JPS641955B2 - - Google Patents
Info
- Publication number
- JPS641955B2 JPS641955B2 JP4289878A JP4289878A JPS641955B2 JP S641955 B2 JPS641955 B2 JP S641955B2 JP 4289878 A JP4289878 A JP 4289878A JP 4289878 A JP4289878 A JP 4289878A JP S641955 B2 JPS641955 B2 JP S641955B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- printed wiring
- copper foil
- wiring board
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 239000011888 foil Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- -1 polybutylene terephthalate Polymers 0.000 claims description 6
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims description 5
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims description 5
- 229940112669 cuprous oxide Drugs 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000011889 copper foil Substances 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 238000000465 moulding Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229920013683 Celanese Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明は安価な樹脂材料を用いて金属箔との接
着強度が強く、十分なはんだ耐熱性を有する印刷
配線板の製造方法を提供するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for manufacturing a printed wiring board that uses an inexpensive resin material, has strong adhesive strength with metal foil, and has sufficient solder heat resistance.
従来、印刷配線板の基体としてはフエノール樹
脂、エポキシ樹脂などの熱硬化性樹脂が主体であ
り、その供給は銅張積層板という形で供給されて
加工されている。四弗化エチレン樹脂，ポリイミ
ド樹脂などの熱可塑性樹脂はフイルムとして供給
されるが、銅箔の接着性がよくなく、手数のかか
る表面処理を必要とし、価格も熱硬化性樹脂から
成る積層板より上廻つていた。ポリエチレンテレ
フタレイト樹脂はポリエステルフイルムの名称で
供給される。これは安価であるが、はんだ耐熱性
が不足するため印刷配線板の基体として使えな
い。ポリアセタール樹脂もはんだ耐熱性の点で不
適格であり、ポリカーボネイト樹脂，ポリサルフ
オン樹脂，ポリフエニレンオキサイド樹脂などは
耐溶剤性の点で（例えば芳香族系溶剤のメチルエ
チルケトン）使用不適格であつた。銅箔を被着し
た積層板あるいはフイルムは、レジストの印刷、
選択的なエツチング、レジストの除去、孔加工な
どの各工程を経て作られるため、吸水−乾燥のサ
イクルが繰り返される。そのため、印刷配線板基
体の特性の不揃い、特性劣化を伴ないかつ製造量
が毎月1000平方米ともなると、製造に１週間以上
をも要するという問題点があつた。 Conventionally, thermosetting resins such as phenolic resins and epoxy resins have been mainly used as substrates for printed wiring boards, and these resins have been supplied and processed in the form of copper-clad laminates. Thermoplastic resins such as tetrafluoroethylene resin and polyimide resin are supplied as films, but they do not have good adhesion to copper foil, require time-consuming surface treatment, and are more expensive than laminates made of thermosetting resins. It was going around. Polyethylene terephthalate resin is supplied under the name polyester film. Although this material is inexpensive, it cannot be used as a substrate for printed wiring boards because of its lack of solder heat resistance. Polyacetal resins are also unsuitable for use in terms of soldering heat resistance, and polycarbonate resins, polysulfone resins, polyphenylene oxide resins, etc. are unsuitable for use in terms of solvent resistance (for example, the aromatic solvent methyl ethyl ketone). Laminated boards or films coated with copper foil can be used for resist printing,
Since it is made through various steps such as selective etching, resist removal, and hole drilling, the cycle of water absorption and drying is repeated. As a result, there was a problem in that the printed wiring board substrate had uneven characteristics and deteriorated characteristics, and if the production volume was 1,000 square meters per month, it would take more than a week to manufacture.
