JPS6432682A - Optoelectronic semiconductor - Google Patents

Optoelectronic semiconductor

Info

Publication number
JPS6432682A
JPS6432682A JP62189364A JP18936487A JPS6432682A JP S6432682 A JPS6432682 A JP S6432682A JP 62189364 A JP62189364 A JP 62189364A JP 18936487 A JP18936487 A JP 18936487A JP S6432682 A JPS6432682 A JP S6432682A
Authority
JP
Japan
Prior art keywords
inner end
end sections
external electrode
terminals
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62189364A
Other languages
Japanese (ja)
Inventor
Shuichi Osaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62189364A priority Critical patent/JPS6432682A/en
Publication of JPS6432682A publication Critical patent/JPS6432682A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To eliminate the need for connection by a metallic small-gage wire, and to improve productivity largely by directly fixing a glass plate and a lead terminal directly fastening the lead terminal and an external electrode for a semiconductor element through a bump. CONSTITUTION:The inner end sections of a plurality of lead terminals 2 surrounding a semiconductor element 3 region are bonded and fixed onto one surface of a mounting substrate 1. An element 3, on the surface of which an external electrode is disposed, is placed onto the inner end sections of the terminal 2 while the surface of the element 3 is directed toward the substrate 1 side. Mutually corresponding external electrode and inner end sections of the terminals 2 are connected directly through bumps 4. The inner end sections of the terminals 2 and the whole of the element 3 are sealed integrally with an insulating resin material 5 coating one surface side of the substrate 1. Accordingly, connection by a metallic small-gage wire is unnecessitated, thus largely improving productivity.
JP62189364A 1987-07-28 1987-07-28 Optoelectronic semiconductor Pending JPS6432682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62189364A JPS6432682A (en) 1987-07-28 1987-07-28 Optoelectronic semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62189364A JPS6432682A (en) 1987-07-28 1987-07-28 Optoelectronic semiconductor

Publications (1)

Publication Number Publication Date
JPS6432682A true JPS6432682A (en) 1989-02-02

Family

ID=16240084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62189364A Pending JPS6432682A (en) 1987-07-28 1987-07-28 Optoelectronic semiconductor

Country Status (1)

Country Link
JP (1) JPS6432682A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH021179A (en) * 1988-02-09 1990-01-05 Canon Inc Manufacture of photoelectric conversion device
US5321204A (en) * 1990-10-13 1994-06-14 Gold Star Electron Co., Ltd. Structure of charged coupled device
WO2006030611A1 (en) * 2004-09-14 2006-03-23 Sony Chemical & Information Device Corporation Function element mounting module and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4922857B1 (en) * 1970-12-25 1974-06-12
JPS59110174A (en) * 1982-12-15 1984-06-26 Hitachi Ltd Solid-state image pick-up device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4922857B1 (en) * 1970-12-25 1974-06-12
JPS59110174A (en) * 1982-12-15 1984-06-26 Hitachi Ltd Solid-state image pick-up device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH021179A (en) * 1988-02-09 1990-01-05 Canon Inc Manufacture of photoelectric conversion device
US5321204A (en) * 1990-10-13 1994-06-14 Gold Star Electron Co., Ltd. Structure of charged coupled device
WO2006030611A1 (en) * 2004-09-14 2006-03-23 Sony Chemical & Information Device Corporation Function element mounting module and manufacturing method thereof
JP2006186288A (en) * 2004-09-14 2006-07-13 Sony Chem Corp Functional element mounted module and manufacturing method thereof

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