JPS63152156A - Resin sealed type package - Google Patents
Resin sealed type packageInfo
- Publication number
- JPS63152156A JPS63152156A JP30077286A JP30077286A JPS63152156A JP S63152156 A JPS63152156 A JP S63152156A JP 30077286 A JP30077286 A JP 30077286A JP 30077286 A JP30077286 A JP 30077286A JP S63152156 A JPS63152156 A JP S63152156A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thermosetting resin
- reliability
- package
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 239000008188 pellet Substances 0.000 abstract description 6
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 235000012771 pancakes Nutrition 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、樹脂封止型半導体装置用パッケージに関し、
特に封止時の熱歪によって発生する霊気特性の変動を防
止することの出来る樹脂封止型の中空パッケージを提供
するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a resin-sealed package for a semiconductor device,
In particular, the present invention provides a resin-sealed hollow package that can prevent fluctuations in aether characteristics caused by thermal distortion during sealing.
中空パッケージと云えば、セラミック系の材料を用いた
パッケージがある。又、樹脂系の中空パッケージは、あ
らかじめプリフォームした熱可塑性樹脂製の容器を溶融
圧着して成る日立化成工業ＫＫＭのＰＣＰ （プラスチ
ックキャビティーパッケージ）がある。Speaking of hollow packages, there are packages that use ceramic materials. Another example of a resin-based hollow package is Hitachi Chemical KKM's PCP (plastic cavity package), which is made by melt-pressing a preformed thermoplastic resin container.
上述したセラミック系のパッケージは、パッケージその
ものの原価も高く、又、生産性も低いため非常に高価で
ある。The ceramic package described above is very expensive because the cost of the package itself is high and productivity is low.
又、ＰＣＰは安価に生産出来るが、リードフレームと樹
脂との密着性が悪く、信頼度、特に耐湿信頼度に劣る欠
点がある。さらに、ＰＣＰは溶融圧着するため、熱可塑
性樹脂の溶融温度以上の温度、かつ、局部的、即ち圧着
部分のみを加熱する必要があるため、大規模な接合機械
が必要である。Further, although PCP can be produced at low cost, it has the disadvantage of poor adhesion between the lead frame and resin, and poor reliability, especially moisture resistance. Furthermore, since PCP is melt-bonded, it is necessary to heat it to a temperature higher than the melting temperature of the thermoplastic resin and to heat only the crimped portion locally, ie, a large-scale bonding machine is required.
しかしながら、中空パッケージは、高周波系の半導体装
置で誘電率が小さいこと、又、バイポーラ系の半導体装
置で、樹脂の熱歪に起因する内部応力が小さいことによ
り、その要求が太きい。However, hollow packages are required to have a small dielectric constant in high-frequency semiconductor devices, and small internal stress caused by thermal distortion of resin in bipolar semiconductor devices.
本発明は、従来中空パンケージの安価に製造出来る点を
とり入れ、その欠点である耐湿信頼度を向上きせるため
、その外周部を通常の熱硬化性樹脂で樹脂封止している
。樹脂封止することＫより、耐湿信頼匹が向上しただけ
でなく、プリフォームされた容器の接着にエポキシ系の
接着剤を使用することが可能になり、大規模な接合機械
が不要になる利点も得られた。The present invention takes advantage of the fact that conventional hollow pancakes can be manufactured at low cost, and in order to improve the moisture resistance and reliability, which is a drawback of hollow pancakes, the outer periphery thereof is sealed with a common thermosetting resin. Resin sealing not only improves moisture resistance and reliability, but also makes it possible to use epoxy adhesive to bond preformed containers, which has the advantage of eliminating the need for large-scale bonding machines. was also obtained.
次に本発明について図面を用いて説明する。 Next, the present invention will be explained using the drawings.
第１図は、本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.
リードフレーム５を用いて、半導体ペレット３を導電性
樹脂７にてダイボンドした後、金細線４でワイヤポンデ
ィングする。しかる後、熱可塑性樹脂にてあらかじめプ
リフォームした容器１１．１２を、ベレットの上下に接
着する。この接着には、信頼度的に、特に問題ないため
エポキシ系の接着剤６で行なう。接着剤を１５０℃２Ｈ
の硬化をした後、通常の低圧トランスファ法によ！り、
１７５℃±１０℃の温度で熱硬化性樹脂２の封止を行な
い、しかる抜リード成形を行なう。A semiconductor pellet 3 is die-bonded with a conductive resin 7 using a lead frame 5, and then wire bonded with a thin gold wire 4. Thereafter, containers 11 and 12 preformed with thermoplastic resin are glued to the top and bottom of the pellet. This bonding is performed using an epoxy adhesive 6 since there is no particular problem in terms of reliability. Glue at 150℃ for 2 hours
After curing, use the normal low pressure transfer method! the law of nature,
The thermosetting resin 2 is sealed at a temperature of 175° C.±10° C., and lead molding is performed accordingly.