本発明の方法においては、安価なポリエチレン
テレフタレイト樹脂に着目し、そのはんだ耐熱性
をポリブチレンテレフタレイトとして改良された
樹脂を用いる。この種の樹脂を用いた難燃性モー
ルド樹脂は、1970年に米セラニーズ社から、また
1971年に米GE社および同イーストマンコダツク
社からそれぞれ発表されている。これはガラス粉
とかアスベスト粉を混じて機械的強度の温度特性
を改良したものであるが、印刷配線回路板として
の展開はみられなかつた。その理由は判然としな
いが、恐らく第１の理由として接着剤塗布銅箔と
接着しにくい事実（勿論銅箔のみにも接着しにく
い）また第２の理由として、はんだ耐熱性が充分
でないことにあつたと思われる。 In the method of the present invention, attention is paid to inexpensive polyethylene terephthalate resin, and a resin whose soldering heat resistance has been improved by changing it to polybutylene terephthalate is used. Flame-retardant molding resin using this type of resin was developed by Celanese Company in 1970.
It was announced in 1971 by GE and Eastman Kodak, respectively. This was made by mixing glass powder or asbestos powder to improve the mechanical strength and temperature characteristics, but it was not developed into a printed wiring circuit board. The reason for this is not clear, but the first reason is probably the fact that it is difficult to adhere to adhesive-coated copper foil (of course it is difficult to adhere to copper foil alone), and the second reason is that the solder heat resistance is not sufficient. It seems to be hot.
本発明はまず前記第１のおよび第２の原因を排
除することから始まる。まず第１の原因を排除す
るために公知の接続剤付銅箔はフエノール樹脂，
ブチラール樹脂あるいは合成ゴム系の接着剤を組
成の全部または一部に用いているから、接着性が
よくないことが判明した。つぎに圧延とか電着し
た銅箔を直接接着する方法もあまりよい結果が得
られなかつた。そして最後に、銅箔の裏面に液体
ホーニングによつて凹凸をつけた粗面を成型板に
圧接することによつて接着剤なしの接着が成型板
について可能である事を見出した。成型中に同時
に、銅箔とかアルミ箔の全面あるいは前記箔をダ
イスタンピングした形で接着することも可能であ
つたが、、成型板に対して成型後接着することも
可能であつた。そしてさらに成型とか銅箔接着に
失敗した樹脂を再使用することも可能である事を
見出した。これはまた導電ペイント，抵抗ペイン
ト導体の印刷に失敗した樹脂成型物も再生して使
用できる点で画期的な事実であつた。すなわち工
程不良品を再生可能とし、くずを外部に排出しな
いからである。銅箔裏面の粗面化部分に、亜酸化
銅処理を施こして置く事によつて前記粗面の長期
保管に耐える事も見出した。 The present invention begins by eliminating the first and second causes. First of all, in order to eliminate the first cause, the known copper foil with connecting agent is made of phenolic resin,
It has been found that adhesive properties are poor because butyral resin or synthetic rubber adhesives are used in all or part of the composition. Next, methods of directly adhering rolled or electrodeposited copper foil did not yield very good results. Finally, we discovered that it was possible to bond the molded plate without adhesive by pressing the rough surface of the copper foil, which had been made uneven by liquid honing, onto the molded plate. Although it was possible to bond the entire surface of the copper foil or aluminum foil or the foil in the form of die stamping at the same time during molding, it was also possible to bond the foil to the molding plate after molding. We also discovered that it is possible to reuse resin that has failed in molding or copper foil bonding. This was also an epoch-making fact in that resin moldings that failed to be printed with conductive paint or resistive paint conductors could be recycled and used. In other words, it is possible to recycle defective products in the process and no waste is discharged to the outside. It has also been found that by applying cuprous oxide treatment to the roughened portion on the back side of the copper foil, the roughened surface can withstand long-term storage.
