JPS6433914A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPS6433914A JPS6433914A JP18968687A JP18968687A JPS6433914A JP S6433914 A JPS6433914 A JP S6433914A JP 18968687 A JP18968687 A JP 18968687A JP 18968687 A JP18968687 A JP 18968687A JP S6433914 A JPS6433914 A JP S6433914A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- pedestal
- hole
- pair
- sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To prevent defective soldering at the time of the surface mounting of a chip type electronic part by simple constitution by forming a solder reservoir in groove width larger than other sections to a specified section on the lead through-hole side in a lead receiving groove for a pedestal. CONSTITUTION:A part element with a pair of leads 2 is inserted into a cylindrical case 1 with a bottom while a part body 5, in which an opening section in the case 1 is sealed with a sealing body with a lead inserting hole, and an electric insulating pedestal 10 mounted on the opening section side of said case 1 are installed. A pair of lead through-holes 12 and a pair of lead receiving grooves 13 shaped so as to mutually communicate with each through-hole 12 from the opposite direction on the base side of the pedestal 10 are formed to the pedestal 10, and each end section 2a of said leads is bent along the lead receiving grooves 13 and changed into chips. In such an electronic part, solder reservoirs 13a in groove width larger than other sections are shaped to specified sections on the lead through-hole 12 sides in said lead receiving grooves 13.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18968687A JPS6433914A (en) | 1987-07-29 | 1987-07-29 | Electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18968687A JPS6433914A (en) | 1987-07-29 | 1987-07-29 | Electronic part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6433914A true JPS6433914A (en) | 1989-02-03 |
Family
ID=16245481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18968687A Pending JPS6433914A (en) | 1987-07-29 | 1987-07-29 | Electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6433914A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5420748A (en) * | 1993-03-31 | 1995-05-30 | Samsung Electro-Mechanics Co., Ltd. | Surface mounting type chip capacitor |
EP0831502A1 (en) * | 1995-02-07 | 1998-03-25 | Matsushita Electric Industrial Co., Ltd. | Method for producing an electrolytic capacitor |
US6359541B1 (en) * | 1998-11-29 | 2002-03-19 | Citizen Electronics Co., Ltd. | Surface-mounted electromagnetic sound generator |
JP2008141079A (en) * | 2006-12-05 | 2008-06-19 | Saga Sanyo Industries Co Ltd | Electrolytic capacitor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60148104A (en) * | 1984-01-12 | 1985-08-05 | 松下電器産業株式会社 | Electronic part |
JPS6151728U (en) * | 1984-09-06 | 1986-04-07 | ||
JPS61125119A (en) * | 1984-11-22 | 1986-06-12 | 日本ケミコン株式会社 | Leadless type electrolytic capacitor |
-
1987
- 1987-07-29 JP JP18968687A patent/JPS6433914A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60148104A (en) * | 1984-01-12 | 1985-08-05 | 松下電器産業株式会社 | Electronic part |
JPS6151728U (en) * | 1984-09-06 | 1986-04-07 | ||
JPS61125119A (en) * | 1984-11-22 | 1986-06-12 | 日本ケミコン株式会社 | Leadless type electrolytic capacitor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5420748A (en) * | 1993-03-31 | 1995-05-30 | Samsung Electro-Mechanics Co., Ltd. | Surface mounting type chip capacitor |
EP0831502A1 (en) * | 1995-02-07 | 1998-03-25 | Matsushita Electric Industrial Co., Ltd. | Method for producing an electrolytic capacitor |
US5769907A (en) * | 1995-02-07 | 1998-06-23 | Matsushita Electric Industrial Co., Ltd. | Method for producing aluminum electrolytic capacitor |
US6359541B1 (en) * | 1998-11-29 | 2002-03-19 | Citizen Electronics Co., Ltd. | Surface-mounted electromagnetic sound generator |
JP2008141079A (en) * | 2006-12-05 | 2008-06-19 | Saga Sanyo Industries Co Ltd | Electrolytic capacitor |
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