JPS6459991A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS6459991A JPS6459991A JP21701687A JP21701687A JPS6459991A JP S6459991 A JPS6459991 A JP S6459991A JP 21701687 A JP21701687 A JP 21701687A JP 21701687 A JP21701687 A JP 21701687A JP S6459991 A JPS6459991 A JP S6459991A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- laminated
- board
- metal
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
PURPOSE:To obtain a printed wiring board which has improved insulation properties between a metal board and a wiring pattern and is free from short-circuit defects by a method wherein a hole for a through-hole is drilled from the surface of the metal board opposite to the surface on which an insulating layer and a metal foil are laminated and creation of burrs is suppressed by the insulating layer. CONSTITUTION:A hole 12 for a through-hole is formed by a drill or the like from the surface B of the metal plate 9 of a single-sided copper cladded laminated board 8 opposite to the laminated surface A on which an insulating layer 10 is laminated. After that, three laminated prepregs 13 are provided on the surface B opposite to the laminated surface A and a copper metal foil 14 is provided on the prepregs 13 and the laminated prepregs and the metal foil are molded by heat and pressure. By this process, resin of the prepregs 13 is made to flow and fill the hole 12 and forms an insulating layer between the metal board 9 and the through-hole. After that, a through-hole which is approximately coaxial with the hole 12 and has a diameter smaller than the hole 12 is drilled and plating is applied to the through-hole and a circuit pattern is formed. With this constitution, insulation properties between the metal board 9 and the wiring pattern can be improved and abort-circuit defects can be avoided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21701687A JPS6459991A (en) | 1987-08-31 | 1987-08-31 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21701687A JPS6459991A (en) | 1987-08-31 | 1987-08-31 | Manufacture of printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6459991A true JPS6459991A (en) | 1989-03-07 |
Family
ID=16697506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21701687A Pending JPS6459991A (en) | 1987-08-31 | 1987-08-31 | Manufacture of printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6459991A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7683266B2 (en) | 2005-07-29 | 2010-03-23 | Sanyo Electric Co., Ltd. | Circuit board and circuit apparatus using the same |
JP2010093292A (en) * | 2005-07-29 | 2010-04-22 | Sanyo Electric Co Ltd | Circuit device |
-
1987
- 1987-08-31 JP JP21701687A patent/JPS6459991A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7683266B2 (en) | 2005-07-29 | 2010-03-23 | Sanyo Electric Co., Ltd. | Circuit board and circuit apparatus using the same |
JP2010093292A (en) * | 2005-07-29 | 2010-04-22 | Sanyo Electric Co Ltd | Circuit device |
US8166643B2 (en) | 2005-07-29 | 2012-05-01 | Sanyo Electric Co., Ltd. | Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device |
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