4-triethoxysilylbutyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCC[Si](OCC)(OCC)OCC PQVPWZHUJMEZSA-UHFFFAOYSA-N 0.000 description 1
- CTFNCWNXTNBVME-UHFFFAOYSA-N triethoxy(5-triethoxysilylpentan-2-yl)silane Chemical compound CCO[Si](OCC)(OCC)CCCC(C)[Si](OCC)(OCC)OCC CTFNCWNXTNBVME-UHFFFAOYSA-N 0.000 description 1
- BMSFSODNLPWTPF-UHFFFAOYSA-N triethoxy(5-triethoxysilylpentyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCC[Si](OCC)(OCC)OCC BMSFSODNLPWTPF-UHFFFAOYSA-N 0.000 description 1
- NRYWFNLVRORSCA-UHFFFAOYSA-N triethoxy(6-triethoxysilylhexyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCCC[Si](OCC)(OCC)OCC NRYWFNLVRORSCA-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- JFFBPULXPLWPAA-UHFFFAOYSA-N trimethoxy(10-trimethoxysilyldecyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCCCC[Si](OC)(OC)OC JFFBPULXPLWPAA-UHFFFAOYSA-N 0.000 description 1
- JCGDCINCKDQXDX-UHFFFAOYSA-N trimethoxy(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](OC)(OC)OC JCGDCINCKDQXDX-UHFFFAOYSA-N 0.000 description 1
- LQASLKRKZDJCBO-UHFFFAOYSA-N trimethoxy(3-trimethoxysilylpropyl)silane Chemical compound CO[Si](OC)(OC)CCC[Si](OC)(OC)OC LQASLKRKZDJCBO-UHFFFAOYSA-N 0.000 description 1
- OTRIBZPALGOVNZ-UHFFFAOYSA-N trimethoxy(4-trimethoxysilylbutyl)silane Chemical compound CO[Si](OC)(OC)CCCC[Si](OC)(OC)OC OTRIBZPALGOVNZ-UHFFFAOYSA-N 0.000 description 1
- SIWWUMIYHBHZEU-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylheptan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(CC)CCC(C)[Si](OC)(OC)OC SIWWUMIYHBHZEU-UHFFFAOYSA-N 0.000 description 1
- OXQUKGVMOJFCGS-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylhexan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)CCC(C)[Si](OC)(OC)OC OXQUKGVMOJFCGS-UHFFFAOYSA-N 0.000 description 1
- QFBFYIBBIGTUNJ-UHFFFAOYSA-N trimethoxy(5-trimethoxysilyloctan-2-yl)silane Chemical compound CCCC([Si](OC)(OC)OC)CCC(C)[Si](OC)(OC)OC QFBFYIBBIGTUNJ-UHFFFAOYSA-N 0.000 description 1
- SSGNPAVXPKHOKS-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylpentan-2-yl)silane Chemical compound CO[Si](OC)(OC)CCCC(C)[Si](OC)(OC)OC SSGNPAVXPKHOKS-UHFFFAOYSA-N 0.000 description 1
- MAFPECYMNWKRHR-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylpentyl)silane Chemical compound CO[Si](OC)(OC)CCCCC[Si](OC)(OC)OC MAFPECYMNWKRHR-UHFFFAOYSA-N 0.000 description 1
- PRAIIRKDOKYQQY-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylheptan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)CCCC(C)[Si](OC)(OC)OC PRAIIRKDOKYQQY-UHFFFAOYSA-N 0.000 description 1
- ODWVKKAQQWZKHG-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexan-2-yl)silane Chemical compound CO[Si](OC)(OC)CCCCC(C)[Si](OC)(OC)OC ODWVKKAQQWZKHG-UHFFFAOYSA-N 0.000 description 1
