JPWO2015146936A1 - 保護膜形成フィルム、保護膜形成用シート、ワークまたは加工物の製造方法、検査方法、良品と判断されたワーク、および良品と判断された加工物 - Google Patents
保護膜形成フィルム、保護膜形成用シート、ワークまたは加工物の製造方法、検査方法、良品と判断されたワーク、および良品と判断された加工物 Download PDFInfo
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- JPWO2015146936A1 JPWO2015146936A1 JP2016510357A JP2016510357A JPWO2015146936A1 JP WO2015146936 A1 JPWO2015146936 A1 JP WO2015146936A1 JP 2016510357 A JP2016510357 A JP 2016510357A JP 2016510357 A JP2016510357 A JP 2016510357A JP WO2015146936 A1 JPWO2015146936 A1 JP WO2015146936A1
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- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- JOUDBUYBGJYFFP-FOCLMDBBSA-N thioindigo Chemical compound S\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2S1 JOUDBUYBGJYFFP-FOCLMDBBSA-N 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 238000001392 ultraviolet--visible--near infrared spectroscopy Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Abstract
Description
(1)フィラーを含有する保護膜形成フィルムであって、前記フィラーの平均粒径は0.4μm以下であることを特徴とする保護膜形成フィルム。
〔保護膜形成フィルム〕
本実施形態に係る保護膜形成フィルムは、ワークまたは当該ワークを加工して得られる加工物に保護膜を形成するためのものである。この保護膜は、保護膜形成フィルム、好ましくは硬化した保護膜形成フィルムから構成される。ワークとしては、例えば半導体ウエハ等が挙げられ、当該ワークを加工して得られる加工物としては、例えば半導体チップが挙げられるが、本発明はこれらに限定されるものではない。なお、ワークが半導体ウエハの場合、保護膜は、半導体ウエハの裏面側(バンプ等の電極が形成されていない側)に形成される。
保護膜形成フィルムは、未硬化の硬化性接着剤を含有することが好ましい。この場合、保護膜形成フィルムに半導体ウエハ等のワークを重ね合わせた後、保護膜形成フィルムを硬化させることにより、保護膜をワークに強固に接着することができ、耐久性を有する保護膜をチップ等に形成することができる。
(1)60度鏡面光沢度Gs(60°)
本実施形態に係る保護膜形成フィルムから形成された保護膜は、JIS Z8741:1997(ISO 2813:1994)に規定される60度鏡面光沢度Gs(60°)が40%以上であることが好ましい。本明細書において、60度鏡面光沢度Gs(60°)は、日本電色工業社製光沢計「VG 2000」を用いて測定された値を意味する。保護膜形成フィルムから形成された保護膜の60度鏡面光沢度Gs(60°)が40%以上であることにより、保護膜の印字視認性を高めることが容易となる。保護膜の印字視認性をより安定的に高める観点から、保護膜の60度鏡面光沢度Gs(60°)は50%以上であることが好ましく、60%以上であることがより好ましく、70%以上であることがさらに好ましく、80%以上であることが特に好ましい。保護膜の印字視認性を高める観点からは、保護膜の60度鏡面光沢度Gs(60°)の上限は限定されない。
本実施形態に係る保護膜形成フィルムは、波長550nmの光線透過率が20%以下であることが好ましい。本明細書における光線透過率は、いずれの波長においても、積分球を使用せずに測定した値とし、測定器具としては分光光度計を使用する。
図1は本発明の一実施形態に係る保護膜形成用シートの断面図である。図1に示すように、本実施形態に係る保護膜形成用シート2は、保護膜形成フィルム1と、保護膜形成フィルム1の一方の面(図1では下側の面)に積層された剥離シート21とを備えて構成される。ただし、剥離シート21は、保護膜形成用シート2の使用時に剥離されるものである。
図2は本発明の他の一実施形態に係る保護膜形成用シートの断面図である。図2に示すように、本実施形態に係る保護膜形成用シート3は、基材41の一方の面に粘着剤層42が積層されてなる粘着シート4と、粘着シート4の粘着剤層42側に積層された保護膜形成フィルム1と、保護膜形成フィルム1における粘着シート4とは反対側の周縁部に積層された治具用粘着剤層5とを備えて構成される。治具用粘着剤層5は、保護膜形成用シート3をリングフレーム等の治具に接着するための層である。
本実施形態に係る保護膜形成用シート3の粘着シート4は、基材41と、基材41の一方の面に積層された粘着剤層42とを備えて構成される。
粘着シート4の基材41は、ワークの加工、例えば半導体ウエハのダイシングおよびエキスパンディングに適するものであれば、その構成材料は特に限定されず、通常は樹脂系の材料を主材とするフィルム(以下「樹脂フィルム」という。)から構成される。
本実施形態に係る保護膜形成用シート3の粘着シート4が備える粘着剤層42は、非エネルギー線硬化性粘着剤から構成されてもよいし、エネルギー線硬化性粘着剤から構成されてもよい。非エネルギー線硬化性粘着剤としては、所望の粘着力および再剥離性を有するものが好ましく、例えば、アクリル系粘着剤、ゴム系粘着剤、シリコーン系粘着剤、ウレタン系粘着剤、ポリエステル系粘着剤、ポリビニルエーテル系粘着剤等を使用することができる。これらの中でも、保護膜形成フィルム1との密着性が高く、ダイシング工程等にてワークまたは加工物の脱落を効果的に抑制することのできるアクリル系粘着剤が好ましい。
保護膜形成用シート3は、好ましくは、保護膜形成フィルム1を含む第1の積層体と、粘着シート4を含む第2の積層体とを別々に作製した後、第1の積層体および第2の積層体を使用して、保護膜形成フィルム1と粘着シート4とを積層することにより製造することができるが、これに限定されるものではない。
本実施形態に係る保護膜形成用シート3を用いて、一例としてワークとしての半導体ウエハから、保護膜が形成されたチップ(加工物)を、改質層破壊式引張り分割による分割加工を含む製造方法により製造する方法を以下に説明する。
図3は本発明のさらに他の一実施形態に係る保護膜形成用シートの断面図である。図3に示すように、本実施形態に係る保護膜形成用シート3Aは、基材41の一方の面に粘着剤層42が積層されてなる粘着シート4と、粘着シート4の粘着剤層42側に積層された保護膜形成フィルム1とを備えて構成される。実施形態における保護膜形成フィルム1は、面方向にてワークとほぼ同じか、ワークよりも少し大きく形成されており、かつ粘着シート4よりも面方向に小さく形成されている。保護膜形成フィルム1が積層されていない部分の粘着剤層42は、リングフレーム等の治具に貼付することが可能となっている。
次の各成分を表1に示す配合比(固形分換算)で混合し、固形分濃度が61質量%となるようにメチルエチルケトンで希釈して、保護膜形成フィルム用塗布剤を調製した。
(A)重合体成分:n−ブチルアクリレート10質量部、メチルアクリレート70質量部、グリシジルメタクリレート5質量部、および2−ヒドロキシエチルアクリレート15質量部を共重合してなるアクリル系重合体(重量平均分子量:40万、ガラス転移温度:−1℃)
(B−1)ビスフェノールA型エポキシ樹脂(三菱化学社製「jER828」,23℃・1atmで液状,分子量370,軟化点93℃,エポキシ当量183〜194g/eq)(B−2)ビスフェノールA型エポキシ樹脂(三菱化学社製「jER1055」,23℃・1atmで固形,分子量1600,エポキシ当量800〜900g/eq)
(B−3)ジシクロペンタジエン型エポキシ樹脂(DIC社製「エピクロンHP−7200HH」,23℃・1atmで固形,軟化点88〜98℃,エポキシ当量255〜260g/eq)
