JPS6441297A - Manufacture of wiring board - Google Patents
Manufacture of wiring boardInfo
- Publication number
- JPS6441297A JPS6441297A JP62196161A JP19616187A JPS6441297A JP S6441297 A JPS6441297 A JP S6441297A JP 62196161 A JP62196161 A JP 62196161A JP 19616187 A JP19616187 A JP 19616187A JP S6441297 A JPS6441297 A JP S6441297A
- Authority
- JP
- Japan
- Prior art keywords
- conductor patterns
- insulation substrate
- conductive layer
- etching
- insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
PURPOSE:To increase a surface insulation resistance between wiring patterns, by etching a conductive layer piled on an insulation substrate to form conductor patterns and next etching a surface phase of the insulation substrate exposed between the conductor patterns. CONSTITUTION:A conductive layer piled on an insulation substrate by vacuum evaporation, sputtering, plating, or the like is etched to form conductor patterns, and next a surface phase of the insulation substrate between the conductor patterns is etched by a wet type etching liquid or by gas plasma. Since various conductive impurities formed between the conductor patterns upon the piling of said conductive layer can be removed in this way, surface insulation resistance between the conductor patterns can be increased.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62196161A JPS6441297A (en) | 1987-08-07 | 1987-08-07 | Manufacture of wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62196161A JPS6441297A (en) | 1987-08-07 | 1987-08-07 | Manufacture of wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6441297A true JPS6441297A (en) | 1989-02-13 |
Family
ID=16353222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62196161A Pending JPS6441297A (en) | 1987-08-07 | 1987-08-07 | Manufacture of wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6441297A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09181423A (en) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | Ceramic circuit board |
EP1670297A2 (en) * | 2004-11-26 | 2006-06-14 | Nitto Denko Corporation | Printed circuit board and manufacturing method thereof |
JP2015130230A (en) * | 2015-03-27 | 2015-07-16 | 大日本印刷株式会社 | Substrate for suspension, suspension, suspension with element, and hard disk drive |
WO2021005864A1 (en) * | 2019-07-09 | 2021-01-14 | 日東電工株式会社 | Wiring circuit board and method for manufacturing wiring circuit board |
-
1987
- 1987-08-07 JP JP62196161A patent/JPS6441297A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09181423A (en) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | Ceramic circuit board |
EP1670297A2 (en) * | 2004-11-26 | 2006-06-14 | Nitto Denko Corporation | Printed circuit board and manufacturing method thereof |
JP2015130230A (en) * | 2015-03-27 | 2015-07-16 | 大日本印刷株式会社 | Substrate for suspension, suspension, suspension with element, and hard disk drive |
WO2021005864A1 (en) * | 2019-07-09 | 2021-01-14 | 日東電工株式会社 | Wiring circuit board and method for manufacturing wiring circuit board |
JP2021012984A (en) * | 2019-07-09 | 2021-02-04 | 日東電工株式会社 | Wiring circuit board and manufacturing method of wiring circuit board |
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