- BHXFSPFDYQBPQY-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexan-3-yl)silane Chemical compound CO[Si](OC)(OC)C(CC)CCC[Si](OC)(OC)OC BHXFSPFDYQBPQY-UHFFFAOYSA-N 0.000 description 1
- BMQGQVPUOLXPKP-UHFFFAOYSA-N trimethoxy(7-trimethoxysilylheptyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC[Si](OC)(OC)OC BMQGQVPUOLXPKP-UHFFFAOYSA-N 0.000 description 1
- UPQNGNQELOQBLG-UHFFFAOYSA-N trimethoxy(7-trimethoxysilyloctan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)CCCCC(C)[Si](OC)(OC)OC UPQNGNQELOQBLG-UHFFFAOYSA-N 0.000 description 1
- CRUHSXGCCKOZML-UHFFFAOYSA-N trimethoxy(8-trimethoxysilyldecan-3-yl)silane Chemical compound CO[Si](OC)(OC)C(CC)CCCCC(CC)[Si](OC)(OC)OC CRUHSXGCCKOZML-UHFFFAOYSA-N 0.000 description 1
- SHCGUUKICQTMGF-UHFFFAOYSA-N trimethoxy(8-trimethoxysilyloctyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCC[Si](OC)(OC)OC SHCGUUKICQTMGF-UHFFFAOYSA-N 0.000 description 1
- MBIWXZXQMMLFAB-UHFFFAOYSA-N trimethoxy(9-trimethoxysilylnonyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCCC[Si](OC)(OC)OC MBIWXZXQMMLFAB-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- ZQTYRTSKQFQYPQ-UHFFFAOYSA-N trisiloxane Chemical class [SiH3]O[SiH2]O[SiH3] ZQTYRTSKQFQYPQ-UHFFFAOYSA-N 0.000 description 1
- 125000005065 undecenyl group Chemical group C(=CCCCCCCCCC)* 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/41—Opaque
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/204—Plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
(A)一分子中に少なくとも2個の炭素原子数2〜12のアルケニル基を有するオルガノポリシロキサン、
(B)一分子中に少なくとも2個のケイ素結合水素原子を有するオルガノハイドロジェンポリシロキサン、及び
(C)ヒドロシリル化反応用触媒、
を含む、硬化性シリコーン組成物であって、
(B)成分の含有量は、(A)成分中の脂肪族不飽和炭素−炭素結合1モルに対して、(B)成分中のケイ素結合水素原子が0.5〜2モルとなる量であり、
硬化性シリコーン組成物中のケイ素結合有機基の2〜17.5モル%がアリール基である、硬化性シリコーン組成物によって達成される。
(a1)一分子中に少なくとも2個の炭素原子数2〜12のアルケニル基を有し、ケイ素結合有機基の3〜25モル%がアリール基である、直鎖状又は部分分岐状オルガノポリシロキサン
(a2)平均単位式:(R1 3SiO1/2)a(R1 2SiO2/2)b(R1SiO3/2)c(SiO4/2)d(式中、R1はそれぞれ独立に炭素原子数1〜12の一価炭化水素基であり、R1の少なくとも1モル%は炭素原子数2〜12のアルケニル基であり、a、b、c及びdは次の条件を全て満たす:a+b+c+d=1、0≦a≦0.8、0≦b≦0.4、0≦c≦0.8、0≦d≦0.6、0.2≦c+d≦0.8)で表される、アルケニル基を有するオルガノポリシロキサン
を含み、
(B)成分が以下の(b1)成分及び(b2)成分:
(b1)分子鎖末端にケイ素結合水素原子を有する直鎖状のオルガノハイドロジェンポリシロキサン
(b2)一分子内に3個以上のケイ素結合水素原子を有するオルガノハイドロジェンポリシロキサン
を含むことが好ましい。
(b2)成分の含有量が、硬化性シリコーン組成物の硬化反応により不揮発性の固形分を形成する成分の和に対して0〜2.0質量%の範囲であることがより好ましい。
i)ポリエーテル化合物の含有量が、硬化性シリコーン組成物の合計量に対して0.1質量%以下であり、かつ、
ii)エポキシ基及びアルコキシシリル基を有する化合物の含有量が、硬化性シリコーン組成物の合計量に対して0.1質量%以下であることが好ましい。
(c1)高エネルギー線の照射なしで活性を示すヒドロシリル化反応用触媒、
(c2)高エネルギー線の照射により活性を示すヒドロシリル化反応用触媒、及び
(c3)(c1)成分と(c2)成分の組み合わせであるヒドロシリル化反応用触媒
からなる群から選択されることが好ましい。
(d1)分子鎖末端に2個のアルコキシシリル基を有する化合物を含むことが好ましい。
第1の透明又は不透明な光学部材と、第2の透明又は不透明な光学部材との間に配置された本発明の硬化物からなる接着層と、を備える積層体にも関する。
基材と、
前記基材に配置された光学素子と、
前記光学素子の少なくとも一部を封止する本発明の硬化物と、を備える光学装置にも関する。
本発明の積層体を供える光学ディスプレイにも関する。
