JPS642050A - Pattern forming method - Google Patents
Pattern forming methodInfo
- Publication number
- JPS642050A JPS642050A JP15820487A JP15820487A JPS642050A JP S642050 A JPS642050 A JP S642050A JP 15820487 A JP15820487 A JP 15820487A JP 15820487 A JP15820487 A JP 15820487A JP S642050 A JPS642050 A JP S642050A
- Authority
- JP
- Japan
- Prior art keywords
- illuminating
- resist
- rays
- alkali
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To enable only light exposed parts to be developed without reducing the film thickness of unexposed parts by selectively illuminating a resist film with far ultraviolet rays and uniformly illuminating the whole surface with X-rays before or after said first illumination. CONSTITUTION:A pattern forming material 2 contains an organic polymer small in light absorption near a wavelength of 249nm, such as formula I, and a photoreactive reagent, such as formula II. The resist pattern 2a is obtained by coating a base plate 1 twice with said material 2 to form the resist film, illuminating it through a mask pattern with 249nm KrF excimer laser beams 3 to convert the reagent in the illuminated parts into an alkali-soluble type, then, uniformly illuminating the whole surface with X rays or doing so before the laser illumination to cross-link the resist, and finally developing it with alkali.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15820487A JPS642050A (en) | 1987-06-25 | 1987-06-25 | Pattern forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15820487A JPS642050A (en) | 1987-06-25 | 1987-06-25 | Pattern forming method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH012050A JPH012050A (en) | 1989-01-06 |
JPS642050A true JPS642050A (en) | 1989-01-06 |
Family
ID=15666557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15820487A Pending JPS642050A (en) | 1987-06-25 | 1987-06-25 | Pattern forming method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS642050A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07164495A (en) * | 1993-12-17 | 1995-06-27 | Nec Corp | Injection molding process for plastic molded article |
EP1035436A1 (en) * | 1999-03-08 | 2000-09-13 | JSR Corporation | Resist pattern formation method |
-
1987
- 1987-06-25 JP JP15820487A patent/JPS642050A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07164495A (en) * | 1993-12-17 | 1995-06-27 | Nec Corp | Injection molding process for plastic molded article |
EP1035436A1 (en) * | 1999-03-08 | 2000-09-13 | JSR Corporation | Resist pattern formation method |
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