JPS6453593A - Thick film hybrid integrated circuit - Google Patents
Thick film hybrid integrated circuitInfo
- Publication number
- JPS6453593A JPS6453593A JP21047787A JP21047787A JPS6453593A JP S6453593 A JPS6453593 A JP S6453593A JP 21047787 A JP21047787 A JP 21047787A JP 21047787 A JP21047787 A JP 21047787A JP S6453593 A JPS6453593 A JP S6453593A
- Authority
- JP
- Japan
- Prior art keywords
- conductors
- thick film
- agpd
- paste
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To improve adhesion strength by a method wherein Ag based conductors are formed as foundations and Cu conductors are formed on them to have double-layer structures and low temperature baked type Cu paste with which the Cu conductors are formed by baking in an N2 atmosphere at a specific temperature is employed. CONSTITUTION:Thick film AgPd paste is applied to the parts corresponding to a component mount land 15 and an external lead terminal attaching land selectively by screen printing and baked in the air at the temperature of 800-900 deg.C to form AgPd conductors 12. Then thick film Cu paste is applied selectively by screen printing and baked in an N2 atmosphere at the temperature of 550-650 deg.C to form Cu conductors 13. By the above-mentioned processes, the pattern wirings of the Cu conductors 13 and double-layer structure electrodes composed of the AgPd conductors 12 on the component mount land 15 and the external lead terminal mount land 16 and the Cu conductors 13 are formed. Then protective films 14 are formed on the Cu conductor wirings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21047787A JPS6453593A (en) | 1987-08-25 | 1987-08-25 | Thick film hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21047787A JPS6453593A (en) | 1987-08-25 | 1987-08-25 | Thick film hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6453593A true JPS6453593A (en) | 1989-03-01 |
Family
ID=16589994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21047787A Pending JPS6453593A (en) | 1987-08-25 | 1987-08-25 | Thick film hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6453593A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190131064A (en) | 2017-04-07 | 2019-11-25 | 니토 코키 가부시키가이샤 | Female pipe joint member with terminal for communication |
-
1987
- 1987-08-25 JP JP21047787A patent/JPS6453593A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190131064A (en) | 2017-04-07 | 2019-11-25 | 니토 코키 가부시키가이샤 | Female pipe joint member with terminal for communication |
| US10876664B2 (en) | 2017-04-07 | 2020-12-29 | Nitto Kohki Co., Ltd. | Female pipe coupling member having communication terminal |
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