JPS6469534A - Method for cutting workpiece, such as glass - Google Patents

Method for cutting workpiece, such as glass

Info

Publication number
JPS6469534A
JPS6469534A JP62227185A JP22718587A JPS6469534A JP S6469534 A JPS6469534 A JP S6469534A JP 62227185 A JP62227185 A JP 62227185A JP 22718587 A JP22718587 A JP 22718587A JP S6469534 A JPS6469534 A JP S6469534A
Authority
JP
Japan
Prior art keywords
workpiece
streak
cut
pressurizing piece
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62227185A
Other languages
English (en)
Inventor
Kazuo Sato
Kunio Saeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP62227185A priority Critical patent/JPS6469534A/ja
Priority to FR888800837A priority patent/FR2620440B1/fr
Priority to GB8801884A priority patent/GB2209747B/en
Priority to DE3802700A priority patent/DE3802700C2/de
Priority to MX011500A priority patent/MX169801B/es
Publication of JPS6469534A publication Critical patent/JPS6469534A/ja
Priority to US07/572,339 priority patent/US5016800A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP62227185A 1987-09-10 1987-09-10 Method for cutting workpiece, such as glass Pending JPS6469534A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP62227185A JPS6469534A (en) 1987-09-10 1987-09-10 Method for cutting workpiece, such as glass
FR888800837A FR2620440B1 (fr) 1987-09-10 1988-01-26 Procede de decoupage d'une piece, en particulier d'une plaque de verre ou de ceramique
GB8801884A GB2209747B (en) 1987-09-10 1988-01-28 Method of cutting workpiece
DE3802700A DE3802700C2 (de) 1987-09-10 1988-01-29 Verfahren zum Schneiden eines Werkstücks, beispielsweise einer Glasplatte oder einer Keramikplatte
MX011500A MX169801B (es) 1987-09-10 1988-05-16 Metodo para cortar una pieza de trabajo
US07/572,339 US5016800A (en) 1987-09-10 1990-08-23 Method of cutting workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62227185A JPS6469534A (en) 1987-09-10 1987-09-10 Method for cutting workpiece, such as glass

Publications (1)

Publication Number Publication Date
JPS6469534A true JPS6469534A (en) 1989-03-15

Family

ID=16856821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62227185A Pending JPS6469534A (en) 1987-09-10 1987-09-10 Method for cutting workpiece, such as glass

Country Status (6)

Country Link
US (1) US5016800A (ja)
JP (1) JPS6469534A (ja)
DE (1) DE3802700C2 (ja)
FR (1) FR2620440B1 (ja)
GB (1) GB2209747B (ja)
MX (1) MX169801B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10279320A (ja) * 1997-03-31 1998-10-20 Hoya Corp 塊状素材の製造方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07100615B2 (ja) * 1988-03-29 1995-11-01 和郎 佐藤 ガラス加工物切断装置
AT399143B (de) * 1989-06-05 1995-03-27 Lisec Peter Verfahren und vorrichtung zum zerteilen einer glastafel
CH685199A5 (de) * 1992-05-01 1995-04-28 Bystronic Masch Plattenschneideverfahren.
JP3227800B2 (ja) * 1992-06-30 2001-11-12 富士ゼロックス株式会社 脆性板切断方法およびその装置
EP0847317B1 (en) * 1995-08-31 2003-08-27 Corning Incorporated Method and apparatus for breaking brittle materials
US6412677B1 (en) * 1998-09-16 2002-07-02 Hoya Corporation Cutting method for plate glass mother material
US6402004B1 (en) * 1998-09-16 2002-06-11 Hoya Corporation Cutting method for plate glass mother material
DE10192558D2 (de) * 2000-06-21 2004-04-15 Schott Glas Verfahren zur Herstellung von Glassubstraten für elektronische Speichermedien
DE10030388A1 (de) 2000-06-21 2002-01-03 Schott Glas Verfahren zur Herstellung von Glassubstraten für elektronische Speichermedien
TW515781B (en) * 2001-07-27 2003-01-01 Hannstar Display Corp Method for dividing fragile material and laminated glass
TWI494284B (zh) 2010-03-19 2015-08-01 Corning Inc 強化玻璃之機械劃割及分離
US8864005B2 (en) 2010-07-16 2014-10-21 Corning Incorporated Methods for scribing and separating strengthened glass substrates
US10065340B2 (en) * 2011-11-10 2018-09-04 LatticeGear, LLC Device and method for cleaving
US10773420B2 (en) 2011-11-10 2020-09-15 LatticeGear, LLC Device and method for cleaving a substrate
US10351460B2 (en) 2012-05-22 2019-07-16 Corning Incorporated Methods of separating strengthened glass sheets by mechanical scribing
IT201700019300A1 (it) * 2017-02-21 2018-08-21 Nuova Ceram Casa S P A Metodo di produzione di listelli coprispigolo in materiale ceramico

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107800A (en) * 1980-12-19 1982-07-05 Casio Computer Co Ltd Method of cutting hard board
JPS58132728A (ja) * 1982-02-02 1983-08-08 Canon Inc 光学セルの製造法
JPS63166734A (ja) * 1986-12-26 1988-07-09 Matsushita Electric Ind Co Ltd 平板ガラス分断装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2504655A (en) * 1947-02-06 1950-04-18 Dallas John Method of and apparatus for cutting and breaking sheet glass
GB742809A (en) * 1953-04-09 1956-01-04 Bjorn Bakke An improved method and device for the "opening" of glass cuts
FR1211447A (fr) * 1958-07-17 1960-03-16 Lignes Telegraph Telephon Outillage de découpe de plaques minces
US3396452A (en) * 1965-06-02 1968-08-13 Nippon Electric Co Method and apparatus for breaking a semiconductor wafer into elementary pieces
SE354915B (ja) * 1966-05-24 1973-03-26 Lkb Produkter Ab
US3559855A (en) * 1969-02-19 1971-02-02 Gen Electric Shimless scribing
US3578227A (en) * 1969-10-01 1971-05-11 Transitron Electronic Corp Method of breaking dice
ES177121Y (es) * 1972-01-28 1973-03-16 Hermanos Boada, S. A. Dispositivo para partir piezas planas de construccion.
US4106683A (en) * 1977-08-11 1978-08-15 Libbey-Owens-Ford Company Glass breaking out apparatus
US4225072A (en) * 1979-02-09 1980-09-30 Reeves Max D Glass cutter for fracturing prescored glass

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107800A (en) * 1980-12-19 1982-07-05 Casio Computer Co Ltd Method of cutting hard board
JPS58132728A (ja) * 1982-02-02 1983-08-08 Canon Inc 光学セルの製造法
JPS63166734A (ja) * 1986-12-26 1988-07-09 Matsushita Electric Ind Co Ltd 平板ガラス分断装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10279320A (ja) * 1997-03-31 1998-10-20 Hoya Corp 塊状素材の製造方法

Also Published As

Publication number Publication date
FR2620440A1 (fr) 1989-03-17
GB2209747B (en) 1991-05-29
FR2620440B1 (fr) 1994-10-14
DE3802700C2 (de) 1995-02-09
DE3802700A1 (de) 1989-03-23
US5016800A (en) 1991-05-21
GB2209747A (en) 1989-05-24
GB8801884D0 (en) 1988-02-24
MX169801B (es) 1993-07-27

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