JPS646385A - Electrical connection structure of circuit substrates - Google Patents
Electrical connection structure of circuit substratesInfo
- Publication number
- JPS646385A JPS646385A JP62159469A JP15946987A JPS646385A JP S646385 A JPS646385 A JP S646385A JP 62159469 A JP62159469 A JP 62159469A JP 15946987 A JP15946987 A JP 15946987A JP S646385 A JPS646385 A JP S646385A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- land
- circuit substrates
- center
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Abstract
PURPOSE:To prevent a poor connection by connecting the first and the second circuit substrates electrically with the solder pouring into a through hole on condition that the center of the through hole and the center of a land are positioned being slipped out relatively. CONSTITUTION:A through hole 13 and a land 14 are formed on circuit substrates 11 and 12 respectively to make the center line O1 of the through hole 13 formed on the one side circuit substrate 11 and the center line O2 of the land 14 formed on the other side circuit substrate 12 slipped out a little each other. Therefore, a minute clearance 8 owing to the difference in level of the land 14 and an insulator 6 is formed linking to the space in the through hole 13. As a result, not only when the solder 5 is poured without filling fully in the through hole 13, but also filling it fully in the through hole 13, the air in the through hole 13 has the escape room, and a soldering connection including no bubble can be carried out. In such a way, plural circuit substrates can be connected electrically with generating no defect.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62159469A JPS646385A (en) | 1987-06-26 | 1987-06-26 | Electrical connection structure of circuit substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62159469A JPS646385A (en) | 1987-06-26 | 1987-06-26 | Electrical connection structure of circuit substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS646385A true JPS646385A (en) | 1989-01-10 |
Family
ID=15694451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62159469A Pending JPS646385A (en) | 1987-06-26 | 1987-06-26 | Electrical connection structure of circuit substrates |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS646385A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0537111A (en) * | 1991-07-31 | 1993-02-12 | Marantz Japan Inc | Mounting structure of hybrid ic |
GB2291070A (en) * | 1994-07-14 | 1996-01-17 | Permelec Electrode Ltd | Fixing electrode to electrode substrate by welding metal filled in a plurality of holes in the electrode to the electrode and the substrate |
WO1999004453A1 (en) * | 1997-07-16 | 1999-01-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Contact and method for producing a contact |
US7207837B2 (en) | 2005-08-22 | 2007-04-24 | Sumitomo Wiring Systems, Ltd. | Connector and a mounting method therefor |
JP2008223526A (en) * | 2007-03-09 | 2008-09-25 | Calsonic Compressor Inc | Gas compressor |
-
1987
- 1987-06-26 JP JP62159469A patent/JPS646385A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0537111A (en) * | 1991-07-31 | 1993-02-12 | Marantz Japan Inc | Mounting structure of hybrid ic |
GB2291070A (en) * | 1994-07-14 | 1996-01-17 | Permelec Electrode Ltd | Fixing electrode to electrode substrate by welding metal filled in a plurality of holes in the electrode to the electrode and the substrate |
WO1999004453A1 (en) * | 1997-07-16 | 1999-01-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Contact and method for producing a contact |
US7207837B2 (en) | 2005-08-22 | 2007-04-24 | Sumitomo Wiring Systems, Ltd. | Connector and a mounting method therefor |
JP2008223526A (en) * | 2007-03-09 | 2008-09-25 | Calsonic Compressor Inc | Gas compressor |
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