(C−1)熱活性潜在性エポキシ樹脂硬化剤(ジシアンジアミド(ADEKA社製「アデカハードナーEH−3636AS」,活性水素量21g/eq))
(C−2)熱活性潜在性エポキシ樹脂硬化剤(ジシアンジアミド(三菱化学社製「DICY7」))
(D)硬化促進剤:2−フェニル−4,5−ジヒドロキシメチルイミダゾール(四国化成工業社製「キュアゾール2PHZ」)
(E−1)シリカフィラー(アドマテックス社製「YA050CMJA」,平均粒子径0.05μm)
(E−2)シリカフィラー(アドマテックス社製「SC2050MA」,平均粒子径0.5μm)
(E−3)シリカフィラー(アドマテックス社製「YC100CMLA」,平均粒子径0.1μm)
(E−4)シリカフィラー(アドマテックス社製「SC1050」をシランカップリング剤(信越化学工業社製「KBM1003」)でビニル基表面修飾したもの,平均粒子径0.3μm)
(F)シランカップリング剤(信越化学工業社製「KBM403」)
(G−1)着色剤(青色顔料):フタロシアニン系青色色素(Pigment Blue
15:3)を色素成分のスチレン−アクリル樹脂に対する質量比が1/3となるように顔料化した。
(G−2)着色剤(黄色顔料):イソインドリノン系黄色色素(Pigment Yellow 139)を色素成分のスチレン−アクリル樹脂に対する質量比が1/3となるように顔料化した。
(G−3)着色剤(赤色顔料):ジケトピロロピロール系赤色色素(Pigment Red264)を色素成分のスチレン−アクリル樹脂に対する質量比が1/3となるように顔料化した。
(H)着色剤:カーボンブラック(三菱化学社製「MA600B」,平均粒径28nm)
・カラム :TSKgelGMHXL(2本)、TSKgel2000HXLをこの順に連結したもの
・溶媒 :THF
・測定温度:40℃
・流速 :1ml/分
・検出器 :示差屈折計
・標準試料:ポリスチレン
保護膜形成フィルムを構成する各成分の種類および配合量を表1に示すように変更する以外、実施例1と同様にして保護膜形成用シートを製造した。
実施例および比較例で得られた保護膜形成用シートから第2の剥離シートを剥離し、保護膜形成用フィルムをシリコンウエハ(#200研磨、直径200mm、厚さ280μm)の研磨面に貼付した。貼付にはテープマウンター(リンテック社製、Adwill RAD−3600)を用いた。保護膜形成用フィルムから第1の剥離シートを剥離した後、シリコンウエハおよび保護膜形成用フィルムを、オーブン内において、大気雰囲気下、130℃で2時間加熱し、保護膜形成フィルムを熱硬化させて保護膜とした。こうして得られた保護膜付きシリコンウエハの保護膜側の面について、日本電色工業社製光沢計「VG
2000」を使用し、JIS Z8741:1997(ISO 2813:1994)に準拠して、60度鏡面光沢度(Gs(60°)、単位:%)を測定した。結果を表1に示す。
実施例および比較例で得られた保護膜形成用シートから第2の剥離シートを剥離し、オーブン内において、大気雰囲気下、130℃で2時間加熱し、保護膜形成フィルムを熱硬化させて保護膜とした。その後、第1の剥離シートを剥離した。
(工程1)
試験例1で得られた保護膜付きシリコンウエハに対して、グリーンレーザーマーカー(キーエンス社製,MD-S9910A)を用いて、下記条件でレーザー印字を行った。
波長:532nm
出力:3.0W
周波数:60kHz
スキャンスピード:500mm/s
印字文字:ABCD
文字サイズ:300μm(高さ)×250μm(幅)
文字間隔:50μm
(工程2)
工程1で得られた印字をデジタルマイクロスコープ(キーエンス社製,VHS−1000)を用いて100倍の倍率で観察し、下記3段階(A〜C)で評価した。
A:印字の認識が容易であり、かつ、印字が鮮明に見える。
B:印字の認識が容易である。
C:印字の認識が困難である。
結果を表1に示す。また、実施例1、3および4ならびに比較例1に係る印字された保護膜の観察画像を、図5から8に示す。
2…保護膜形成用シート
21…剥離シート
3,3A…保護膜形成用シート
4…粘着シート
41…基材
42…粘着剤層
5…治具用粘着剤層
6…半導体ウエハ
7…リングフレーム
Claims (18)
- フィラーを含有する保護膜形成フィルムであって、
前記フィラーの平均粒径は0.4μm以下であること
