JPWO2007072616A1 - 部品内蔵モジュールおよびその製造方法 - Google Patents
部品内蔵モジュールおよびその製造方法 Download PDFInfo
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- JPWO2007072616A1 JPWO2007072616A1 JP2007509813A JP2007509813A JPWO2007072616A1 JP WO2007072616 A1 JPWO2007072616 A1 JP WO2007072616A1 JP 2007509813 A JP2007509813 A JP 2007509813A JP 2007509813 A JP2007509813 A JP 2007509813A JP WO2007072616 A1 JPWO2007072616 A1 JP WO2007072616A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
A1 サブモジュール
1 モジュール基板
2 配線電極(第1配線)
3 ビア導体
4 シールド電極
5 端子電極
7 第1回路部品
10 サブモジュール基板
11 配線電極(第2配線)
12 ビア導体
13 内部導体
14 端子電極
15 第2回路部品
15a 集積回路素子
15b 個別受動部品
20 絶縁樹脂層
21 シールド層
22 ビア導体
30 支持板
Claims (9)
- 上面に第1の配線を有するモジュール基板と、
上記モジュール基板の第1の配線上に実装された第1の回路部品と、
上記モジュール基板より小面積に形成され、上記第1の回路部品が実装された箇所以外のモジュール基板の第1の配線上に実装され、上面に第2の配線を有するサブモジュール基板と、
上記サブモジュール基板の第2の配線上に実装された第2の回路部品と、
上記モジュール基板の上面全面に、上記第1の回路部品、上記第2の回路部品および上記サブモジュール基板を包み込むように形成された絶縁樹脂層と、を備えたことを特徴とする部品内蔵モジュール。 - 絶縁樹脂層と、
上記絶縁樹脂層の下面に設けられた第1の配線と、
上記第1の配線上に実装され、上記絶縁樹脂層に埋設された第1の回路部品と、
上記絶縁樹脂層より小面積に形成され、上記第1の回路部品が埋設された箇所以外の上記絶縁樹脂層に埋設され、上面に第2の配線を有するサブモジュール基板と、
上記サブモジュール基板の第2の配線上に実装され、上記絶縁樹脂層に埋設された第2の回路部品と、を備えたことを特徴とする部品内蔵モジュール。 - 上記第2の回路部品は多数の端子を持つ集積回路素子を含み、
上記集積回路素子の各端子は上記サブモジュール基板の第2の配線とそれぞれ接続固定されており、
上記サブモジュール基板の下面には、上記第1の配線と接続固定される端子電極が形成されていることを特徴とする請求項1または2に記載の部品内蔵モジュール。 - 上記第1の回路部品は、上記集積回路素子より端子数の少ない個別回路部品であることを特徴とする請求項3に記載の部品内蔵モジュール。
- 上記第1の回路部品は、上記第2の回路部品より背丈の高い回路部品を含むことを特徴とする請求項1ないし4のいずれか1項に記載の部品内蔵モジュール。
- 上記サブモジュール基板は間隔をあけて複数個配置されており、
上記サブモジュール基板が配置された部位の中間位置に上記第1の回路部品が配置されていることを特徴とする請求項1ないし5のいずれか1項に記載の部品内蔵モジュール。 - 上記絶縁樹脂層の上面にシールド層が設けられており、
上記第1の配線または上記第2の配線はグランド電極を含み、
上記シールド層と上記グランド電極とを接続するビア導体が上記絶縁樹脂層に形成されていることを特徴とする請求項1ないし6のいずれか1項に記載の部品内蔵モジュール。 - 上面に第1の配線が形成されたモジュール基板を準備する工程と、
上記モジュール基板の第1の配線上に第1の回路部品を実装する工程と、
上記モジュール基板より小面積に形成され、上面に第2の配線を有するサブモジュール基板を準備する工程と、
上記第2の配線上に第2の回路部品を実装する工程と、
上記モジュール基板の第1の回路部品を実装する箇所以外のモジュール基板の第1の配線上に、上記第2の回路部品を実装済みのサブモジュール基板を実装する工程と、
上記モジュール基板の上面全面に、上記第1の回路部品、上記第2の回路部品および上記サブモジュール基板を包み込むように絶縁樹脂層を形成する工程と、を含む部品内蔵モジュールの製造方法。 - 支持板上に第1の配線を形成する工程と、
上記第1の配線上に第1の回路部品を実装する工程と、
上面に第2の配線を有するサブモジュール基板を準備する工程と、
上記第2の配線上に第2の回路部品を実装する工程と、
上記第1の回路部品を実装する箇所以外の上記支持板上に、上記第2の回路部品を実装済みのサブモジュール基板を配置する工程と、
上記支持板の上面に、上記第1の回路部品、上記第2の回路部品および上記サブモジュール基板を包み込むように絶縁樹脂層を形成する工程と、
上記絶縁樹脂層の硬化後に上記支持板から上記絶縁樹脂層を剥離する工程と、を含む部品内蔵モジュールの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2005369685 | 2005-12-22 | ||
JP2005369685 | 2005-12-22 | ||
PCT/JP2006/319937 WO2007072616A1 (ja) | 2005-12-22 | 2006-10-05 | 部品内蔵モジュールおよびその製造方法 |
Publications (1)
Publication Number | Publication Date |
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JPWO2007072616A1 true JPWO2007072616A1 (ja) | 2009-05-28 |
Family
ID=38188399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007509813A Pending JPWO2007072616A1 (ja) | 2005-12-22 | 2006-10-05 | 部品内蔵モジュールおよびその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070170582A1 (ja) |
EP (1) | EP1965615A4 (ja) |
JP (1) | JPWO2007072616A1 (ja) |
KR (2) | KR100901985B1 (ja) |
CN (1) | CN101080958A (ja) |
WO (1) | WO2007072616A1 (ja) |
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WO2008136251A1 (ja) | 2007-05-02 | 2008-11-13 | Murata Manufacturing Co., Ltd. | 部品内蔵モジュール及びその製造方法 |
JP2009038111A (ja) * | 2007-07-31 | 2009-02-19 | Toshiba Corp | 半導体パッケージ、プリント配線板構造および電子機器 |
TWI360207B (en) | 2007-10-22 | 2012-03-11 | Advanced Semiconductor Eng | Chip package structure and method of manufacturing |
JP2009260272A (ja) * | 2008-03-25 | 2009-11-05 | Panasonic Corp | 基板の加工方法および半導体チップの製造方法ならびに樹脂接着層付き半導体チップの製造方法 |
US20100020518A1 (en) * | 2008-07-28 | 2010-01-28 | Anadigics, Inc. | RF shielding arrangement for semiconductor packages |