本発明の高エネルギー線の照射なしで活性を示すヒドロシリル化触媒を少なくとも含有する硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置し、前記二つの光学部材を前記硬化性シリコーン組成物を介して貼り合わせる配置工程、及び放置若しくは加熱して前記組成物のヒドロシリル化反応を進行させて前記組成物を硬化させる硬化工程を含む、積層体の製造方法にも関する。なお、本発明の積層体を構成する光学部材は、平面状の広がりを有する板状部分を備えていることが一般的であり、当該板状部位または部材自身が湾曲していてもよく、部材の用途に由来する三次元的な凹凸を備えていてもよい。また、光学部材の両面に配置された硬化物であって他の光学部材との貼り合わせに使用されない硬化物は、接着面として剥離層や他の部材への接合に用いることができる。
本発明の高エネルギー線の照射により活性を示すヒドロシリル化触媒を少なくとも含有する硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置し、前記二つの光学部材を前記硬化性シリコーン組成物を介して貼り合わせる配置工程、及び
高エネルギー線照射、放置若しくは加熱して前記組成物のヒドロシリル化反応を進行させて前記組成物を硬化させる硬化工程を含む、積層体の製造方法にも関する。
本発明の高エネルギー線の照射により活性を示すヒドロシリル化触媒を少なくとも含有する硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置し、高エネルギー線照射を行い、非流動性の半硬化状態を形成した後、前記二つの光学部材を半硬化状態の前記硬化性シリコーン組成物を介して貼り合わせる配置工程、及び放置若しくは加熱して前記組成物のヒドロシリル化反応を進行させて前記組成物を本硬化させる本硬化工程を含む、積層体の製造方法にも関する。
本発明の高エネルギー線の照射なしで活性を示すヒドロシリル化触媒と高エネルギー線の照射により活性を示すヒドロシリル化触媒の両方を含有する硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置した後に、放置若しくは加熱して前記組成物のヒドロシリル化反応させて室温(25℃)を含む低温領域(15〜80℃)で非流動性の半硬化状態を形成した後、前記二つの光学部材を半硬化状態の前記硬化性シリコーン組成物を介して貼り合わせる配置工程、及び透明基材を通して高エネルギー線照射を行った後に、放置若しくは加熱して半硬化状態の前記組成物のヒドロシリル化反応を進行させて前記組成物を本硬化させる本硬化工程を含む、積層体の製造にも関する。
本発明の高エネルギー線の照射なしで活性を示すヒドロシリル化触媒を少なくとも含有する硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置した後、放置若しくは加熱して前記組成物のヒドロシリル化反応させて室温(25℃)を含む低温領域(15〜80℃)で非流動性の半硬化状態を形成した後、前記二つの光学部材を半硬化状態の前記硬化性シリコーン組成物を介して貼り合わせる配置工程、及び放置若しくは加熱して半硬化状態の前記組成物のヒドロシリル化反応を進行させて前記組成物を本硬化させる本硬化工程を含む、積層体の製造方法にも関する。
前記積層体が光学装置である積層体の製造方法にも関する。
前記積層体が光学ディスプレイである、積層体の製造方法にも関する。
以下、まずは本発明の硬化性シリコーン組成物(以下、「本組成物」と称することがある。)について詳細に説明する。
(a1)一分子中に少なくとも2個の炭素原子数2〜12のアルケニル基を有し、ケイ素結合有機基の3〜25モル%がアリール基である直鎖状又は部分分岐状オルガノポリシロキサン
(a2)平均単位式:(R1 3SiO1/2)a(R1 2SiO2/2)b(R1SiO3/2)c(SiO4/2)d(式中、R1はそれぞれ独立に炭素原子数1〜12の一価炭化水素基であり、R1の少なくとも1モル%は炭素原子数2〜12のアルケニル基であり、a、b、c及びdは次の条件を全て満たす:a+b+c+d=1、0≦a≦0.8、0≦b≦0.4、0≦c≦0.8、0≦d≦0.6、0.2≦c+d≦0.8)で表される、アルケニル基を有するオルガノポリシロキサン
を含む。
(ViMe2SiO1/2)0.1(Me3SiO1/2)0.4(SiO4/2)0.5
(ViMe2SiO1/2)0.1(Me3SiO1/2)0.5(SiO4/2)0.4
(ViMe2SiO1/2)0.05(Me3SiO1/2)0.55(SiO4/2)0.4
(ViMe2SiO1/2)0.1(Me3SiO1/2)0.4(PhSiO3/2)0.1(SiO4/2)0.4
(ViMe2SiO1/2)0.046(Me3SiO1/2)0.394(SiO4/2)0.56
(ViMe2SiO1/2)0.25(PhSiO3/2)0.75
が例示される。なお、上式中Meはメチル基であり、Phはフェニル基であり、Viはビニル基である。
(b1)分子鎖末端にケイ素結合水素原子を有する直鎖状のオルガノハイドロジェンポリシロキサン
(b2)一分子内に3個以上のケイ素結合水素原子を有するオルガノハイドロジェンポリシロキサン
を含む。
(HMe2SiO1/2)0.6(SiO4/2)0.4
(HMe2SiO1/2)0.3(Me3SiO1/2)0.3(SiO4/2)0.4
(HMe2SiO1/2)0.5(Me3SiO1/2)0.05(SiO4/2)0.4
(HMe2SiO1/2)0.5(PhSiO3/2)0.1(SiO4/2)0.4
(HMe2SiO1/2)0.6(PhSiO3/2)0.4
(HMe2SiO1/2)0.75(PhSiO3/2)0.25
及びこれらのオルガノポリシロキサンの2種以上の混合物が例示される。なお、上式中Meはメチル基であり、Phはフェニル基である。
(c1)高エネルギー線の照射なしで活性を示すヒドロシリル化反応用触媒、
(c2)高エネルギー線の照射により活性を示すヒドロシリル化反応用触媒、及び
(c3)(c1)成分と(c2)成分の組み合わせであるヒドロシリル化反応用触媒
からなる群から選択されるものを使用することが好ましい。
(MeO)3SiCH2CH2(Me)2Si-O-SiMe(CH2CH2Si(OMe)3)-O-Si(Me)2CH2CH2Si(OMe)3
である(上式中、Meはメチル基である)。
XO−(C2H4O)p(CnH2nO)q(YO)r−X
