JPS6428928A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6428928A
JPS6428928A JP18351787A JP18351787A JPS6428928A JP S6428928 A JPS6428928 A JP S6428928A JP 18351787 A JP18351787 A JP 18351787A JP 18351787 A JP18351787 A JP 18351787A JP S6428928 A JPS6428928 A JP S6428928A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
denatured
coupling agent
denatured resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18351787A
Other languages
Japanese (ja)
Inventor
Teru Okunoyama
Hiroshi Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP18351787A priority Critical patent/JPS6428928A/en
Publication of JPS6428928A publication Critical patent/JPS6428928A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain a semiconductor device whose bonding performance, resistance to hydrolysis, moistureproof reliability and hardening speed are excellent by a method wherein a semiconductor chip and a lead frame are bonded by using a denatured resin composition whose constituents are a denatured resin composed of polyparahydroxystyrene and an epoxy resin, a silane-based coupling agent containing a ureide group and a conductor powder. CONSTITUTION:A semiconductor device is manufactured in the following manner: a denatured resin composed of polyparahydroxystyrene and an epoxy resin, a ureide silane-based coupling agent and a conductive powder are mixed sufficiently according to an ordinary method; after that, this mixture is kneaded, e.g., by using three rolls, a semiconductor chip and a lead frame are bonded by an obtained denatured resin composition; this composition is hardended in a short time by using a heat block or the like; after that, a wire bonding operation is executed; after that, the semiconductor device is sealed by using a resin. Because the denatured resin and the silanebased coupling agent containing a ureide group are used, the bonding performance between the resin and a wire is enhanced; a high-speed hardening operation can be executed.
JP18351787A 1987-07-24 1987-07-24 Semiconductor device Pending JPS6428928A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18351787A JPS6428928A (en) 1987-07-24 1987-07-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18351787A JPS6428928A (en) 1987-07-24 1987-07-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6428928A true JPS6428928A (en) 1989-01-31

Family

ID=16137229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18351787A Pending JPS6428928A (en) 1987-07-24 1987-07-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6428928A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5657792A (en) * 1979-10-15 1981-05-20 Shin Etsu Chem Co Ltd Preparation of ureido group-containing alkoxysilane
JPS60189229A (en) * 1984-03-09 1985-09-26 Toshiba Chem Corp Semiconductor device
JPS60193349A (en) * 1984-03-15 1985-10-01 Toshiba Chem Corp Semiconductor element
JPS6110247A (en) * 1984-06-26 1986-01-17 Hitachi Chem Co Ltd Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5657792A (en) * 1979-10-15 1981-05-20 Shin Etsu Chem Co Ltd Preparation of ureido group-containing alkoxysilane
JPS60189229A (en) * 1984-03-09 1985-09-26 Toshiba Chem Corp Semiconductor device
JPS60193349A (en) * 1984-03-15 1985-10-01 Toshiba Chem Corp Semiconductor element
JPS6110247A (en) * 1984-06-26 1986-01-17 Hitachi Chem Co Ltd Semiconductor device

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