JPS649629A - Method for supplying and compressing solder - Google Patents
Method for supplying and compressing solderInfo
- Publication number
- JPS649629A JPS649629A JP16443087A JP16443087A JPS649629A JP S649629 A JPS649629 A JP S649629A JP 16443087 A JP16443087 A JP 16443087A JP 16443087 A JP16443087 A JP 16443087A JP S649629 A JPS649629 A JP S649629A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- clamper
- compressing
- cutting
- knife edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To improve accuracy and reliability in bonding, by supplying solder to a base assembling part of a lead frame and the like, cutting a required minute amount of the solder with a knife edge, and compressing the solder with a compressing tool at the same time. CONSTITUTION:With a solder 7 being kept with a clamper 8, the clamper 8 advances. When the minute amount of the solder 7 is pushed out, a knife edge 3, a compressing tool 5, the clamper 8 and the solder 7 are simultaneously lowered, and the solder 7 is cut. Then, the compressing tool is lowered, and the cut solder is compressed to a lead frame 12. The clamper 8 releases the solder 7. The clamper 8 is retreated by the supplied length of the solder. The clamper 8 holds the solder 7 again and 15 further retreated. The solder 7 is separated, and cutting is ensured. Thereafter, the compressing with the compressing tool 5 is completed. Ultrasonic waves are applied to the knife edge 3 and the compressing tool 5. Thus the cutting of the solder at a low temperature is performed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16443087A JPS649629A (en) | 1987-07-01 | 1987-07-01 | Method for supplying and compressing solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16443087A JPS649629A (en) | 1987-07-01 | 1987-07-01 | Method for supplying and compressing solder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS649629A true JPS649629A (en) | 1989-01-12 |
Family
ID=15793006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16443087A Pending JPS649629A (en) | 1987-07-01 | 1987-07-01 | Method for supplying and compressing solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS649629A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0473943U (en) * | 1990-10-31 | 1992-06-29 | ||
US20130134210A1 (en) * | 2011-11-25 | 2013-05-30 | Aya Muto | Joining method and semiconductor device manufacturing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5237452B2 (en) * | 1973-04-26 | 1977-09-22 | ||
JPS59150434A (en) * | 1983-02-07 | 1984-08-28 | Toshiba Corp | Manufacture and apparatus of semiconductor device |
JPS62269324A (en) * | 1986-05-19 | 1987-11-21 | Nec Corp | Pellet-mounting unit |
JPS63232340A (en) * | 1987-11-13 | 1988-09-28 | Sanyo Electric Co Ltd | Device for applying foil |
-
1987
- 1987-07-01 JP JP16443087A patent/JPS649629A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5237452B2 (en) * | 1973-04-26 | 1977-09-22 | ||
JPS59150434A (en) * | 1983-02-07 | 1984-08-28 | Toshiba Corp | Manufacture and apparatus of semiconductor device |
JPS62269324A (en) * | 1986-05-19 | 1987-11-21 | Nec Corp | Pellet-mounting unit |
JPS63232340A (en) * | 1987-11-13 | 1988-09-28 | Sanyo Electric Co Ltd | Device for applying foil |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0473943U (en) * | 1990-10-31 | 1992-06-29 | ||
US20130134210A1 (en) * | 2011-11-25 | 2013-05-30 | Aya Muto | Joining method and semiconductor device manufacturing method |
US8746538B2 (en) * | 2011-11-25 | 2014-06-10 | Mitsubishi Electric Corporation | Joining method and semiconductor device manufacturing method |
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