で表されるポリオキシアルキレン化合物である。
X2O(C2H4O)p[CH2CH(Me)O]qX2
X3O(C2H4O)p[CH2CH(Me)O]qX3
X4O(C2H4O)p[CH2CH(Me)O]qX4
X2O(C2H4O)p[CH2CH(Me)O]qX1
X3O(C2H4O)p[CH2CH(Me)O]qX1
X4O(C2H4O)p[CH2CH(Me)O]qX1
X5O(C2H4O)p[CH2CH(Me)O]qX1
X5O(C2H4O)p[CH2CH(Me)O]qX2
X5O(C2H4O)p[CH2CH(Me)O]qX4
X2O(C2H4O)pX2
X3O(C2H4O)pX3
X4O(C2H4O)pX4
X2O(C2H4O)pX1
X3O(C2H4O)pX1
X4O(C2H4O)pX1
X5O(C2H4O)pX1
X5O(C2H4O)pX2
X5O(C2H4O)pX4
X2O(C2H4O)p−p−C6H4−C9H19
X3O(C2H4O)p−p−C6H4−C9H19
X4O(C2H4O)p−p−C6H4−C9H19
X2O(C2H4O)p−C6H5
X3O(C2H4O)p−C6H5
X4O(C2H4O)p−C6H5
X2O(C2H4O)p−p−C6H4−CMe2−p−C6H4−O(C2H4O)pX2
X3O(C2H4O)p−p−C6H4−CMe2−p−C6H4−O(C2H4O)pX3
X4O(C2H4O)p−p−C6H4−CMe2−p−C6H4−O(C2H4O)pX4
次に、本発明の硬化物について詳細に説明する。
図1は、本発明の実施形態の積層体を示す断面図である。本発明の実施形態の積層体1は、第1の光学部材20と、第2の光学部材21と、2つの光学部材20、21の間に配置された本硬化物からなる接着層15と、を備えている。積層体1では、2つの光学部材20、21が接着層15により接着されている。これらの光学部材は透明であっても、不透明であってもよく、一方又は両方の光学部材が、単独の基材であってもよく、バックライトユニットのようにそれ自体が独立した積層体である光学部材であってもよい。なお、本発明の積層体を構成する光学部材は、平面状の広がりを有する板状部分を備えていることが一般的であり、当該板状部位または部材自身が湾曲していてもよく、部材の用途に由来する三次元的な凹凸を備えていてもよい。
工程i):前記(c2)高エネルギー線の照射により活性を示すヒドロシリル化触媒を少なくとも含有する上記の硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置する工程S1
工程ii):工程i)で配置された前記組成物に高エネルギー線照射を行い、当該組成物を非流動性の半硬化状態にする工程S21
工程iii):工程ii)の後、前記二つの光学部材を半硬化状態の前記硬化性シリコーン組成物を介して貼り合わせる工程S3
工程iv):工程iii)で貼り合わせた前記二つの光学部材を、15〜80℃の温度範囲で前記組成物のヒドロシリル化反応を進行させ、前記組成物を本硬化させる工程S22
工程i):前記(c1)高エネルギー線の照射なしで活性を示すヒドロシリル化触媒と、前記(c2)の高エネルギー線の照射により活性を示すヒドロシリル化触媒との両方を含有する上記の硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置する工程S1であって、少なくとも一方の部材として透明な光学部材を用いる工程
工程ii):工程i)で配置された前記組成物を室温で放置若しくは加熱して前記組成物のヒドロシリル化反応を進行させ、当該組成物を非流動性の半硬化状態にする工程S21
工程iii):工程ii)の後、前記二つの光学部材を半硬化状態の前記硬化性シリコーン組成物を介して貼り合わせる工程S3
工程iv):工程iii)で貼り合わせた前記二つの光学部材について、前記透明な光学部材を通して、前記硬化性シリコーン組成物に高エネルギー線照射を行った後、15〜80℃の温度範囲で半硬化状態の前記組成物のヒドロシリル化反応を進行させ、前記組成物を本硬化させる工程S22
工程i):(c1)高エネルギー線の照射なしで活性を示すヒドロシリル化触媒を少なくとも含有する上記の硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置する工程S1
工程ii):工程i)で配置された前記組成物を15〜80℃の温度範囲で前記組成物のヒドロシリル化反応を進行させ、当該組成物を非流動性の半硬化状態にする工程S21
工程iii):工程ii)の後、前記二つの光学部材を半硬化状態の前記硬化性シリコーン組成物を介して貼り合わせる工程S3
工程iv):工程iii)で貼り合わせた前記二つの光学部材を、さらに、15〜80℃の温度範囲で半硬化状態の前記組成物のヒドロシリル化反応を進行させ、前記組成物を本硬化させる工程S22
本発明の実施形態の光学装置(以下、「本光学装置」と称することがある。)は、基材と、基材に配置された光学素子と、光学素子の少なくとも一部を封止する本硬化物と、を備えている。
本組成物を加熱することによりヒドロシリル化反応を進行させた組成物を得てから基材に配置された光学素子上に加熱後の組成物を配置する配置工程S1、又は
基材に配置された光学素子上に本組成物を配置してから本組成物を加熱することによりヒドロシリル化反応を進行させた組成物を得る加熱工程のいずれか1つを含み、
高エネルギー線を照射して加熱後の組成物を硬化させる硬化工程をさらに含む。
図8は、本発明の実施形態の光学ディスプレイを示す断面図である。本発明の実施形態の光学ディスプレイ200は、上記の積層体1と、画像表示パネル201と、を備えている。
前記前面パネルの前記表示面に対向する面に設けられ、透明導電膜が形成された面を有するシールド基板をさらに備え、
前記透明導電膜と前記ベゼルとが導電性材料を介して電気的に接続された構造を備えた表示装置であってよい。
当該表示装置は、前記表示面と前面パネルとの間が実質的に透明な光学弾性体樹脂部材又は光学ゲル状樹脂部材により充填された構造を備えた表示装置であることが好ましい。このような光学弾性体樹脂部材又は光学ゲル状樹脂部材をOCRとして、オプティカルボンディングに用いることで、当該表示装置の表示性能及び耐久性を改善し、高信頼性の表示装置を提供できる。
