JPS6444030A - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- JPS6444030A JPS6444030A JP19973387A JP19973387A JPS6444030A JP S6444030 A JPS6444030 A JP S6444030A JP 19973387 A JP19973387 A JP 19973387A JP 19973387 A JP19973387 A JP 19973387A JP S6444030 A JPS6444030 A JP S6444030A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- recess
- circuit
- chip
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE:To easily and inexpensively obtain a semiconductor package having an excellent mechanical strength and a thin mounting thickness by mounting a semiconductor chip in a recess formed with a printed substrate formed in advance with a circuit. CONSTITUTION:A circuit forming copper foil is formed on a flexible printed substrate 1, the foil is etched in a predetermined pattern to form a circuit 3 containing a circuit terminal for mounting a semiconductor chip, and a recess 2 is then formed by a hot press at a predetermined part of the substrate 1. Then, a semiconductor chip 4 having 0.4mm of thickness printed in advance with solder paste by screen printing is engaged within the recess 2, and heated while press-bonding to connect the wirings of the chip 4 to the circuit terminal. Thereafter, flux is cleaned, epoxy potting resin 6 is filled in the recess 2 of the substrate 1 on which the chip 4 is mounted, thermally cured, the substrate 1 is eventually cut in a desired profile to obtain a semiconductor package 100.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19973387A JPS6444030A (en) | 1987-08-12 | 1987-08-12 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19973387A JPS6444030A (en) | 1987-08-12 | 1987-08-12 | Semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6444030A true JPS6444030A (en) | 1989-02-16 |
Family
ID=16412718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19973387A Pending JPS6444030A (en) | 1987-08-12 | 1987-08-12 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6444030A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02152247A (en) * | 1988-12-02 | 1990-06-12 | Nec Corp | Resin-sealed type semiconductor device |
US8183873B2 (en) | 2008-10-22 | 2012-05-22 | Fujitsu Limited | Contact sensor unit, electronic device, and method for producing a contact sensor unit |
-
1987
- 1987-08-12 JP JP19973387A patent/JPS6444030A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02152247A (en) * | 1988-12-02 | 1990-06-12 | Nec Corp | Resin-sealed type semiconductor device |
US8183873B2 (en) | 2008-10-22 | 2012-05-22 | Fujitsu Limited | Contact sensor unit, electronic device, and method for producing a contact sensor unit |
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