SG10201806898WA - Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product - Google Patents
Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate productInfo
- Publication number
- SG10201806898WA SG10201806898WA SG10201806898WA SG10201806898WA SG10201806898WA SG 10201806898W A SG10201806898W A SG 10201806898WA SG 10201806898W A SG10201806898W A SG 10201806898WA SG 10201806898W A SG10201806898W A SG 10201806898WA SG 10201806898W A SG10201806898W A SG 10201806898WA
- Authority
- SG
- Singapore
- Prior art keywords
- product
- protection membrane
- workpiece
- determined
- adequate
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0041—Optical brightening agents, organic pigments
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/40—Glass
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
- C09J2463/003—Presence of epoxy resin in the primer coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
- C09J2463/006—Presence of epoxy resin in the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
PROTECTION MEMBRANE FORMING FILM, PROTECTION MEMBRANE FORMING UTILIZATION SHEET, PRODUCTION METHOD AND INSPECTION METHOD FOR WORKPIECE OR PROCESSED PRODUCT, WORKPIECE DETERMINED AS ADEQUATE PRODUCT, AND PROCESSED PRODUCT DETERMINED AS ADEQUATE PRODUCT A protection membrane-forming film (1) containing a filler, wherein the average particle size of the filler is not more than 0.4µm, a protection membrane-forming sheet (2), a production method and an inspection method for a workpiece or a processed product which use the film and the sheet, and a workpiece and a processed product determined as adequate products by the inspection method. The protection membrane-forming film and the protection membrane- forming sheet of the invention enable the formation of a protection membrane having excellent print legibility when subjected to print processing by laser irradiation. FIG. 1
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014060968 | 2014-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201806898WA true SG10201806898WA (en) | 2018-09-27 |
Family
ID=54195449
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201806898WA SG10201806898WA (en) | 2014-03-24 | 2015-03-23 | Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product |
SG11201607716PA SG11201607716PA (en) | 2014-03-24 | 2015-03-23 | Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201607716PA SG11201607716PA (en) | 2014-03-24 | 2015-03-23 | Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product |
Country Status (8)
Country | Link |
---|---|
US (1) | US10106700B2 (en) |
JP (1) | JP6554738B2 (en) |
KR (1) | KR102356171B1 (en) |
CN (1) | CN106104760B (en) |
PH (1) | PH12016501824A1 (en) |
SG (2) | SG10201806898WA (en) |
TW (1) | TWI711682B (en) |
WO (1) | WO2015146936A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY186759A (en) * | 2014-08-22 | 2021-08-18 | Lintec Corp | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
CN117656639A (en) * | 2016-03-04 | 2024-03-08 | 琳得科株式会社 | Composite sheet for forming protective film |
JP6854811B2 (en) * | 2016-04-28 | 2021-04-07 | リンテック株式会社 | Method for manufacturing protective film forming film, protective film forming composite sheet, and semiconductor chip |
TWI721158B (en) * | 2016-04-28 | 2021-03-11 | 日商琳得科股份有限公司 | Protective film forming film and composite sheet for forming protective film |
KR102319730B1 (en) * | 2016-12-07 | 2021-11-02 | 후루카와 덴키 고교 가부시키가이샤 | Tape for semiconductor processing |
KR102448152B1 (en) * | 2017-10-27 | 2022-09-27 | 린텍 가부시키가이샤 | A film for forming a protective film, a composite sheet for forming a protective film, and a method for manufacturing a semiconductor chip |
JP7139153B2 (en) * | 2018-05-29 | 2022-09-20 | 日東電工株式会社 | Back adhesion film and dicing tape integrated back adhesion film |
JP7326103B2 (en) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7326102B2 (en) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7326100B2 (en) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7326101B2 (en) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP2022149804A (en) | 2021-03-25 | 2022-10-07 | リンテック株式会社 | Film for forming protective film |
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JP4351348B2 (en) | 2000-01-27 | 2009-10-28 | リンテック株式会社 | IC card manufacturing method having protective layer |
JP4659300B2 (en) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | Laser processing method and semiconductor chip manufacturing method |
