JPS6436440A - Clad material for electronic components - Google Patents

Clad material for electronic components

Info

Publication number
JPS6436440A
JPS6436440A JP19353987A JP19353987A JPS6436440A JP S6436440 A JPS6436440 A JP S6436440A JP 19353987 A JP19353987 A JP 19353987A JP 19353987 A JP19353987 A JP 19353987A JP S6436440 A JPS6436440 A JP S6436440A
Authority
JP
Japan
Prior art keywords
electronic components
make
plate
clad
clad material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19353987A
Other languages
Japanese (ja)
Inventor
Kenji Yamaguchi
Sadahiko Sanki
Yasuhiko Miyake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP19353987A priority Critical patent/JPS6436440A/en
Publication of JPS6436440A publication Critical patent/JPS6436440A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To make a clad material for electronic components which has low expansibility and high adhesiveness, thermal conductivity and electrical conductivity, by preparing a Fe-Ni-alloy plate as base material, cladding one side of the plate with Cu and the other side with Al, and making the percentage by volume of Al more than that of Cu when preventing the bending of this plate. CONSTITUTION:A clad material is made by rolling, pressing and sticking Al 3 on one side and Cu 2 on the other side of a Fe-Ni-alloy plate 1. Then, epoxy resin as an insulating layer 5 is pressed and sticked by heating on the Al side 3 of the clad and an electrolytic copper foil 6 is pressed and sticked by heating on the epoxy resin to make a surface mounting substrate. After the surface Cu foil of this composite substrate is patterned by etching and a circuit is formed on it, an IC element 8 is mounted on it and connected with a bonding wire 7 to make a semiconductor device. In this way it is possible to obtain a cladding material for electronic components which has low expansibility, high adhesiveness with isolation material, also high electrical conductivity and thermal conductivity.
JP19353987A 1987-08-01 1987-08-01 Clad material for electronic components Pending JPS6436440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19353987A JPS6436440A (en) 1987-08-01 1987-08-01 Clad material for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19353987A JPS6436440A (en) 1987-08-01 1987-08-01 Clad material for electronic components

Publications (1)

Publication Number Publication Date
JPS6436440A true JPS6436440A (en) 1989-02-07

Family

ID=16309756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19353987A Pending JPS6436440A (en) 1987-08-01 1987-08-01 Clad material for electronic components

Country Status (1)

Country Link
JP (1) JPS6436440A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0716981A (en) * 1993-07-02 1995-01-20 Tokyo Tungsten Co Ltd Metallic composite component
JP2003237010A (en) * 2002-02-18 2003-08-26 Toyo Kohan Co Ltd Method for manufacturing resistance plate laminated material and method for manufacturing component using resistance plate laminated material
JP2005340578A (en) * 2004-05-28 2005-12-08 Sanyo Electric Co Ltd Circuit device
CN102602111A (en) * 2012-02-21 2012-07-25 甄凯军 Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0716981A (en) * 1993-07-02 1995-01-20 Tokyo Tungsten Co Ltd Metallic composite component
JP2003237010A (en) * 2002-02-18 2003-08-26 Toyo Kohan Co Ltd Method for manufacturing resistance plate laminated material and method for manufacturing component using resistance plate laminated material
JP2005340578A (en) * 2004-05-28 2005-12-08 Sanyo Electric Co Ltd Circuit device
CN102602111A (en) * 2012-02-21 2012-07-25 甄凯军 Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product

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