JPWO2012002378A1 - 配線基板および撮像装置ならびに撮像装置モジュール - Google Patents
配線基板および撮像装置ならびに撮像装置モジュール Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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- H—ELECTRICITY
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
<第1の実施形態>
本発明の第1の実施形態における撮像モジュールは、図1に示す例のように撮像装置10と撮像装置10上に設けられたレンズ固定部材11とレンズ固定部材11に固定されたレンズ12とを有している。
<第2の実施形態>
本発明の第2の実施形態における撮像装置10において、第1の実施形態と異なる部分は、図4に示す例のように、絶縁基板1aの下面の周囲領域1bが貫通孔2を囲む傾斜領域1cと傾斜領域1cを囲む平坦領域1dとを有しており、複数の接続電極4が、平坦領域1dに設けられている点である。その他の構成については、第1の実施形態と同様である。
<第3の実施形態>
本発明の第3の実施形態における撮像装置10において、第1の実施形態と異なる部分は、図5に示す例のように、絶縁基板1aは下面のうち貫通孔2を囲む縁部分に凹み部を有している点である。その他の構成については、第1の実施形態と同様である。
<第4の実施形態>
本発明の第4の実施形態における撮像装置10において、第1の実施形態と異なる部分は、図6に示す例のように、絶縁基板1aは電子部品13が設けられる凹部14を含む上面を有している点および凹部14は平面視で傾斜領域1cの周囲に位置している点ならびに配線基板1が平板状に形成されている点である。その他の構成については、第1の実施形態と同様である。
1a・・・絶縁基板
1b・・・周囲領域
1c・・・傾斜領域
1d・・・平坦領域
2・・・・貫通孔
3・・・・配線導体
4・・・・接続電極
5・・・・外部端子
6・・・・撮像素子
6a・・・受光部
6b・・・接続端子
7・・・・キャビティ
8a・・・接続部材
8b・・・接合材
9・・・・透光性部材
10・・・・撮像装置
11・・・・レンズ固定部材
12・・・・レンズ
13・・・・電子部品
14・・・・凹部
Claims (8)
- 開口部を有している絶縁基板と、
該絶縁基板の下面のうち前記開口部の周囲領域に設けられており、撮像素子が電気的に接続される複数の接続電極とを備えており、
前記周囲領域が、前記開口部を囲んでおり、前記開口部に向かって下方へ傾斜している傾斜領域を有していることを特徴とする配線基板。 - 前記絶縁基板は、前記下面のうち前記開口部の縁部分に凹み部を有していることを特徴とする請求項1記載の配線基板。
- 前記周囲領域が、前記傾斜領域を囲む平坦領域を有しており、前記複数の接続電極が、前記平坦領域に設けられていることを特徴とする請求項1記載の配線基板。
- 前記絶縁基板は、電子部品が設けられる凹部を含む上面を有していることを特徴とする請求項1記載の配線基板。
- 前記凹部は、平面視で前記傾斜領域の周囲に位置していることを特徴とする請求項4記載の配線基板。
- 前記絶縁基板の上面が、前記開口部に向かって下方へ傾斜している傾斜領域を有していることを特徴とする請求項1記載の配線基板。
- 請求項1乃至請求項6のいずれかに記載された配線基板と、
該配線基板の前記絶縁基板の前記下面に搭載されており、前記複数の接続電極に電気的に接続された撮像素子とを備えていることを特徴とする撮像装置。 - 請求項7に記載された撮像装置と、
該撮像装置の前記開口部の上方に設けられたレンズとを具備することを特徴とする撮像装置モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2012522638A JP5491628B2 (ja) | 2010-06-28 | 2011-06-28 | 配線基板および撮像装置ならびに撮像装置モジュール |
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JP2010146463 | 2010-06-28 | ||
JP2010146463 | 2010-06-28 | ||
JP2012522638A JP5491628B2 (ja) | 2010-06-28 | 2011-06-28 | 配線基板および撮像装置ならびに撮像装置モジュール |
PCT/JP2011/064794 WO2012002378A1 (ja) | 2010-06-28 | 2011-06-28 | 配線基板および撮像装置ならびに撮像装置モジュール |
Publications (2)
Publication Number | Publication Date |
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JPWO2012002378A1 true JPWO2012002378A1 (ja) | 2013-08-29 |
JP5491628B2 JP5491628B2 (ja) | 2014-05-14 |
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Country | Link |
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US (1) | US20130128109A1 (ja) |
EP (1) | EP2587793B1 (ja) |
JP (1) | JP5491628B2 (ja) |
KR (1) | KR20130120981A (ja) |
CN (1) | CN102893593B (ja) |
WO (1) | WO2012002378A1 (ja) |
Cited By (1)
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JP2022097355A (ja) * | 2020-12-18 | 2022-06-30 | 海華科技股▲分▼有限公司 | 携帯電子機器及びそのカスタマイズ画像取得モジュール |
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CN104321861B (zh) * | 2012-05-31 | 2017-10-20 | 京瓷株式会社 | 电子元件搭载用基板以及电子装置 |
JP6022888B2 (ja) * | 2012-10-19 | 2016-11-09 | 京セラ株式会社 | 電子素子搭載用基板および電子装置 |
JP6150249B2 (ja) * | 2013-02-25 | 2017-06-21 | 京セラ株式会社 | 電子デバイスのガラス封止方法 |
US9608020B2 (en) * | 2013-10-23 | 2017-03-28 | Kyocera Corporation | Imaging element mounting substrate and imaging device |
CN105280630B (zh) * | 2014-06-10 | 2019-01-01 | 意法半导体(格勒诺布尔2)公司 | 包括光学传感器芯片的电子设备 |
KR20160080166A (ko) * | 2014-12-29 | 2016-07-07 | 에스케이하이닉스 주식회사 | 이미지 센서 내장형 패키지 및 그 제조방법 |
US10771666B2 (en) | 2015-12-01 | 2020-09-08 | Ningbo Sunny Opotech Co., Ltd. | Image capturing module and electrical support thereof |
CN105472215A (zh) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | 具有电气支架的摄像模组及其组装方法和应用 |
CN105530413B (zh) * | 2015-12-01 | 2019-08-30 | 宁波舜宇光电信息有限公司 | 摄像模组及其电气支架和线路导通方法 |
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- 2011-06-28 CN CN201180024080.9A patent/CN102893593B/zh active Active
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- 2011-06-28 US US13/701,443 patent/US20130128109A1/en not_active Abandoned
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EP2587793A4 (en) | 2014-04-16 |
KR20130120981A (ko) | 2013-11-05 |
US20130128109A1 (en) | 2013-05-23 |
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CN102893593B (zh) | 2016-11-23 |
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EP2587793A1 (en) | 2013-05-01 |
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