〔実施例２〕 第２図は、本発明の実施例２の縦断面図である。[Example 2] FIG. 2 is a longitudinal sectional view of Example 2 of the present invention.
パッケージの高さが低いため、プリフォームされたベレ
ット上部の容器１１は、パッケージの一主面に視認され
る構造となっている。Since the height of the package is low, the container 11 on the top of the preformed pellet is visible on one main surface of the package.
以上説明した様に、本発明はあらかじめプリフォームさ
れた容器を用いることによシ、中空構造となり、又、中
空パッケージの欠点である。接合部分の耐湿信頼度の悪
さを、二重モード構造にすることによってカバーできる
効果がある。As explained above, the present invention uses a preformed container, resulting in a hollow structure, which also suffers from the drawbacks of hollow packages. The dual mode structure has the effect of covering up the poor moisture resistance reliability of the joint.
なお、プリフォームされた容器は、実施例において熱可
塑性樹脂を用いたが、熱硬化性樹脂が可能なのは言うま
でもない。In addition, although thermoplastic resin was used in the embodiment for the preformed container, it goes without saying that thermosetting resin can also be used.
第１図、第２図は、本発明の樹脂封止型中空パッケージ
の縦断面図である。
１１．１２・・・・・・熱可塑性樹脂でプリフォームさ
れた容器、２・・・・・・熱硬化性樹脂、３・・・・・
−半導体ペレット、４・・・・・・金細線、５・・・・
・・リード、６・・・・・・接着剤、７・・・・・・導
電性接着剤。1 and 2 are longitudinal sectional views of the resin-sealed hollow package of the present invention. 11.12...Container preformed with thermoplastic resin, 2...Thermosetting resin, 3...
- Semiconductor pellet, 4... Gold wire, 5...
... Lead, 6 ... Adhesive, 7 ... Conductive adhesive.
Claims (1)
された容器で、半導体素子をパッケージングした後、さ
らに熱硬化性樹脂で前記容器の接合部分を含んで樹脂封
止することを特徴とする、樹脂封止型パッケージ。The resin-sealed semiconductor device is characterized in that after the semiconductor element is packaged in a container preformed with resin, the container is further sealed with a thermosetting resin, including the joint portion thereof. Resin-sealed package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30077286A JPS63152156A (en) | 1986-12-16 | 1986-12-16 | Resin sealed type package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30077286A JPS63152156A (en) | 1986-12-16 | 1986-12-16 | Resin sealed type package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63152156A true JPS63152156A (en) | 1988-06-24 |
Family
ID=17888902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30077286A Pending JPS63152156A (en) | 1986-12-16 | 1986-12-16 | Resin sealed type package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63152156A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03108742A (en) * | 1989-09-22 | 1991-05-08 | Murata Mfg Co Ltd | Electronic part |
| JPH0669145U (en) * | 1993-03-08 | 1994-09-27 | 日本マタイ株式会社 | Bag for heavy goods |
| US5441918A (en) * | 1993-01-29 | 1995-08-15 | Lsi Logic Corporation | Method of making integrated circuit die package |
| US9041169B2 (en) | 2013-05-31 | 2015-05-26 | Yokowo Co., Ltd. | Semiconductor packaging container, semiconductor device, electronic device |
-
1986
- 1986-12-16 JP JP30077286A patent/JPS63152156A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03108742A (en) * | 1989-09-22 | 1991-05-08 | Murata Mfg Co Ltd | Electronic part |
| US5441918A (en) * | 1993-01-29 | 1995-08-15 | Lsi Logic Corporation | Method of making integrated circuit die package |
| JPH0669145U (en) * | 1993-03-08 | 1994-09-27 | 日本マタイ株式会社 | Bag for heavy goods |
| US9041169B2 (en) | 2013-05-31 | 2015-05-26 | Yokowo Co., Ltd. | Semiconductor packaging container, semiconductor device, electronic device |
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