を特徴とする保護膜形成フィルム。 - 前記保護膜形成フィルムから形成された保護膜のJIS Z8741:1997(ISO 2813:1994)に規定される60度鏡面光沢度Gs(60°)が40%以上である、請求項1に記載の保護膜形成フィルム。
- 波長550nmの光線透過率が20%以下である、請求項1または2に記載の保護膜形成フィルム。
- 波長1064nmの光線透過率が50%以上である、請求項1〜3のいずれか一項に記載の保護膜形成フィルム。
- 波長1250nmの光線透過率が40%以上である、請求項1〜4のいずれか一項に記載の保護膜形成フィルム。
- 前記保護膜形成フィルムは有機系の着色剤を含有する、請求項1〜5のいずれか一項に記載の保護膜形成フィルム。
- 前記有機系の着色剤は顔料を含む、請求項6に記載の保護膜形成フィルム。
- 前記保護膜形成フィルムはエポキシ樹脂を含有する、請求項1〜7のいずれか一項に記載の保護膜形成フィルム。
- 前記エポキシ樹脂は、23℃、1atmで液状のエポキシ樹脂を少なくとも含む、請求項8に記載の保護膜形成フィルム。
- 前記エポキシ樹脂は、前記液状のエポキシ樹脂のみからなるか、または
前記エポキシ樹脂は、前記液状のエポキシ樹脂および23℃、1atmで固形のエポキシ樹脂を含有し、かつ、前記液状のエポキシ樹脂および前記固形のエポキシ樹脂の合計含有量に対する前記液状のエポキシ樹脂の含有割合が25質量%以上100質量%未満である、請求項9に記載の保護膜形成フィルム。 - 基材の一方の面側に粘着剤層が積層されてなる粘着シートと、
前記粘着シートの前記粘着剤層側に積層された、請求項1〜10のいずれか一項に記載の保護膜形成フィルムと
を備えたことを特徴とする保護膜形成用シート。 - 請求項1〜10のいずれか一項に記載の保護膜形成フィルム、または請求項11に記載の保護膜形成用シートを使用して、ワークまたは前記ワークが分割加工されてなる加工物に印字された保護膜を形成することを特徴とするワークまたは加工物の製造方法。
- 前記印字された保護膜は、前記保護膜形成フィルムの面または前記保護膜形成フィルムから形成された保護膜の面へのレーザー光を照射する印字工程を備える、請求項12に記載のワークまたは加工物の製造方法。
- 前記分割加工は、
前記ワーク内に設定された焦点に集束されるように赤外域のレーザー光を照射して、前記ワーク内部に改質層を形成し、
前記改質層が形成されたワークに力を付与して、前記改質層が形成されたワークを分割して複数の片状体を加工物として得る加工である、
請求項12または13に記載のワークまたは加工物の製造方法。 - 前記ワークは半導体ウエハであり、前記加工物は半導体チップである、請求項12〜14のいずれか一項に記載のワークまたは加工物の製造方法。
- 請求項12〜15のいずれか一項に記載の製造方法により製造されたワークまたは加工物について、赤外線を利用し、前記保護膜を介して検査を行うことを特徴とする検査方法。
- 請求項16に記載の検査方法に基づいて、良品と判断されたワーク。
- 請求項16に記載の検査方法に基づいて、良品と判断された加工物。
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JP6554738B2 (ja) | 2019-08-07 |
SG10201806898WA (en) | 2018-09-27 |
PH12016501824B1 (en) | 2016-11-07 |
PH12016501824A1 (en) | 2016-11-07 |
KR20160137533A (ko) | 2016-11-30 |
US20170130090A1 (en) | 2017-05-11 |
US10106700B2 (en) | 2018-10-23 |
TW201544571A (zh) | 2015-12-01 |
CN106104760A (zh) | 2016-11-09 |
SG11201607716PA (en) | 2016-11-29 |
CN106104760B (zh) | 2019-11-01 |
KR102356171B1 (ko) | 2022-01-26 |
WO2015146936A1 (ja) | 2015-10-01 |
TWI711682B (zh) | 2020-12-01 |
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