厚みが10mm以上の硬化性シリコーン組成物をシャーレ中、25℃で48時間放置して硬化させ、針入度測定装置(離合社製のRPM−201)を使用して、25℃における針入度を測定した。
2枚のガラス板(縦75mm×横25mm×厚さ2mm)の間に、硬化後のシリコーン硬化物の寸法が縦25mm×横25mm×厚さ200μmとなるように硬化性シリコーン組成物を充填し、室温で48時間加熱することにより、前記組成物を硬化させ、2枚のガラス板に挟まれた硬化物からなる試験体を作製した。この試験体を、JIS K6850に規定される方法に準じてせん断接着試験を行ない、接着強度を測定した。
2枚のガラス板(縦75mm×横25mm×厚さ2mm)の間に、硬化後のシリコーン硬化物の寸法が縦25mm×横25mm×厚さ200μmとなるように硬化性シリコーン組成物を充填した試験体を、25℃で48時間放置した。硬化したものについては、−55℃の冷凍庫に500時間試験体を放置し、約2時間室温まで戻した後及び冷熱サイクル試験機中−55℃と85℃を30分保持時間を200回繰り返した後、目視で外観を観察した。その結果、明瞭な亀裂が観察されたものを記録した。
下記の成分を用いて、表1に示す組成(質量部)の硬化性シリコーン組成物を調製した。各構造式において、Meはメチル基であり、Viはビニル基であり、Phはフェニル基であり、Epはエポキシ基である。
a1−1:ViMe2SiO(SiMe2O)233(SiMePhO)24OSiMe2Vi
a1−2:ViMe2SiO(SiMe2O)240(SiMePhO)17OSiMe2Vi
a1−3:ViMe2SiO(SiMe2O)203(SiMePhO)50OSiMe2Vi
a1’−1(比較成分):ViMe2SiO(SiMe2O)372OSiMe2Vi
a1’−2(比較成分):ViMe2SiO(SiMe2O)80(SiMePhO)80OSiMe2Vi
a1’−3(比較成分):ViMe2SiO(SiMe2O)256(SiMePhO)4OSiMe2Vi
a2−1:(ViMe2SiO1/2)0.046(Me3SiO1/2)0.394(SiO4/2)0.56
a2−2:Si(OSiMe2Vi)4
b1−1:HMe2SiO(SiMe2O)24OSiMe2H
b2−1:(HMe2SiO1/2)0.63(SiO4/2)0.37
b2−2:(HMe2SiO1/2)0.75(PhSiO3/2)0.25
c1−1:白金 1,3―ジビニル−1,1,3,3−テトラメチルジシロキサン錯体
d1−1:1,6−ビス(トリメトキシシリル)ヘキサン
d1−2:1,3−ビス(トリメトキシシリルエチル)テトラメチルジシロキサン
任意成分−1:Me3SiO(SiMe2O)450(SiMePhO)40OSiMe3
15 接着層
20 第1の光学部材
20a 接着面
20b 面
21 第2の光学部材
21a 面
21b 面
100、100A LED
101、101B、101G、101R LED素子(光学素子)
102 リードフレーム(基材)
103 透明層104 ボンディングワイヤ
105 枠材
106 本硬化物
110 表示パネル
111 表示面
120 ベゼル
121 枠部
122 開口端
130 前面パネル
140 樹脂部材(ダム)
150 OCR
170、170A 表示モジュール
171 バックライトユニット
172 間隙
173 空間
200 光学ディスプレイ
201 画像表示パネル
300A 光学ディスプレイ
300B 光学ディスプレイ
301 画像表示パネル
301a 面
302 タッチパネル
400 表示装置(光学ディスプレイ)
Claims (24)
- (A)一分子中に少なくとも2個の炭素原子数2〜12のアルケニル基を有するオルガノポリシロキサン、
(B)一分子中に少なくとも2個のケイ素結合水素原子を有するオルガノハイドロジェンポリシロキサン、及び
(C)ヒドロシリル化反応用触媒、
を含む、硬化性シリコーン組成物であって、
(B)成分の含有量は、(A)成分中の脂肪族不飽和炭素−炭素結合1モルに対して、(B)成分中のケイ素結合水素原子が0.5〜2モルとなる量であり、
硬化性シリコーン組成物中のケイ素結合有機基の2〜17.5モル%がアリール基である、硬化性シリコーン組成物。 - (A)成分中のケイ素結合有機基の2〜20モル%がアリール基である、請求項1に記載の硬化性シリコーン組成物。
- (A)成分が以下の(a1)成分及び(a2)成分:
(a1)一分子中に少なくとも2個の炭素原子数2〜12のアルケニル基を有し、ケイ素結合有機基の3〜25モル%がアリール基である直鎖状又は分岐鎖状オルガノポリシロキサン
(a2)平均単位式:(R1 3SiO1/2)a(R1 2SiO2/2)b(R1SiO3/2)c(SiO4/2)d(式中、R1はそれぞれ独立に炭素原子数1〜12の一価炭化水素基であり、R1の少なくとも1モル%は炭素原子数2〜12のアルケニル基であり、a、b、c及びdは次の条件を全て満たす:a+b+c+d=1、0≦a≦0.8、0≦b≦0.4、0≦c≦0.8、0≦d≦0.6、0.2≦c+d≦0.8)で表される、アルケニル基を有するオルガノポリシロキサン
を含み、
(B)成分が以下の(b1)成分及び(b2)成分:
(b1)分子鎖末端にケイ素結合水素原子を有する直鎖状のオルガノハイドロジェンポリシロキサン
(b2)一分子内に3個以上のケイ素結合水素原子を有するオルガノハイドロジェンポリシロキサン
を含む、請求項1又は2のいずれか一項に記載の硬化性シリコーン組成物。 - (a2)成分の含有量が、硬化性シリコーン組成物の硬化反応により不揮発性の固形分を形成する成分の和に対して0.5〜5.0質量%の範囲であり、かつ、
(b2)成分の含有量が、硬化性シリコーン組成物の硬化反応により不揮発性の固形分を形成する成分の和に対して0〜2.0質量%の範囲である、請求項2に記載の硬化性シリコーン組成物。 - (D)一分子中に2個以上のアルコキシシリル基を有する有機化合物
をさらに含む、請求項1から3のいずれか一項に記載の硬化性シリコーン組成物。 - i)ポリエーテル化合物の含有量が、硬化性シリコーン組成物の合計量に対して0.1質量%以下であり、かつ、
ii)エポキシ基及びアルコキシシリル基を有する化合物の含有量が、硬化性シリコーン組成物の合計量に対して0.1質量%以下である、請求項6に記載の硬化性シリコーン組成物。 - (D)成分の含有量が、硬化性シリコーン組成物の合計量に対して0.001〜5質量%の範囲である、請求項6又は7に記載の硬化性シリコーン組成物。