JP3544362B2 (en) | 2001-03-21 | 2004-07-21 | リンテック株式会社 | Method for manufacturing semiconductor chip |
JP4869517B2 (en) | 2001-08-21 | 2012-02-08 | リンテック株式会社 | Adhesive tape |
JP3790220B2 (en) * | 2002-03-01 | 2006-06-28 | 大日本印刷株式会社 | Thermal transfer image protective sheet, protective layer forming method, and recorded matter obtained by the method |
DE60310282T2 (en) | 2002-03-01 | 2007-05-10 | Dai Nippon Printing Co., Ltd. | Thermally transferable image protection sheet, process for protective layer formation and recording produced by the process |
JP4364508B2 (en) * | 2002-12-27 | 2009-11-18 | リンテック株式会社 | Protective film forming sheet for chip back surface and manufacturing method of chip with protective film |
JP4494728B2 (en) | 2003-05-26 | 2010-06-30 | 株式会社ディスコ | Non-metallic substrate division method |
CN100428418C (en) | 2004-02-09 | 2008-10-22 | 株式会社迪斯科 | Method for cutting wafer |
JP4642436B2 (en) | 2004-11-12 | 2011-03-02 | リンテック株式会社 | Marking method and protective film forming and dicing sheet |
JP2006202933A (en) | 2005-01-20 | 2006-08-03 | Disco Abrasive Syst Ltd | Wafer dividing method |
JP4762671B2 (en) * | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | Dicing tape and semiconductor wafer dicing method |
KR100808720B1 (en) * | 2006-11-13 | 2008-02-29 | 삼성토탈 주식회사 | Polyethylene resin composition for packaging film |
US20110291300A1 (en) | 2009-02-12 | 2011-12-01 | Takashi Hirano | Dicing sheet-attached film for forming semiconductor protection film, method for producing semiconductor device using the same, and semiconductor device |
JP2011151362A (en) * | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface |
JP5501938B2 (en) | 2009-12-24 | 2014-05-28 | 日東電工株式会社 | Flip chip type film for semiconductor backside |
KR101859237B1 (en) * | 2010-01-27 | 2018-05-18 | 데이진 가부시키가이샤 | Film |
JP5554118B2 (en) * | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | Wafer processing tape |
US9911683B2 (en) | 2010-04-19 | 2018-03-06 | Nitto Denko Corporation | Film for back surface of flip-chip semiconductor |
JP5249290B2 (en) | 2010-07-20 | 2013-07-31 | 日東電工株式会社 | Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, semiconductor device manufacturing method, and flip chip type semiconductor device |
JP5367656B2 (en) * | 2010-07-29 | 2013-12-11 | 日東電工株式会社 | Flip chip type film for semiconductor back surface and use thereof |
JP5432853B2 (en) | 2010-07-30 | 2014-03-05 | 日東電工株式会社 | Dicing tape-integrated film for semiconductor back surface, manufacturing method thereof, and manufacturing method of semiconductor device |
JP5796628B2 (en) * | 2011-03-30 | 2015-10-21 | 宇部興産株式会社 | Polyimide film |
JP6001273B2 (en) | 2012-02-13 | 2016-10-05 | 信越化学工業株式会社 | Protective film for semiconductor wafer and method for manufacturing semiconductor chip |
DE102012205650A1 (en) * | 2012-04-05 | 2013-10-10 | Siemens Aktiengesellschaft | Insulating material for rotating machines |
JP6171280B2 (en) * | 2012-07-31 | 2017-08-02 | 味の素株式会社 | Manufacturing method of semiconductor device |
WO2014087947A1 (en) | 2012-12-03 | 2014-06-12 | リンテック株式会社 | Protective-membrane-forming film |
CN105934811B (en) | 2014-01-22 | 2020-07-17 | 琳得科株式会社 | Protective film forming film, protective film forming sheet, protective film forming composite sheet, and method for producing processed product |
-
2015
- 2015-03-23 JP JP2016510357A patent/JP6554738B2/en active Active
- 2015-03-23 US US15/127,378 patent/US10106700B2/en active Active
- 2015-03-23 KR KR1020167025696A patent/KR102356171B1/en active IP Right Grant
- 2015-03-23 CN CN201580015032.1A patent/CN106104760B/en active Active
- 2015-03-23 WO PCT/JP2015/058797 patent/WO2015146936A1/en active Application Filing
- 2015-03-23 SG SG10201806898WA patent/SG10201806898WA/en unknown
- 2015-03-23 SG SG11201607716PA patent/SG11201607716PA/en unknown
- 2015-03-24 TW TW104109313A patent/TWI711682B/en active
-
2016
- 2016-09-19 PH PH12016501824A patent/PH12016501824A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20170130090A1 (en) | 2017-05-11 |
CN106104760B (en) | 2019-11-01 |
KR20160137533A (en) | 2016-11-30 |
PH12016501824B1 (en) | 2016-11-07 |
TW201544571A (en) | 2015-12-01 |
PH12016501824A1 (en) | 2016-11-07 |
TWI711682B (en) | 2020-12-01 |
WO2015146936A1 (en) | 2015-10-01 |
US10106700B2 (en) | 2018-10-23 |
JP6554738B2 (en) | 2019-08-07 |
JPWO2015146936A1 (en) | 2017-04-13 |
CN106104760A (en) | 2016-11-09 |
KR102356171B1 (en) | 2022-01-26 |
SG11201607716PA (en) | 2016-11-29 |
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