JPS6442825A - Manufacture of resin sealed semiconductor device - Google Patents

Manufacture of resin sealed semiconductor device

Info

Publication number
JPS6442825A
JPS6442825A JP20031387A JP20031387A JPS6442825A JP S6442825 A JPS6442825 A JP S6442825A JP 20031387 A JP20031387 A JP 20031387A JP 20031387 A JP20031387 A JP 20031387A JP S6442825 A JPS6442825 A JP S6442825A
Authority
JP
Japan
Prior art keywords
positioning
lead
leads
resin sealed
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20031387A
Other languages
Japanese (ja)
Other versions
JPH0579167B2 (en
Inventor
Sadao Yoshida
Masami Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP20031387A priority Critical patent/JPS6442825A/en
Publication of JPS6442825A publication Critical patent/JPS6442825A/en
Publication of JPH0579167B2 publication Critical patent/JPH0579167B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To allow the miniaturization and manufacture of a lead frame at low costs by pulling out a positioning lead after inserting a projection of a hook into a throughhole. CONSTITUTION:An assembling body 23 is prepared, wherein a resin sealed body 16 is formed so that a supporting board 1, a semiconductor chip 13, connecting external lead 2, a part of non-connecting external leads 3 and 4, and almost the whole part of positioning leads 5 and 6 can be coated. A hook 32 is installed to throughholes 21 and 22 of a connecting small strand 9 to pull the positioning leads 5 and 6 relative to the supporting board 1 and break the positioning leads 5 and 6 at the small section thereof 11. This makes it possible to put in contact an end surface 18 of the resin sealed body 16 with that of the lead connecting small strand 9. According to the constitution, the positioning leads 5 and 6 can be designed to be short, whereby the lead frame can be miniaturized and the manufacturing cost thereof can be reduced as well.
JP20031387A 1987-08-10 1987-08-10 Manufacture of resin sealed semiconductor device Granted JPS6442825A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20031387A JPS6442825A (en) 1987-08-10 1987-08-10 Manufacture of resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20031387A JPS6442825A (en) 1987-08-10 1987-08-10 Manufacture of resin sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS6442825A true JPS6442825A (en) 1989-02-15
JPH0579167B2 JPH0579167B2 (en) 1993-11-01

Family

ID=16422233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20031387A Granted JPS6442825A (en) 1987-08-10 1987-08-10 Manufacture of resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS6442825A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0173946U (en) * 1987-11-05 1989-05-18
US5173574A (en) * 1990-06-30 1992-12-22 Johannes Heidenhain Gmbh Soldering connector and method for manufacturing an electric circuit with this soldering connector
DE10109936B3 (en) * 2001-02-26 2005-02-24 Infineon Technologies Ag Separating packaged electronic component involves pulling apart or compressing system carrier band with tool near mechanical bridges while allowing separated electronic component out of band

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156420A (en) * 1984-07-31 1986-03-22 Sanken Electric Co Ltd Manufacture of resin-sealed semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156420A (en) * 1984-07-31 1986-03-22 Sanken Electric Co Ltd Manufacture of resin-sealed semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0173946U (en) * 1987-11-05 1989-05-18
US5173574A (en) * 1990-06-30 1992-12-22 Johannes Heidenhain Gmbh Soldering connector and method for manufacturing an electric circuit with this soldering connector
DE10109936B3 (en) * 2001-02-26 2005-02-24 Infineon Technologies Ag Separating packaged electronic component involves pulling apart or compressing system carrier band with tool near mechanical bridges while allowing separated electronic component out of band

Also Published As

Publication number Publication date
JPH0579167B2 (en) 1993-11-01

Similar Documents

Publication Publication Date Title
JPS6442825A (en) Manufacture of resin sealed semiconductor device
JPS5721830A (en) Bonding wire for semiconductor element
JPS5487474A (en) Semiconductor device
EP0776018A3 (en) Method of manufacturing a case for electronic component
JPS6421876A (en) Electrical structural component with contact pin
ATE377344T1 (en) METHOD FOR PRODUCING A SOLDERED CONNECTION
JPS5796561A (en) Lead for connection of semiconductor device
JPS6474795A (en) Method of mounting semiconductor device
KR920004937Y1 (en) Terminal of jack
JPS57154863A (en) Manufacture of resin sealing type electronic parts
JPS6433914A (en) Electronic part
JPS54161095A (en) Socket device
JPS5745957A (en) Circuit substrate and manufacture thereof
KR910003218Y1 (en) Electric terminal
JPS5629355A (en) Manufacture of resin-sealed semiconductor device
JPS6428571A (en) Aging board
JPS62222Y2 (en)
JPH03104150A (en) Semiconductor device
JPS6431448A (en) Lead frame and manufacture thereof
JPH03269961A (en) Low height type connector
JPS5726459A (en) Glass-sealed semiconductor device
JPS57111048A (en) Integrated circuit device
JPS5721063A (en) Fluorescent lamp
JPS63296257A (en) Semiconductor case
JPS57176526A (en) Magnetic head

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees