JPWO2020080215A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JPWO2020080215A1 JPWO2020080215A1 JP2020553107A JP2020553107A JPWO2020080215A1 JP WO2020080215 A1 JPWO2020080215 A1 JP WO2020080215A1 JP 2020553107 A JP2020553107 A JP 2020553107A JP 2020553107 A JP2020553107 A JP 2020553107A JP WO2020080215 A1 JPWO2020080215 A1 JP WO2020080215A1
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- switching element
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Abstract
Description
第1端子および第2端子と、
第1ゲート電極、第1ソース電極および第1ドレイン電極を有する第1スイッチング素子と、
第2ゲート電極、第2ソース電極および第2ドレイン電極を有する第2スイッチング素子と、を備え、
前記第1端子および前記第2端子間において前記第1スイッチング素子および前記第2スイッチング素子が直列に接続された半導体装置であって、
前記第1端子および前記第2端子間において前記第1スイッチング素子および前記第2スイッチング素子と並列に接続された第1コンデンサを備えており、
前記第1スイッチング素子および前記第2スイッチング素子は、第1方向に並べられており、
前記第1コンデンサは、前記第1方向と直角である第2方向視において、前記第1スイッチング素子および前記第2スイッチング素子の少なくともいずれかと重なる、半導体装置。
〔付記2〕
前記第1コンデンサは、前記第2方向視において、前記第1スイッチング素子および前記第2スイッチング素子の双方と重なる、付記1に記載の半導体装置。
〔付記3〕
前記第1スイッチング素子および前記第2スイッチング素子は、前記第2方向を厚さ方向とする扁平な形状である、付記1または2に記載の半導体装置。
〔付記4〕
第1ゲート電極、第1ソース電極および第1ドレイン電極は、前記第2方向において前記第1コンデンサとは反対側に配置されている、付記3に記載の半導体装置。
〔付記5〕
第2ゲート電極、第2ソース電極および第2ドレイン電極は、前記第2方向において前記第1コンデンサとは反対側に配置されている、付記4に記載の半導体装置。
〔付記6〕
前記第1ドレイン電極と前記第1コンデンサに導通する第1導電部材と、
前記第2ソース電極と前記第1コンデンサに導通する第2導電部材と、を備える、付記5に記載の半導体装置。
〔付記7〕
前記第1導電部材は、前記第1ドレイン電極に導通接合された第1部と、前記第2方向において前記第1スイッチング素子に対して前記第1部とは反対側に配置され且つ前記第1コンデンサに導通接合された第2部と、を有する、付記6に記載の半導体装置。
〔付記8〕
前記第2導電部材は、前記第2ドレイン電極に導通接合された第1部と、前記第2方向において前記第2スイッチング素子に対して前記第2導電部材の前記第1部とは反対側に配置され且つ前記第1コンデンサに導通接合された第2部と、を有する、付記7に記載の半導体装置。
〔付記9〕
前記第1導電部材は、前記第1方向において前記第1スイッチング素子に対して前記第2スイッチング素子とは反対側に位置し且つ前記第1導電部材の前記第1部と前記第1導電部材の前記第2部とを連結する第3部を有する、付記8に記載の半導体装置。
〔付記10〕
前記第2導電部材は、前記第1方向において前記第2スイッチング素子に対して前記第1スイッチング素子とは反対側に位置し且つ前記第2導電部材の前記第1部と前記第2導電部材の前記第2部とを連結する第3部を有する、付記9に記載の半導体装置。
〔付記11〕
前記第1ソース電極および前記第2ドレイン電極に導通接合された第3導電部材をさらに備える、付記10に記載の半導体装置。
〔付記12〕
前記第3導電部材は、前記第1方向において前記第1導電部材の前記第1部と前記第2導電部材の前記第1部との間に位置する、付記11に記載の半導体装置。
〔付記13〕
前記第1方向および前記第2方向と直角である第3方向において、前記第1スイッチング素子および前記第2スイッチング素子に対して一方側に配置された集積回路素子をさらに備える、付記12に記載の半導体装置。
〔付記14〕
前記第1ゲート電極と前記集積回路素子とに接続された第4導電部材をさらに備える、付記13に記載の半導体装置。
〔付記15〕
前記第2ゲート電極と前記集積回路素子とに接続された第5導電部材をさらに備える、付記14に記載の半導体装置。
〔付記16〕
前記第1導電部材を構成する第1リード、前記第2導電部材を構成する第2リード、前記第3導電部材を構成する第3リード、前記第4導電部材を構成する第4リードおよび前記第5導電部材を構成する第5リード、を備える、付記15に記載の半導体装置。
〔付記17〕
前記第1スイッチング素子および前記第2スイッチング素子は、GaN系半導体からなる半導体層を含む、付記13ないし16のいずれかに記載の半導体装置。
Claims (17)
- 第1端子および第2端子と、
第1ゲート電極、第1ソース電極および第1ドレイン電極を有する第1スイッチング素子と、
第2ゲート電極、第2ソース電極および第2ドレイン電極を有する第2スイッチング素子と、を備え、
前記第1端子および前記第2端子間において前記第1スイッチング素子および前記第2スイッチング素子が直列に接続された半導体装置であって、
前記第1端子および前記第2端子間において前記第1スイッチング素子および前記第2スイッチング素子と並列に接続された第1コンデンサを備えており、
前記第1スイッチング素子および前記第2スイッチング素子は、第1方向に並べられており、
前記第1コンデンサは、前記第1方向と直角である第2方向視において、前記第1スイッチング素子および前記第2スイッチング素子の少なくともいずれかと重なる、半導体装置。 - 前記第1コンデンサは、前記第2方向視において、前記第1スイッチング素子および前記第2スイッチング素子の双方と重なる、請求項1に記載の半導体装置。
- 前記第1スイッチング素子および前記第2スイッチング素子は、前記第2方向を厚さ方向とする扁平な形状である、請求項1または2に記載の半導体装置。
- 第1ゲート電極、第1ソース電極および第1ドレイン電極は、前記第2方向において前記第1コンデンサとは反対側に配置されている、請求項3に記載の半導体装置。
- 第2ゲート電極、第2ソース電極および第2ドレイン電極は、前記第2方向において前記第1コンデンサとは反対側に配置されている、請求項4に記載の半導体装置。
- 前記第1ドレイン電極と前記第1コンデンサに導通する第1導電部材と、
前記第2ソース電極と前記第1コンデンサに導通する第2導電部材と、を備える、請求項5に記載の半導体装置。 - 前記第1導電部材は、前記第1ドレイン電極に導通接合された第1部と、前記第2方向において前記第1スイッチング素子に対して前記第1部とは反対側に配置され且つ前記第1コンデンサに導通接合された第2部と、を有する、請求項6に記載の半導体装置。
- 前記第2導電部材は、前記第2ドレイン電極に導通接合された第1部と、前記第2方向において前記第2スイッチング素子に対して前記第2導電部材の前記第1部とは反対側に配置され且つ前記第1コンデンサに導通接合された第2部と、を有する、請求項7に記載の半導体装置。
- 前記第1導電部材は、前記第1方向において前記第1スイッチング素子に対して前記第2スイッチング素子とは反対側に位置し且つ前記第1導電部材の前記第1部と前記第1導電部材の前記第2部とを連結する第3部を有する、請求項8に記載の半導体装置。
- 前記第2導電部材は、前記第1方向において前記第2スイッチング素子に対して前記第1スイッチング素子とは反対側に位置し且つ前記第2導電部材の前記第1部と前記第2導電部材の前記第2部とを連結する第3部を有する、請求項9に記載の半導体装置。
- 前記第1ソース電極および前記第2ドレイン電極に導通接合された第3導電部材をさらに備える、請求項10に記載の半導体装置。
- 前記第3導電部材は、前記第1方向において前記第1導電部材の前記第1部と前記第2導電部材の前記第1部との間に位置する、請求項11に記載の半導体装置。
- 前記第1方向および前記第2方向と直角である第3方向において、前記第1スイッチング素子および前記第2スイッチング素子に対して一方側に配置された集積回路素子をさらに備える、請求項12に記載の半導体装置。
- 前記第1ゲート電極と前記集積回路素子とに接続された第4導電部材をさらに備える、請求項13に記載の半導体装置。
- 前記第2ゲート電極と前記集積回路素子とに接続された第5導電部材をさらに備える、請求項14に記載の半導体装置。
- 前記第1導電部材を構成する第1リード、前記第2導電部材を構成する第2リード、前記第3導電部材を構成する第3リード、前記第4導電部材を構成する第4リードおよび前記第5導電部材を構成する第5リード、を備える、請求項15に記載の半導体装置。
- 前記第1スイッチング素子および前記第2スイッチング素子は、GaN系半導体からなる半導体層を含む、請求項13ないし16のいずれかに記載の半導体装置。
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