JPS646385A - Electrical connection structure of circuit substrates - Google Patents

Electrical connection structure of circuit substrates

Info

Publication number
JPS646385A
JPS646385A JP62159469A JP15946987A JPS646385A JP S646385 A JPS646385 A JP S646385A JP 62159469 A JP62159469 A JP 62159469A JP 15946987 A JP15946987 A JP 15946987A JP S646385 A JPS646385 A JP S646385A
Authority
JP
Japan
Prior art keywords
hole
land
circuit substrates
center
electrical connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62159469A
Other languages
Japanese (ja)
Inventor
Toshiya Kurihashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP62159469A priority Critical patent/JPS646385A/en
Publication of JPS646385A publication Critical patent/JPS646385A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Abstract

PURPOSE:To prevent a poor connection by connecting the first and the second circuit substrates electrically with the solder pouring into a through hole on condition that the center of the through hole and the center of a land are positioned being slipped out relatively. CONSTITUTION:A through hole 13 and a land 14 are formed on circuit substrates 11 and 12 respectively to make the center line O1 of the through hole 13 formed on the one side circuit substrate 11 and the center line O2 of the land 14 formed on the other side circuit substrate 12 slipped out a little each other. Therefore, a minute clearance 8 owing to the difference in level of the land 14 and an insulator 6 is formed linking to the space in the through hole 13. As a result, not only when the solder 5 is poured without filling fully in the through hole 13, but also filling it fully in the through hole 13, the air in the through hole 13 has the escape room, and a soldering connection including no bubble can be carried out. In such a way, plural circuit substrates can be connected electrically with generating no defect.
JP62159469A 1987-06-26 1987-06-26 Electrical connection structure of circuit substrates Pending JPS646385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62159469A JPS646385A (en) 1987-06-26 1987-06-26 Electrical connection structure of circuit substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62159469A JPS646385A (en) 1987-06-26 1987-06-26 Electrical connection structure of circuit substrates

Publications (1)

Publication Number Publication Date
JPS646385A true JPS646385A (en) 1989-01-10

Family

ID=15694451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62159469A Pending JPS646385A (en) 1987-06-26 1987-06-26 Electrical connection structure of circuit substrates

Country Status (1)

Country Link
JP (1) JPS646385A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537111A (en) * 1991-07-31 1993-02-12 Marantz Japan Inc Mounting structure of hybrid ic
GB2291070A (en) * 1994-07-14 1996-01-17 Permelec Electrode Ltd Fixing electrode to electrode substrate by welding metal filled in a plurality of holes in the electrode to the electrode and the substrate
WO1999004453A1 (en) * 1997-07-16 1999-01-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Contact and method for producing a contact
US7207837B2 (en) 2005-08-22 2007-04-24 Sumitomo Wiring Systems, Ltd. Connector and a mounting method therefor
JP2008223526A (en) * 2007-03-09 2008-09-25 Calsonic Compressor Inc Gas compressor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537111A (en) * 1991-07-31 1993-02-12 Marantz Japan Inc Mounting structure of hybrid ic
GB2291070A (en) * 1994-07-14 1996-01-17 Permelec Electrode Ltd Fixing electrode to electrode substrate by welding metal filled in a plurality of holes in the electrode to the electrode and the substrate
WO1999004453A1 (en) * 1997-07-16 1999-01-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Contact and method for producing a contact
US7207837B2 (en) 2005-08-22 2007-04-24 Sumitomo Wiring Systems, Ltd. Connector and a mounting method therefor
JP2008223526A (en) * 2007-03-09 2008-09-25 Calsonic Compressor Inc Gas compressor

Similar Documents

Publication Publication Date Title
DE3780025D1 (en) DOUBLE SOLDERING METHOD FOR CONNECTING THE CONNECTION CONTACTS OF ELECTRICAL COMPONENTS TO THE LADDERS OF PRINTED CIRCUITS.
IE830590L (en) Electrical connector
EP0358332A3 (en) Circuit board and method of soldering
JPS646385A (en) Electrical connection structure of circuit substrates
JPS5231758A (en) Liquid display device
JPS5797634A (en) Hybrid integrated circuit
JPS6448423A (en) Dividing method of semiconductor chip
JPS6435905A (en) Method of mounting capacitor to circuit board
JPS5436595A (en) Preparation of bubble memory chip
JPS5587462A (en) Integrated circuit package
GB1250839A (en)
JPS5571053A (en) Circuit device
JPS57187955A (en) Sealing structure of semiconductor element
JPS6474795A (en) Method of mounting semiconductor device
JPS6444092A (en) Wiring substrate
JPS6437073A (en) Printed board
JPS6444027A (en) Semiconductor device
JPS6428891A (en) Multi-layer printed circuit board
JPS6444091A (en) Electronic circuit substrate
JPS6439795A (en) Terminal structure of printed board
JPS6455289A (en) Integrated circuit device
JPS5347769A (en) Integrated circuit connection leads and its production
KR870010570A (en) Variable resistor for balance adjustment and forming method
JPS5313853A (en) Terminal system of ligic circuit
JPS6454365A (en) Prober