JPS6464254A - Solid-state image sensor and manufacture thereof - Google Patents

Solid-state image sensor and manufacture thereof

Info

Publication number
JPS6464254A
JPS6464254A JP62220770A JP22077087A JPS6464254A JP S6464254 A JPS6464254 A JP S6464254A JP 62220770 A JP62220770 A JP 62220770A JP 22077087 A JP22077087 A JP 22077087A JP S6464254 A JPS6464254 A JP S6464254A
Authority
JP
Japan
Prior art keywords
solid
state image
pickup device
image pickup
transparent resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62220770A
Other languages
Japanese (ja)
Other versions
JPH0821702B2 (en
Inventor
Shigeru Sato
Kuniaki Tsurushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62220770A priority Critical patent/JPH0821702B2/en
Publication of JPS6464254A publication Critical patent/JPS6464254A/en
Publication of JPH0821702B2 publication Critical patent/JPH0821702B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To completely prevent deterioration of image quality due to water drops, by curing liquid transparent resin for sealing a solid-state image pickup device with the resin. CONSTITUTION:A semiconductor chip (solid-state image pickup device) 3 of a CCD image sensor is bonded at the center of a bed 2b through a conductive adhesive layer 4. A plurality of electrodes formed on the inner surface of the chip are connected to respective inner leads at the ends of leads 2a introduced from the side walls of an envelope 1, by means of bonding wires 5 formed of aluminum, gold or the like. A transparent resin 8 such as epoxy resin is injected in the liquid state and then cured so that the inside of the envelope 1 is filled with the transparent resin. Thereby, the solid-state image pickup device 3 can be sealed with the resin together with the inner leads at the proximal ends of the leads 2a while the transparent resin body 8 can be formed such that it has the top face 8a parallel with the surface 3a of the solid-state image pickup device 3.
JP62220770A 1987-09-03 1987-09-03 Solid-state imaging device and manufacturing method thereof Expired - Fee Related JPH0821702B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62220770A JPH0821702B2 (en) 1987-09-03 1987-09-03 Solid-state imaging device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62220770A JPH0821702B2 (en) 1987-09-03 1987-09-03 Solid-state imaging device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPS6464254A true JPS6464254A (en) 1989-03-10
JPH0821702B2 JPH0821702B2 (en) 1996-03-04

Family

ID=16756286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62220770A Expired - Fee Related JPH0821702B2 (en) 1987-09-03 1987-09-03 Solid-state imaging device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPH0821702B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428454U (en) * 1990-06-28 1992-03-06
JPH11340480A (en) * 1998-05-21 1999-12-10 Tokai Rika Co Ltd Plastic package
JP2007194737A (en) * 2006-01-17 2007-08-02 Matsushita Electric Ind Co Ltd Solid-state imaging apparatus and manufacturing method therefor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS551116A (en) * 1978-06-16 1980-01-07 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS56116649A (en) * 1980-02-19 1981-09-12 Matsushita Electric Ind Co Ltd Manufacturing of semiconductor device
JPS5943526A (en) * 1982-09-03 1984-03-10 Matsushita Electric Works Ltd Manufacture of resin sealed type electronic part
JPS5999405A (en) * 1982-11-29 1984-06-08 Dainippon Printing Co Ltd Manufacture of color separation filter
JPS60136254A (en) * 1983-12-23 1985-07-19 Toshiba Corp Solid-state image pickup device and manufacture thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS551116A (en) * 1978-06-16 1980-01-07 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS56116649A (en) * 1980-02-19 1981-09-12 Matsushita Electric Ind Co Ltd Manufacturing of semiconductor device
JPS5943526A (en) * 1982-09-03 1984-03-10 Matsushita Electric Works Ltd Manufacture of resin sealed type electronic part
JPS5999405A (en) * 1982-11-29 1984-06-08 Dainippon Printing Co Ltd Manufacture of color separation filter
JPS60136254A (en) * 1983-12-23 1985-07-19 Toshiba Corp Solid-state image pickup device and manufacture thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428454U (en) * 1990-06-28 1992-03-06
JPH11340480A (en) * 1998-05-21 1999-12-10 Tokai Rika Co Ltd Plastic package
JP2007194737A (en) * 2006-01-17 2007-08-02 Matsushita Electric Ind Co Ltd Solid-state imaging apparatus and manufacturing method therefor

Also Published As

Publication number Publication date
JPH0821702B2 (en) 1996-03-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees