JPS55111152A - Method of manufacturing multilayer thin film circuit board - Google Patents

Method of manufacturing multilayer thin film circuit board

Info

Publication number
JPS55111152A
JPS55111152A JP1836979A JP1836979A JPS55111152A JP S55111152 A JPS55111152 A JP S55111152A JP 1836979 A JP1836979 A JP 1836979A JP 1836979 A JP1836979 A JP 1836979A JP S55111152 A JPS55111152 A JP S55111152A
Authority
JP
Japan
Prior art keywords
resistor
wiring layer
paste
conductor
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1836979A
Other languages
Japanese (ja)
Inventor
Nobuyuki Sugishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1836979A priority Critical patent/JPS55111152A/en
Publication of JPS55111152A publication Critical patent/JPS55111152A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To reduce the number of working steps and raise accuracy and reliability, by printing a first wiring layer on a substrate, baking the first wiring layer, printing a resistor, a dielectric substance and a second wiring layer, baking the resistor, the dielectric substance and the second wiring layer simultaneously and coating the resistor and the second wiring layer with the same crystallized glass of low melting point. CONSTITUTION:A paste of Ag-Pd conductor or the like is printed on a substrate 1 of alumina or the like and baked so that the first wiring layer conductor 2 is provided. A resistor paste 4 of RuO2 or the like is then printed. A paste of Ag-Pd conductor is printed in succession to crystalline glass pastes 3'', 3'. The resistor paste 4, the glass pastes 3'', 3' and the paste of Ag-Pd conductor are simultaneously baked so that a dielectric substance 3, a resistor 4 and the second wiring layer conductor 2' are provided. A paste of glass of low melting point is printed to coat the resistor 4 and the conductor 2' and baked so that a glass coating 5 is provided. As a result, the number of times of baking is reduced, the accuracy of resistance is improved, and the reliability of humidity-proof property is raised by the glass coating.
JP1836979A 1979-02-21 1979-02-21 Method of manufacturing multilayer thin film circuit board Pending JPS55111152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1836979A JPS55111152A (en) 1979-02-21 1979-02-21 Method of manufacturing multilayer thin film circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1836979A JPS55111152A (en) 1979-02-21 1979-02-21 Method of manufacturing multilayer thin film circuit board

Publications (1)

Publication Number Publication Date
JPS55111152A true JPS55111152A (en) 1980-08-27

Family

ID=11969781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1836979A Pending JPS55111152A (en) 1979-02-21 1979-02-21 Method of manufacturing multilayer thin film circuit board

Country Status (1)

Country Link
JP (1) JPS55111152A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624354A (en) * 1985-06-29 1987-01-10 Toshiba Corp Manufacture of thick film multi-layer substrate
JPH0284795A (en) * 1988-09-21 1990-03-26 Nippon Denso Co Ltd Integrated circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624354A (en) * 1985-06-29 1987-01-10 Toshiba Corp Manufacture of thick film multi-layer substrate
JPH059954B2 (en) * 1985-06-29 1993-02-08 Tokyo Shibaura Electric Co
JPH0284795A (en) * 1988-09-21 1990-03-26 Nippon Denso Co Ltd Integrated circuit device

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