GB0706875D0 - Thick-film hybrid production process - Google Patents
Thick-film hybrid production processInfo
- Publication number
- GB0706875D0 GB0706875D0 GBGB0706875.2A GB0706875A GB0706875D0 GB 0706875 D0 GB0706875 D0 GB 0706875D0 GB 0706875 A GB0706875 A GB 0706875A GB 0706875 D0 GB0706875 D0 GB 0706875D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- thick
- pads
- film
- substrate
- metallised
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 3
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
- C04B41/90—Coating or impregnation for obtaining at least two superposed coatings having different compositions at least one coating being a metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
A process for producing a thick-film hybrid, comprises the steps of: providing a ceramic substrate 1; printing at least one thick-film conducting layer 2 onto the substrate to form a conductive pattern on the substrate, the pattern comprising at least one conductive pad located for subsequent connection to an electrical component; covering at least a portion of the thick-film conductor with an insulating overglaze 3, leaving each pad uncovered by the overglaze; metallising the pads 4; and electrically connecting electrical components 7 to the metallised pads. The hybrid produced is suitable for use at ambient temperatures above 150{C. A printed resistor may also be formed. The pads may be metallised with layers of nickel and gold. Components 7 may be attached to the pads by solder, conducting adhesive, ultrasonically bonded aluminium wire or micro-welded nickel strips.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0420992A GB2418538A (en) | 2004-09-22 | 2004-09-22 | Thick-film printed circuit |
PCT/GB2005/003290 WO2006032836A1 (en) | 2004-09-22 | 2005-08-24 | Thick-film hybrid production process |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0706875D0 true GB0706875D0 (en) | 2007-05-16 |
GB2432978A GB2432978A (en) | 2007-06-06 |
Family
ID=33306966
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0420992A Withdrawn GB2418538A (en) | 2004-09-22 | 2004-09-22 | Thick-film printed circuit |
GB0706875A Withdrawn GB2432978A (en) | 2004-09-22 | 2005-08-24 | Thick-film hybrid production process |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0420992A Withdrawn GB2418538A (en) | 2004-09-22 | 2004-09-22 | Thick-film printed circuit |
Country Status (3)
Country | Link |
---|---|
GB (2) | GB2418538A (en) |
NO (1) | NO20071954L (en) |
WO (1) | WO2006032836A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107041061A (en) * | 2015-12-22 | 2017-08-11 | 德国贺利氏公司 | Pass through the enhanced direct copper-clad base plate of thick film ink |
EP3301082A1 (en) | 2016-09-30 | 2018-04-04 | Infineon Technologies AG | Method for producing a metal-ceramic substrate, and a metal-ceramic substrate |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4870240A (en) * | 1987-01-30 | 1989-09-26 | Siemens Aktiengesellschaft | Apparatus for contacting wires with resistance welding |
JPS63253659A (en) * | 1987-04-10 | 1988-10-20 | Hitachi Ltd | Thick-film hybrid integrated circuit device |
JPH02112201A (en) * | 1988-10-21 | 1990-04-24 | Hitachi Ltd | Thick film hybrid integrated circuit |
JPH03244183A (en) * | 1990-02-22 | 1991-10-30 | Matsushita Electric Ind Co Ltd | Thick film integrated circuit device |
JPH04296088A (en) * | 1991-03-25 | 1992-10-20 | Nec Corp | Thick film hybrid integrated circuit device |
JPH0846357A (en) * | 1994-07-29 | 1996-02-16 | Hitachi Ltd | Production of thin film ceramic hybrid board |
JPH08162746A (en) * | 1994-11-30 | 1996-06-21 | Taiyo Yuden Co Ltd | Circuit board |
DE19646369B4 (en) * | 1996-11-09 | 2008-07-31 | Robert Bosch Gmbh | Ceramic multilayer circuit and method for its production |
JP2000207938A (en) * | 1999-01-13 | 2000-07-28 | Murata Mfg Co Ltd | Insulative glass paste and thick-film circuit parts |
JP2000216187A (en) * | 1999-01-20 | 2000-08-04 | Fuji Electric Co Ltd | Module with built-in electronic parts |
JP4019543B2 (en) * | 1999-03-23 | 2007-12-12 | 株式会社デンソー | Circuit board manufacturing method |
DE60021828D1 (en) * | 1999-10-28 | 2005-09-15 | Murata Manufacturing Co | Thick film resistor and ceramic substrate |
DE10333439A1 (en) * | 2003-07-23 | 2005-02-17 | Robert Bosch Gmbh | A method of making a multi-wiring hybrid product |
-
2004
- 2004-09-22 GB GB0420992A patent/GB2418538A/en not_active Withdrawn
-
2005
- 2005-08-24 GB GB0706875A patent/GB2432978A/en not_active Withdrawn
- 2005-08-24 WO PCT/GB2005/003290 patent/WO2006032836A1/en active Application Filing
-
2007
- 2007-04-17 NO NO20071954A patent/NO20071954L/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
GB0420992D0 (en) | 2004-10-20 |
NO20071954L (en) | 2007-06-22 |
GB2432978A (en) | 2007-06-06 |
GB2418538A (en) | 2006-03-29 |
WO2006032836A1 (en) | 2006-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104051408B (en) | Module and its manufacture method | |
JP2755252B2 (en) | Semiconductor device package and semiconductor device | |
JP2006253289A5 (en) | ||
JPS592179B2 (en) | Method of manufacturing electrical components | |
JPH0951020A (en) | Semiconductor device and its manufacturing method and ic card | |
JP2917964B2 (en) | Semiconductor device structure and method of manufacturing the same | |
GB0706875D0 (en) | Thick-film hybrid production process | |
CN101483210A (en) | Substrate construction for LED | |
TW200931633A (en) | Structure of LED substrate | |
JP4741624B2 (en) | Wiring board | |
JP4671511B2 (en) | Wiring board manufacturing method | |
JPH0744202B2 (en) | Chip mounting method | |
JPS61230961A (en) | Thin film thermal head | |
JP3890850B2 (en) | Electronic circuit equipment | |
JPS6436440A (en) | Clad material for electronic components | |
JPS6347157B2 (en) | ||
JP2000216546A (en) | Laminated board having bottomed via hole | |
JP2634592B2 (en) | Circuit board with low resistance and method of manufacturing the same | |
JP2004241732A5 (en) | Thick film multilayer wiring board and method of manufacturing the same | |
JP4557461B2 (en) | Wiring board | |
JP2797995B2 (en) | Semiconductor device | |
JP2743524B2 (en) | Hybrid integrated circuit device | |
JPH02153543A (en) | Flexible printed board | |
KR19980063922A (en) | Heat slag and semiconductor device for semiconductor device | |
JPH0632420B2 (en) | Manufacturing method of flexible wiring board with shield |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |