JPS645097A - Ceramic multilayer interconnection substrate - Google Patents
Ceramic multilayer interconnection substrateInfo
- Publication number
- JPS645097A JPS645097A JP16167987A JP16167987A JPS645097A JP S645097 A JPS645097 A JP S645097A JP 16167987 A JP16167987 A JP 16167987A JP 16167987 A JP16167987 A JP 16167987A JP S645097 A JPS645097 A JP S645097A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- layer
- ceramic multilayer
- filling
- multilayer interconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To eliminate generation of cracks to obtain a ceramic multilayer interconnection substrate with high density by filling the central part of a through hole with an insulating material. CONSTITUTION:A conductive layer 3 for through hole is formed on the inwall of a through hole 2 of a substrate insulating layer 1. A filling layer 6 of the same component as that of the insulating layer 1 is formed in the through hole 2. And a printed conductive layer 4 is formed on each of both surfaces of the substrate body comprising the insulating layer 1 and the filling layer 6. Then, the ratio which the conductive layer 3 forms is so small that the stress, which results from the difference of the thermal expansion coefficient between the insulating layer 1 and the filling members 3, 6 in the through hole 1 and stresses between upper and lower surfaces of the through hole 2, is reduced. As a result, cracks are prevented from being generating in the portion A. Therefore, a ceramic multilayer interconnection substrate with high density can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16167987A JPS645097A (en) | 1987-06-29 | 1987-06-29 | Ceramic multilayer interconnection substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16167987A JPS645097A (en) | 1987-06-29 | 1987-06-29 | Ceramic multilayer interconnection substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS645097A true JPS645097A (en) | 1989-01-10 |
Family
ID=15739782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16167987A Pending JPS645097A (en) | 1987-06-29 | 1987-06-29 | Ceramic multilayer interconnection substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS645097A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5093186A (en) * | 1989-09-26 | 1992-03-03 | Ngk Spark Plug Co., Ltd. | Multilayer ceramic wiring board |
-
1987
- 1987-06-29 JP JP16167987A patent/JPS645097A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5093186A (en) * | 1989-09-26 | 1992-03-03 | Ngk Spark Plug Co., Ltd. | Multilayer ceramic wiring board |
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