- (C)成分が、
(c1)高エネルギー線の照射なしで活性を示すヒドロシリル化反応用触媒、
(c2)高エネルギー線の照射により活性を示すヒドロシリル化反応用触媒、及び
(c3)(c1)成分と(c2)成分の組み合わせであるヒドロシリル化反応用触媒
からなる群から選択される、請求項1から7のいずれか一項に記載の硬化性シリコーン組成物。 - 前記高エネルギー線が、紫外線、ガンマ線、X線、α線、又は電子線から選択される、請求項9に記載の硬化性シリコーン組成物。
- (D)成分が、
(d1)分子鎖末端に2個のアルコキシシリル基を有する化合物を含む、請求項1から9のいずれか一項に記載の硬化性シリコーン組成物。 - 25℃における粘度が100,000mPa以下である、請求項1から10のいずれか一項に記載の硬化性シリコーン組成物。
- 光学用接着剤又は光学用粘着剤である、請求項1から8のいずれか一項に記載の硬化性シリコーン組成物。
- 請求項1から12のいずれか一項に記載の硬化性シリコーン組成物の硬化物。
- 25℃における針入度が5〜70の範囲である、請求項13に記載の硬化物。
- 第1の透明又は不透明な光学部材と第2の透明又は不透明な光学部材との間に配置された請求項13又は14に記載の硬化物からなる接着層と、を備える積層体。
- 基材と、
前記基材に配置された光学素子と、
前記光学素子の少なくとも一部を封止する請求項13又は14に記載の硬化物と、を備える光学装置。 - 請求項15に記載の積層体を備える光学ディスプレイ。
- 前記(c1)高エネルギー線の照射なしで活性を示すヒドロシリル化触媒を少なくとも含有する請求項8又は9に記載の硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置し、前記二つの光学部材を前記硬化性シリコーン組成物を介して貼り合わせる配置工程、及び放置若しくは加熱して前記組成物のヒドロシリル化反応を進行させて前記組成物を硬化させる硬化工程を含む、積層体の製造方法。
- 前記(c2)高エネルギー線の照射により活性を示すヒドロシリル化触媒を少なくとも含有する請求項8又は9に記載の硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置し、前記二つの光学部材を前記硬化性シリコーン組成物を介して貼り合わせる配置工程、及び高エネルギー線照射後、放置若しくは加熱して前記組成物のヒドロシリル化反応を進行させて前記組成物を硬化させる硬化工程を含む、積層体の製造方法。
- 以下の工程を有する積層体の製造方法:
工程i):前記(c2)高エネルギー線の照射により活性を示すヒドロシリル化触媒を少なくとも含有する請求項8又は9に記載の硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置する工程
工程ii):工程i)で配置された前記組成物に高エネルギー線照射を行い、当該組成物を非流動性の半硬化状態にする工程
工程iii):工程ii)の後、前記二つの光学部材を半硬化状態の前記硬化性シリコーン組成物を介して貼り合わせる工程
工程iv):工程iii)で貼り合わせた前記二つの光学部材を、15〜80℃の温度範囲で半硬化状態の前記組成物のヒドロシリル化反応を進行させ、前記組成物を本硬化させる工程。 - 以下の工程を有する積層体の製造方法:
工程i):前記(c1)高エネルギー線の照射なしで活性を示すヒドロシリル化触媒と、前記(c2)高エネルギー線の照射により活性を示すヒドロシリル化触媒との両方を含有する請求項8又は9に記載の硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置する工程であって、少なくとも一方の部材として透明な光学部材を用いる工程
工程ii):工程i)で配置された前記組成物を15〜80℃の温度範囲で前記組成物のヒドロシリル化反応を進行させ、当該組成物を非流動性の半硬化状態にする工程
工程iii):工程ii)の後、前記二つの光学部材を半硬化状態の前記硬化性シリコーン組成物を介して貼り合わせる工程
工程iv):工程iii)で貼り合わせた前記二つの光学部材について、前記透明な光学部材を通して、前記硬化性シリコーン組成物に高エネルギー線照射を行った後、15〜80℃の温度範囲で半硬化状態の前記組成物のヒドロシリル化反応を進行させ、前記組成物を本硬化させる工程。 - 以下の工程を有する積層体の製造方法:
工程i):(c1)高エネルギー線の照射なしで活性を示すヒドロシリル化触媒を少なくとも含有する請求項8又は9に記載の硬化性シリコーン組成物を二つの光学部材のうち少なくとも一方の部材の一面又は両面に配置する工程
工程ii):工程i)で配置された前記組成物に15〜80℃の温度範囲で前記組成物のヒドロシリル化反応を進行させ、当該組成物を非流動性の半硬化状態にする工程
工程iii):工程ii)の後、前記二つの光学部材を半硬化状態の前記硬化性シリコーン組成物を介して貼り合わせる工程
工程iv):工程iii)で貼り合わせた前記二つの光学部材を、さらに、15〜80℃の温度範囲で半硬化状態の前記組成物のヒドロシリル化反応を進行させ、前記組成物を本硬化させる工程。 - 積層体が光学装置である、請求項19から22いずれか一項に記載の積層体の製造方法。
- 積層体が光学ディスプレイである、請求項19から22いずれか一項に記載の積層体の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018196663 | 2018-10-18 | ||
JP2018196663 | 2018-10-18 | ||
PCT/JP2019/040432 WO2020080350A1 (ja) | 2018-10-18 | 2019-10-15 | 硬化性シリコーン組成物及びその硬化物、積層体及びその製造方法、並びに光学装置又は光学ディスプレイ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020080350A1 true JPWO2020080350A1 (ja) | 2021-09-16 |
JP7366053B2 JP7366053B2 (ja) | 2023-10-20 |
