JPS6437079A - Manufacture of through-hole printed wiring board - Google Patents
Manufacture of through-hole printed wiring boardInfo
- Publication number
- JPS6437079A JPS6437079A JP19300087A JP19300087A JPS6437079A JP S6437079 A JPS6437079 A JP S6437079A JP 19300087 A JP19300087 A JP 19300087A JP 19300087 A JP19300087 A JP 19300087A JP S6437079 A JPS6437079 A JP S6437079A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- conductive paste
- piercing
- drilled
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
PURPOSE:To facilitate formation of through-holes with highly reliable electric continuity by a method wherein films in which holes are provided in a required arrangement pattern are applied to double-sided metal foil clad laminate and piercing holes for through-holes are drilled and filled with conductive paste. CONSTITUTION:A double-sided copper foil clad laminate 2 which have metal foils 1 on both the surfaces is prepared. Films 4 in which holes 3 with diameters larger than the diameter of a through-hole are formed at the positions corresponding to the through-holes are applied to the metal foils on both the surfaces. Then piercing holes 5 for through-holes are drilled and the board is let through felt rolls 6 and 6' impregnated with conductive paste 7 to fill the piercing holes 5 with the conductive paste 7 and dried and the films 4 are peeled off. Therefore, the metal foil 1 surfaces are protected while the holes are drilled, lands are formed simultaneously when the piercing holes are filled with the conductive paste, the piercing holes are securely filled with the conductive paste and falling out of the paste can be avoided. With this constitution, the through-holes with highly reliable electric continuity can be formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19300087A JPS6437079A (en) | 1987-07-31 | 1987-07-31 | Manufacture of through-hole printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19300087A JPS6437079A (en) | 1987-07-31 | 1987-07-31 | Manufacture of through-hole printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6437079A true JPS6437079A (en) | 1989-02-07 |
Family
ID=16300544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19300087A Pending JPS6437079A (en) | 1987-07-31 | 1987-07-31 | Manufacture of through-hole printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6437079A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0568930A2 (en) * | 1992-05-06 | 1993-11-10 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing organic substrate used for printed circuits |
EP0645950A1 (en) * | 1993-09-21 | 1995-03-29 | Matsushita Electric Industrial Co., Ltd. | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
EP0645951A1 (en) * | 1993-09-22 | 1995-03-29 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method of manufacturing the same |
EP0865231A1 (en) * | 1997-03-14 | 1998-09-16 | Photo Print Electronic GmbH | Method for producing printed circuit boards with through-platings |
KR100754071B1 (en) * | 2006-05-16 | 2007-08-31 | 삼성전기주식회사 | Method of manufacturing printed circuit board for using all layer interstitial via hole |
-
1987
- 1987-07-31 JP JP19300087A patent/JPS6437079A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0568930A2 (en) * | 1992-05-06 | 1993-11-10 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing organic substrate used for printed circuits |
EP0568930A3 (en) * | 1992-05-06 | 1994-04-06 | Matsushita Electric Ind Co Ltd | |
EP0645950A1 (en) * | 1993-09-21 | 1995-03-29 | Matsushita Electric Industrial Co., Ltd. | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
EP0645951A1 (en) * | 1993-09-22 | 1995-03-29 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method of manufacturing the same |
EP0865231A1 (en) * | 1997-03-14 | 1998-09-16 | Photo Print Electronic GmbH | Method for producing printed circuit boards with through-platings |
KR100754071B1 (en) * | 2006-05-16 | 2007-08-31 | 삼성전기주식회사 | Method of manufacturing printed circuit board for using all layer interstitial via hole |
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