JPS56157053A - Manufacture of thick film hybrid ic plate - Google Patents

Manufacture of thick film hybrid ic plate

Info

Publication number
JPS56157053A
JPS56157053A JP6063780A JP6063780A JPS56157053A JP S56157053 A JPS56157053 A JP S56157053A JP 6063780 A JP6063780 A JP 6063780A JP 6063780 A JP6063780 A JP 6063780A JP S56157053 A JPS56157053 A JP S56157053A
Authority
JP
Japan
Prior art keywords
printed
layer
baked
paste
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6063780A
Other languages
Japanese (ja)
Inventor
Kazuyuki Fujimoto
Nobuyuki Sugishita
Masanori Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6063780A priority Critical patent/JPS56157053A/en
Publication of JPS56157053A publication Critical patent/JPS56157053A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof

Abstract

PURPOSE:To manufacture the high-density thick film IC plate in a good yield and low price by a method wherein an insulation layer is printed and baked in two times. CONSTITUTION:Conductor paste of Ag-Pd system is printed and baked on a ceramic substrate 1, the first wiring conductor 2 being formed, resistor paste of RuO2 system being printed and baked so as to be connected to the conductor 2 to form the first layer resistor 3. Then, insulator paste containing the crystallized glass printed and baked so as to cover those mentioned above to form an insulator first layer 4-1. Thereafter, the first layer resistor 3 is trimmed by laser and the insulator paste is printed and baked again to form an insulator second layer 4-2 and to form an insulator layer 4. Thereafter, the conductor paste of the Ag-Pd system is printed, and the resistor paste of the RuO2 system is printed and baked, thereby, permitting the second layer wiring conductor 5 and the second resistor 6 to be formed.
JP6063780A 1980-05-09 1980-05-09 Manufacture of thick film hybrid ic plate Pending JPS56157053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6063780A JPS56157053A (en) 1980-05-09 1980-05-09 Manufacture of thick film hybrid ic plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6063780A JPS56157053A (en) 1980-05-09 1980-05-09 Manufacture of thick film hybrid ic plate

Publications (1)

Publication Number Publication Date
JPS56157053A true JPS56157053A (en) 1981-12-04

Family

ID=13148022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6063780A Pending JPS56157053A (en) 1980-05-09 1980-05-09 Manufacture of thick film hybrid ic plate

Country Status (1)

Country Link
JP (1) JPS56157053A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113993A (en) * 1983-11-25 1985-06-20 三菱電機株式会社 Method of producing multilayer circuit board
JPS60169196A (en) * 1984-02-13 1985-09-02 三菱電機株式会社 Method of producing multilayer circuit board
JPS60189293A (en) * 1984-03-07 1985-09-26 三菱電機株式会社 Method of producing multilayer circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113993A (en) * 1983-11-25 1985-06-20 三菱電機株式会社 Method of producing multilayer circuit board
JPH023317B2 (en) * 1983-11-25 1990-01-23 Mitsubishi Electric Corp
JPS60169196A (en) * 1984-02-13 1985-09-02 三菱電機株式会社 Method of producing multilayer circuit board
JPH021389B2 (en) * 1984-02-13 1990-01-11 Mitsubishi Electric Corp
JPS60189293A (en) * 1984-03-07 1985-09-26 三菱電機株式会社 Method of producing multilayer circuit board
JPH025024B2 (en) * 1984-03-07 1990-01-31 Mitsubishi Electric Corp

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