JPS57111048A - Integrated circuit device - Google Patents

Integrated circuit device

Info

Publication number
JPS57111048A
JPS57111048A JP55188724A JP18872480A JPS57111048A JP S57111048 A JPS57111048 A JP S57111048A JP 55188724 A JP55188724 A JP 55188724A JP 18872480 A JP18872480 A JP 18872480A JP S57111048 A JPS57111048 A JP S57111048A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hole
package
electronic part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55188724A
Other languages
Japanese (ja)
Inventor
Osamu Minato
Toshiaki Masuhara
Katsumi Miyauchi
Tetsuichi Kudo
Yoshio Uetani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Maxell Holdings Ltd
Original Assignee
Hitachi Ltd
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Maxell Ltd filed Critical Hitachi Ltd
Priority to JP55188724A priority Critical patent/JPS57111048A/en
Publication of JPS57111048A publication Critical patent/JPS57111048A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To readily couple an integrated circuit device with other electronic part by connecting the prescribed lead pins of a package body to the lead pins of other part externally, thereby forming a hole at the body. CONSTITUTION:The prescribed lead pin 21 of a package is connected through holes 3 formed at the body 1 with the lead pin 31 from an external electronic part, and this hole can be formed in any number as required. The hole thus formed can support the lead pin 31 and readily couples the other electronic part with the package 1. Accordingly, the mounting density can be improved.
JP55188724A 1980-12-26 1980-12-26 Integrated circuit device Pending JPS57111048A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55188724A JPS57111048A (en) 1980-12-26 1980-12-26 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55188724A JPS57111048A (en) 1980-12-26 1980-12-26 Integrated circuit device

Publications (1)

Publication Number Publication Date
JPS57111048A true JPS57111048A (en) 1982-07-10

Family

ID=16228664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55188724A Pending JPS57111048A (en) 1980-12-26 1980-12-26 Integrated circuit device

Country Status (1)

Country Link
JP (1) JPS57111048A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59147449A (en) * 1983-02-10 1984-08-23 Matsushita Electric Ind Co Ltd Manufacture of electronic part

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5066168A (en) * 1973-10-12 1975-06-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5066168A (en) * 1973-10-12 1975-06-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59147449A (en) * 1983-02-10 1984-08-23 Matsushita Electric Ind Co Ltd Manufacture of electronic part

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