JPS6437079A - Manufacture of through-hole printed wiring board - Google Patents

Manufacture of through-hole printed wiring board

Info

Publication number
JPS6437079A
JPS6437079A JP19300087A JP19300087A JPS6437079A JP S6437079 A JPS6437079 A JP S6437079A JP 19300087 A JP19300087 A JP 19300087A JP 19300087 A JP19300087 A JP 19300087A JP S6437079 A JPS6437079 A JP S6437079A
Authority
JP
Japan
Prior art keywords
holes
conductive paste
piercing
drilled
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19300087A
Other languages
Japanese (ja)
Inventor
Minoru Otsuka
Masahiro Tanji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP19300087A priority Critical patent/JPS6437079A/en
Publication of JPS6437079A publication Critical patent/JPS6437079A/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To facilitate formation of through-holes with highly reliable electric continuity by a method wherein films in which holes are provided in a required arrangement pattern are applied to double-sided metal foil clad laminate and piercing holes for through-holes are drilled and filled with conductive paste. CONSTITUTION:A double-sided copper foil clad laminate 2 which have metal foils 1 on both the surfaces is prepared. Films 4 in which holes 3 with diameters larger than the diameter of a through-hole are formed at the positions corresponding to the through-holes are applied to the metal foils on both the surfaces. Then piercing holes 5 for through-holes are drilled and the board is let through felt rolls 6 and 6' impregnated with conductive paste 7 to fill the piercing holes 5 with the conductive paste 7 and dried and the films 4 are peeled off. Therefore, the metal foil 1 surfaces are protected while the holes are drilled, lands are formed simultaneously when the piercing holes are filled with the conductive paste, the piercing holes are securely filled with the conductive paste and falling out of the paste can be avoided. With this constitution, the through-holes with highly reliable electric continuity can be formed.
JP19300087A 1987-07-31 1987-07-31 Manufacture of through-hole printed wiring board Pending JPS6437079A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19300087A JPS6437079A (en) 1987-07-31 1987-07-31 Manufacture of through-hole printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19300087A JPS6437079A (en) 1987-07-31 1987-07-31 Manufacture of through-hole printed wiring board

Publications (1)

Publication Number Publication Date
JPS6437079A true JPS6437079A (en) 1989-02-07

Family

ID=16300544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19300087A Pending JPS6437079A (en) 1987-07-31 1987-07-31 Manufacture of through-hole printed wiring board

Country Status (1)

Country Link
JP (1) JPS6437079A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0568930A2 (en) * 1992-05-06 1993-11-10 Matsushita Electric Industrial Co., Ltd. Method of manufacturing organic substrate used for printed circuits
EP0645950A1 (en) * 1993-09-21 1995-03-29 Matsushita Electric Industrial Co., Ltd. Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
EP0645951A1 (en) * 1993-09-22 1995-03-29 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method of manufacturing the same
EP0865231A1 (en) * 1997-03-14 1998-09-16 Photo Print Electronic GmbH Method for producing printed circuit boards with through-platings
KR100754071B1 (en) * 2006-05-16 2007-08-31 삼성전기주식회사 Method of manufacturing printed circuit board for using all layer interstitial via hole

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0568930A2 (en) * 1992-05-06 1993-11-10 Matsushita Electric Industrial Co., Ltd. Method of manufacturing organic substrate used for printed circuits
EP0568930A3 (en) * 1992-05-06 1994-04-06 Matsushita Electric Ind Co Ltd
EP0645950A1 (en) * 1993-09-21 1995-03-29 Matsushita Electric Industrial Co., Ltd. Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
EP0645951A1 (en) * 1993-09-22 1995-03-29 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method of manufacturing the same
EP0865231A1 (en) * 1997-03-14 1998-09-16 Photo Print Electronic GmbH Method for producing printed circuit boards with through-platings
KR100754071B1 (en) * 2006-05-16 2007-08-31 삼성전기주식회사 Method of manufacturing printed circuit board for using all layer interstitial via hole

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