Family
ID=70283844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020553187A Active JP7366053B2 (ja) | 2018-10-18 | 2019-10-15 | 硬化性シリコーン組成物及びその硬化物、積層体及びその製造方法、並びに光学装置又は光学ディスプレイ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220025235A1 (ja) |
EP (1) | EP3868832A4 (ja) |
JP (1) | JP7366053B2 (ja) |
KR (1) | KR20210077723A (ja) |
CN (1) | CN113039247A (ja) |
WO (1) | WO2020080350A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021015044A1 (ja) * | 2019-07-24 | 2021-01-28 | ||
CN113540275A (zh) * | 2021-07-16 | 2021-10-22 | 彼博股份有限公司 | 一种曲面多形态集成光伏模块及其封装方法 |
WO2024145274A1 (en) * | 2022-12-28 | 2024-07-04 | Dow Silicones Corporation | Curable silicone composition |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08134358A (ja) * | 1994-11-11 | 1996-05-28 | Shin Etsu Chem Co Ltd | 光学用硬化性シリコーン組成物 |
JP2006335857A (ja) * | 2005-06-01 | 2006-12-14 | Ge Toshiba Silicones Co Ltd | 透明な硬化物を与えるポリオルガノシロキサン組成物 |
JP2007191504A (ja) * | 2006-01-17 | 2007-08-02 | Shin Etsu Chem Co Ltd | 硬化性シリコーンゴム組成物及びその硬化物 |
JP2008019385A (ja) * | 2006-07-14 | 2008-01-31 | Shin Etsu Chem Co Ltd | 硬化性シリコーンゴム組成物及びその硬化物 |
JP2016534162A (ja) * | 2013-08-29 | 2016-11-04 | ダウ コーニング コーポレーションDow Corning Corporation | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
JP2017161779A (ja) * | 2016-03-10 | 2017-09-14 | 富士ゼロックス株式会社 | 定着部材、定着装置、及び画像形成装置 |
WO2018043270A1 (ja) * | 2016-09-01 | 2018-03-08 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物 |
WO2018159725A1 (ja) * | 2017-03-02 | 2018-09-07 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光学ディスプレイ |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4413636A (en) * | 1979-11-19 | 1983-11-08 | Phillip R. Beutel | Catheter |
JPH1012546A (ja) | 1996-06-18 | 1998-01-16 | Sharp Corp | 半導体ウェハの加熱処理方法 |
EP1032616A4 (en) * | 1997-10-23 | 2001-04-11 | Aar Cornelis P J V D | RUBBER TO METAL LIABILITY THROUGH SILANE COUPLING REAGENTS |
KR20090015965A (ko) * | 2006-05-10 | 2009-02-12 | 다우 코닝 도레이 캄파니 리미티드 | 실리콘 고무 조성물 |
JP5581721B2 (ja) * | 2010-02-12 | 2014-09-03 | 住友ベークライト株式会社 | シリコーンゴム系硬化性組成物、その製造方法、成形体及び医療用チューブ |
JP2012111850A (ja) | 2010-11-25 | 2012-06-14 | Yokohama Rubber Co Ltd:The | シリコーン樹脂組成物、ならびに、これを用いて得られるシリコーン樹脂含有構造体および光半導体素子封止体 |
CN106414612A (zh) * | 2014-04-09 | 2017-02-15 | 道康宁东丽株式会社 | 固化性有机聚硅氧烷组合物以及电气电子元件的保护剂或粘接剂组合物 |
CN106189251A (zh) * | 2015-05-29 | 2016-12-07 | 弗洛里光电材料(苏州)有限公司 | 应用于半导体封装的有机硅组合物及其应用 |
-
2019
- 2019-10-15 EP EP19873227.3A patent/EP3868832A4/en active Pending
- 2019-10-15 JP JP2020553187A patent/JP7366053B2/ja active Active
- 2019-10-15 WO PCT/JP2019/040432 patent/WO2020080350A1/ja unknown
- 2019-10-15 KR KR1020217014474A patent/KR20210077723A/ko active Search and Examination
- 2019-10-15 US US17/285,744 patent/US20220025235A1/en active Pending
