JPS6444048A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS6444048A
JPS6444048A JP19984487A JP19984487A JPS6444048A JP S6444048 A JPS6444048 A JP S6444048A JP 19984487 A JP19984487 A JP 19984487A JP 19984487 A JP19984487 A JP 19984487A JP S6444048 A JPS6444048 A JP S6444048A
Authority
JP
Japan
Prior art keywords
wirings
holes
intruded
peripheries
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19984487A
Other languages
Japanese (ja)
Inventor
Shinichi Tanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi ULSI Engineering Corp
Hitachi Ltd
Original Assignee
Hitachi ULSI Engineering Corp
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi ULSI Engineering Corp, Hitachi Ltd filed Critical Hitachi ULSI Engineering Corp
Priority to JP19984487A priority Critical patent/JPS6444048A/en
Publication of JPS6444048A publication Critical patent/JPS6444048A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To prevent the disconnection of fine wirings and to improve the reliability of connections between wirings by forming a slit on the periphery of a thick connection hole in the connections between thick wirings and thin wirings. CONSTITUTION:Slits 20 are formed on the parts connected to wirings 11 or gate electrodes 6, i.e., the peripheries of connecting holes 10 of wirings 12A-12C. A final protective film is intruded into the slot 20, and the protective film intruded into the slot 20 is covered with an insulating film. The peripheries of the holes 10 of the wirings 12A-12C are substantially thinned by providing the slits 20, and the thinned holes 10 are secured by the protective films intruded into the slots 20. That is, even if the wirings 12A-12C are thermally expanded or contracted, the peripheries of the holes 10 are secured. Thus, it can prevent the disconnection of thin wirings connected with thick wirings and the reliability of connecting between the wirings can be enhanced.
JP19984487A 1987-08-12 1987-08-12 Semiconductor integrated circuit device Pending JPS6444048A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19984487A JPS6444048A (en) 1987-08-12 1987-08-12 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19984487A JPS6444048A (en) 1987-08-12 1987-08-12 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6444048A true JPS6444048A (en) 1989-02-16

Family

ID=16414589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19984487A Pending JPS6444048A (en) 1987-08-12 1987-08-12 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6444048A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0224540U (en) * 1988-07-29 1990-02-19
JPH0252434A (en) * 1988-08-17 1990-02-22 Sony Corp Formation of conductive wiring
JPH02192146A (en) * 1989-01-20 1990-07-27 Toshiba Corp Semiconductor device
JPH04332152A (en) * 1991-05-02 1992-11-19 Mitsubishi Electric Corp Wiring connection structure of semiconductor integrated circuit device and fabrication thereof
JPH05136275A (en) * 1991-11-13 1993-06-01 Mitsubishi Electric Corp Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0224540U (en) * 1988-07-29 1990-02-19
JPH0252434A (en) * 1988-08-17 1990-02-22 Sony Corp Formation of conductive wiring
JPH02192146A (en) * 1989-01-20 1990-07-27 Toshiba Corp Semiconductor device
JPH04332152A (en) * 1991-05-02 1992-11-19 Mitsubishi Electric Corp Wiring connection structure of semiconductor integrated circuit device and fabrication thereof
JPH05136275A (en) * 1991-11-13 1993-06-01 Mitsubishi Electric Corp Semiconductor device

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