US8569894B2 (en) | 2010-01-13 | 2013-10-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
JP5468940B2 (ja) * | 2010-03-03 | 2014-04-09 | セイコーインスツル株式会社 | パッケージの製造方法 |
TWI411075B (zh) | 2010-03-22 | 2013-10-01 | Advanced Semiconductor Eng | 半導體封裝件及其製造方法 |
CN102835193A (zh) * | 2010-04-15 | 2012-12-19 | 古河电气工业株式会社 | 基板以及基板的制造方法 |
WO2011148915A1 (ja) | 2010-05-26 | 2011-12-01 | 株式会社村田製作所 | モジュール基板およびその製造方法 |
KR101147343B1 (ko) | 2010-05-28 | 2012-05-22 | 엘지이노텍 주식회사 | 복수의 소자가 내장된 집적 인쇄회로기판 및 그 제조 방법 |
KR101118817B1 (ko) | 2010-07-05 | 2012-03-12 | 삼성전기주식회사 | 다층 임베디드 인쇄회로기판 및 이의 제조 방법 |
US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
JP2012151353A (ja) * | 2011-01-20 | 2012-08-09 | Sharp Corp | 半導体モジュール |
KR101175901B1 (ko) | 2011-10-25 | 2012-08-23 | 삼성전기주식회사 | 다층 임베디드 인쇄회로기판 및 이의 제조 방법 |
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JP6003532B2 (ja) * | 2012-10-25 | 2016-10-05 | 株式会社村田製作所 | 部品内蔵基板およびその製造方法 |
US9300254B2 (en) | 2014-06-26 | 2016-03-29 | Freescale Semiconductor Inc. | Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof |
JP6202177B1 (ja) * | 2016-01-21 | 2017-09-27 | 東洋インキScホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
DE102016217452A1 (de) * | 2016-09-13 | 2017-10-26 | Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | Verfahren zur Herstellung eines Schaltungsträgers und einer elektrischen Schaltung |
US20180374798A1 (en) * | 2017-06-24 | 2018-12-27 | Amkor Technology, Inc. | Semiconductor device having emi shielding structure and related methods |
CN107613640B (zh) * | 2017-08-16 | 2020-03-17 | 福建联迪商用设备有限公司 | 一种表面贴装方法和印刷电路板组件 |
CN109727928B (zh) * | 2017-10-30 | 2021-02-26 | 长鑫存储技术有限公司 | 具有电磁干扰屏蔽的半导体封装结构及制造方法 |
US11031373B2 (en) * | 2019-03-29 | 2021-06-08 | International Business Machines Corporation | Spacer for die-to-die communication in an integrated circuit |
US11362036B2 (en) * | 2020-01-06 | 2022-06-14 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
WO2022080360A1 (ja) * | 2020-10-16 | 2022-04-21 | 株式会社村田製作所 | 電子部品モジュール、サブモジュールおよびその製造方法 |
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2006
- 2006-10-05 CN CNA2006800009989A patent/CN101080958A/zh active Pending
- 2006-10-05 KR KR1020087014059A patent/KR100901985B1/ko active IP Right Grant
- 2006-10-05 EP EP06811275A patent/EP1965615A4/en not_active Withdrawn
- 2006-10-05 JP JP2007509813A patent/JPWO2007072616A1/ja active Pending
- 2006-10-05 WO PCT/JP2006/319937 patent/WO2007072616A1/ja active Application Filing
- 2006-10-05 KR KR1020077010489A patent/KR100877292B1/ko active IP Right Grant
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2007
- 2007-04-05 US US11/696,919 patent/US20070170582A1/en not_active Abandoned
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JPS6375069U (ja) * | 1986-11-04 | 1988-05-19 | ||
JPH05136558A (ja) * | 1991-11-11 | 1993-06-01 | Fujitsu Ltd | プリント板ユニツトの実装方法 |
JPH08191128A (ja) * | 1995-01-09 | 1996-07-23 | Hitachi Ltd | 電子装置 |
JP2001177043A (ja) * | 1999-12-15 | 2001-06-29 | Matsushita Electric Ind Co Ltd | 電子モジュール |
JP2002290051A (ja) * | 2001-01-19 | 2002-10-04 | Matsushita Electric Ind Co Ltd | 部品内蔵モジュールとその製造方法 |
Also Published As
Publication number | Publication date |
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CN101080958A (zh) | 2007-11-28 |
KR100901985B1 (ko) | 2009-06-08 |
KR20080064203A (ko) | 2008-07-08 |
EP1965615A1 (en) | 2008-09-03 |
EP1965615A4 (en) | 2009-11-11 |
KR20070100239A (ko) | 2007-10-10 |
US20070170582A1 (en) | 2007-07-26 |
WO2007072616A1 (ja) | 2007-06-28 |
KR100877292B1 (ko) | 2009-01-07 |
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