- 2019-10-15 CN CN201980075257.4A patent/CN113039247A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08134358A (ja) * | 1994-11-11 | 1996-05-28 | Shin Etsu Chem Co Ltd | 光学用硬化性シリコーン組成物 |
JP2006335857A (ja) * | 2005-06-01 | 2006-12-14 | Ge Toshiba Silicones Co Ltd | 透明な硬化物を与えるポリオルガノシロキサン組成物 |
JP2007191504A (ja) * | 2006-01-17 | 2007-08-02 | Shin Etsu Chem Co Ltd | 硬化性シリコーンゴム組成物及びその硬化物 |
JP2008019385A (ja) * | 2006-07-14 | 2008-01-31 | Shin Etsu Chem Co Ltd | 硬化性シリコーンゴム組成物及びその硬化物 |
JP2016534162A (ja) * | 2013-08-29 | 2016-11-04 | ダウ コーニング コーポレーションDow Corning Corporation | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
JP2017161779A (ja) * | 2016-03-10 | 2017-09-14 | 富士ゼロックス株式会社 | 定着部材、定着装置、及び画像形成装置 |
WO2018043270A1 (ja) * | 2016-09-01 | 2018-03-08 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物 |
WO2018159725A1 (ja) * | 2017-03-02 | 2018-09-07 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光学ディスプレイ |
Also Published As
Publication number | Publication date |
---|---|
CN113039247A (zh) | 2021-06-25 |
JP7366053B2 (ja) | 2023-10-20 |
KR20210077723A (ko) | 2021-06-25 |
EP3868832A1 (en) | 2021-08-25 |
US20220025235A1 (en) | 2022-01-27 |
WO2020080350A1 (ja) | 2020-04-23 |
EP3868832A4 (en) | 2022-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7366052B2 (ja) | 硬化性シリコーン組成物及びその硬化物、積層体及びその製造方法、並びに光学装置又は光学ディスプレイ | |
JP4503271B2 (ja) | シリコーン積層体の製造方法 | |
TWI685516B (zh) | 含有氟烷基之硬化性有機聚矽氧烷組合物、其硬化物及具備該硬化物之電子零件或顯示裝置 | |
JP7053124B2 (ja) | 硬化性シリコーン組成物、その硬化物、および光学ディスプレイ | |
JP7366053B2 (ja) | 硬化性シリコーン組成物及びその硬化物、積層体及びその製造方法、並びに光学装置又は光学ディスプレイ | |
JP7419251B2 (ja) | 硬化反応性シリコーン組成物及びその硬化物並びにそれらの用途 | |
US11555120B2 (en) | Organopolysiloxane composition, and half-cured product and cured product produced from same | |
JPWO2019088067A1 (ja) | オルガノポリシロキサン硬化物を製造する方法、オルガノポリシロキサン硬化物、積層体、および光学部品 | |
JP7366051B2 (ja) | 硬化性シリコーン組成物及びその硬化物、積層体及びその製造方法、並びに光学装置又は光学ディスプレイ | |
JP2010095659A (ja) | フラットパネルディスプレイ用透明粘着シート及びフラットパネルディスプレイ | |
JP6243567B1 (ja) | 硬化性ポリオルガノシロキサン組成物及びその使用 | |
WO2022234802A1 (ja) | 紫外線硬化性シリコーン組成物及びその硬化物、積層体、並びに光学装置又は光学ディスプレイ | |
JP2011095318A (ja) | フラットパネルディスプレイ用直貼り光学フィルム又は光学フィルム積層体及びそれらの製造方法 | |
WO2024057924A1 (ja) | 硬化性シリコーン組成物及びその硬化物、積層体、並びに光学装置又は光学ディスプレイ | |
JP4961026B2 (ja) | シリコーン積層体の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221007 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230425 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230621 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231004 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231010 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7366053 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S802 | Written request for registration of partial abandonment of right |
Free format text: JAPANESE INTERMEDIATE CODE: R311802 |