JPS6444048A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS6444048A JPS6444048A JP19984487A JP19984487A JPS6444048A JP S6444048 A JPS6444048 A JP S6444048A JP 19984487 A JP19984487 A JP 19984487A JP 19984487 A JP19984487 A JP 19984487A JP S6444048 A JPS6444048 A JP S6444048A
- Authority
- JP
- Japan
- Prior art keywords
- wirings
- holes
- intruded
- peripheries
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To prevent the disconnection of fine wirings and to improve the reliability of connections between wirings by forming a slit on the periphery of a thick connection hole in the connections between thick wirings and thin wirings. CONSTITUTION:Slits 20 are formed on the parts connected to wirings 11 or gate electrodes 6, i.e., the peripheries of connecting holes 10 of wirings 12A-12C. A final protective film is intruded into the slot 20, and the protective film intruded into the slot 20 is covered with an insulating film. The peripheries of the holes 10 of the wirings 12A-12C are substantially thinned by providing the slits 20, and the thinned holes 10 are secured by the protective films intruded into the slots 20. That is, even if the wirings 12A-12C are thermally expanded or contracted, the peripheries of the holes 10 are secured. Thus, it can prevent the disconnection of thin wirings connected with thick wirings and the reliability of connecting between the wirings can be enhanced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19984487A JPS6444048A (en) | 1987-08-12 | 1987-08-12 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19984487A JPS6444048A (en) | 1987-08-12 | 1987-08-12 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6444048A true JPS6444048A (en) | 1989-02-16 |
Family
ID=16414589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19984487A Pending JPS6444048A (en) | 1987-08-12 | 1987-08-12 | Semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6444048A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0224540U (en) * | 1988-07-29 | 1990-02-19 | ||
JPH0252434A (en) * | 1988-08-17 | 1990-02-22 | Sony Corp | Formation of conductive wiring |
JPH02192146A (en) * | 1989-01-20 | 1990-07-27 | Toshiba Corp | Semiconductor device |
JPH04332152A (en) * | 1991-05-02 | 1992-11-19 | Mitsubishi Electric Corp | Wiring connection structure of semiconductor integrated circuit device and fabrication thereof |
JPH05136275A (en) * | 1991-11-13 | 1993-06-01 | Mitsubishi Electric Corp | Semiconductor device |
-
1987
- 1987-08-12 JP JP19984487A patent/JPS6444048A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0224540U (en) * | 1988-07-29 | 1990-02-19 | ||
JPH0252434A (en) * | 1988-08-17 | 1990-02-22 | Sony Corp | Formation of conductive wiring |
JPH02192146A (en) * | 1989-01-20 | 1990-07-27 | Toshiba Corp | Semiconductor device |
JPH04332152A (en) * | 1991-05-02 | 1992-11-19 | Mitsubishi Electric Corp | Wiring connection structure of semiconductor integrated circuit device and fabrication thereof |
JPH05136275A (en) * | 1991-11-13 | 1993-06-01 | Mitsubishi Electric Corp | Semiconductor device |
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