JPS55111152A - Method of manufacturing multilayer thin film circuit board - Google Patents
Method of manufacturing multilayer thin film circuit boardInfo
- Publication number
- JPS55111152A JPS55111152A JP1836979A JP1836979A JPS55111152A JP S55111152 A JPS55111152 A JP S55111152A JP 1836979 A JP1836979 A JP 1836979A JP 1836979 A JP1836979 A JP 1836979A JP S55111152 A JPS55111152 A JP S55111152A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- wiring layer
- paste
- conductor
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To reduce the number of working steps and raise accuracy and reliability, by printing a first wiring layer on a substrate, baking the first wiring layer, printing a resistor, a dielectric substance and a second wiring layer, baking the resistor, the dielectric substance and the second wiring layer simultaneously and coating the resistor and the second wiring layer with the same crystallized glass of low melting point. CONSTITUTION:A paste of Ag-Pd conductor or the like is printed on a substrate 1 of alumina or the like and baked so that the first wiring layer conductor 2 is provided. A resistor paste 4 of RuO2 or the like is then printed. A paste of Ag-Pd conductor is printed in succession to crystalline glass pastes 3'', 3'. The resistor paste 4, the glass pastes 3'', 3' and the paste of Ag-Pd conductor are simultaneously baked so that a dielectric substance 3, a resistor 4 and the second wiring layer conductor 2' are provided. A paste of glass of low melting point is printed to coat the resistor 4 and the conductor 2' and baked so that a glass coating 5 is provided. As a result, the number of times of baking is reduced, the accuracy of resistance is improved, and the reliability of humidity-proof property is raised by the glass coating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1836979A JPS55111152A (en) | 1979-02-21 | 1979-02-21 | Method of manufacturing multilayer thin film circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1836979A JPS55111152A (en) | 1979-02-21 | 1979-02-21 | Method of manufacturing multilayer thin film circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55111152A true JPS55111152A (en) | 1980-08-27 |
Family
ID=11969781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1836979A Pending JPS55111152A (en) | 1979-02-21 | 1979-02-21 | Method of manufacturing multilayer thin film circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55111152A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS624354A (en) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | Manufacture of thick film multi-layer substrate |
JPH0284795A (en) * | 1988-09-21 | 1990-03-26 | Nippon Denso Co Ltd | Integrated circuit device |
-
1979
- 1979-02-21 JP JP1836979A patent/JPS55111152A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS624354A (en) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | Manufacture of thick film multi-layer substrate |
JPH059954B2 (en) * | 1985-06-29 | 1993-02-08 | Tokyo Shibaura Electric Co | |
JPH0284795A (en) * | 1988-09-21 | 1990-03-26 | Nippon Denso Co Ltd | Integrated circuit device |
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