次に第２の原因を排除するために、はんだ耐熱
の条件である260℃・10秒（デイツプソルダリン
グ）、350℃・２秒（はんだごて作業）は銅箔の非
粗面側に当てられる事を考慮すれば、銅箔粗面で
の熱放散と、粗面をおおう厚さ約1μmの亜酸化銅
層による熱バリヤ効果によつて熱の直撃を緩和す
ることができる。さらに樹脂中にガラス粉，アス
ベスト粉などを混じると樹脂自体の熱変形温度が
見掛上高くなり、５Kg／cm2程度の応力負荷であれ
ば、ガラス粉30％で232℃の熱変形温度が得られ
る。（試験法はAGTMのD648）。そして応力負荷
が殆んどない条件下では350℃３秒，260℃・20秒
の無熱変形性を有するようになることを見出し
た。銅箔との接着を樹脂成型時おこなつてエツチ
ング加工をおこなつて導体としたり、樹脂中のガ
ラス粉を少なくしてフレキシブル性配線板とした
りすることも可能であつた。一担樹脂板として成
型後の銅箔接着は200℃、曲げ加工は80〜150℃の
加温下で可能であり、ポストフオーミング印刷配
線板としても使用できる。また銅箔導体を接着す
るときフラツシユな導体として押し込む事もでき
る。 Next, in order to eliminate the second cause, the soldering heat resistance conditions of 260℃ for 10 seconds (dip soldering) and 350℃ for 2 seconds (soldering iron work) are applied to the non-rough side of the copper foil. Considering the fact that the copper foil is exposed to heat, direct heat damage can be alleviated by heat dissipation on the rough surface of the copper foil and the thermal barrier effect of the cuprous oxide layer with a thickness of about 1 μm covering the rough surface. Furthermore, if glass powder, asbestos powder, etc. are mixed into the resin, the heat distortion temperature of the resin itself will apparently increase.If the stress load is about 5 kg/cm2, the heat distortion temperature will be 232℃ with 30% glass powder. can get. (Test method is AGTM D648). We also found that under conditions with almost no stress load, it has a non-thermal deformability of 350°C for 3 seconds and 260°C for 20 seconds. It was also possible to make a conductor by adhering copper foil during resin molding and etching it, or to make a flexible wiring board by reducing the amount of glass powder in the resin. Copper foil can be bonded at 200°C after being molded as a single resin plate, and bending can be performed at 80-150°C, and can also be used as a post-forming printed wiring board. It can also be pressed in as a flat conductor when bonding copper foil conductors.
実施例
第１図に示すように米セラニーズ社のポリブチ
レンテレフタレイト樹脂のガラス粉30％を含む成
型用ペレツト１と金型２とを用意し、射出成形機
によつて成型する。この際、ランナー直径3.0mm，
ランナー長60mm，ゲート直径1.0mm，ランドの長
さ1.0mmのピンゲートを用い、温度240℃，射出圧
力750Kg／cm2で、厚さ1.6mmで10×20cmの成型板４
を得た。樹脂の非流入側に銅箔５として粗面と亜
酸化銅処理面とを有する側を向けて配置してピン
３により形成した孔をテンテイングした形の導体
層５を形成することもできた。EXAMPLE As shown in FIG. 1, a molding pellet 1 containing 30% glass powder of polybutylene terephthalate resin manufactured by Celanese Co., Ltd. and a mold 2 are prepared and molded using an injection molding machine. At this time, the runner diameter is 3.0mm,
Using a pin gate with a runner length of 60 mm, a gate diameter of 1.0 mm, and a land length of 1.0 mm, a molded plate 4 of 10 x 20 cm with a thickness of 1.6 mm was prepared at a temperature of 240°C and an injection pressure of 750 Kg/cm2.
I got it. It was also possible to form a conductor layer 5 in the form of tenting holes formed by pins 3 by arranging the copper foil 5 with its rough surface and cuprous oxide treated surface facing the non-inflow side of the resin.
以上のように、本発明の方法によれば、金属箔
の一方の面に粗面化処理を施し、この面に樹脂基
体を射出成形して接着させるので、接着剤を使わ
ずに、金属箔と樹脂とを強固に接着することがで
きる。さらに、金属箔の樹脂側を粗面化すること
により、金属箔の非粗面側がはんだ浴等の熱にさ
らされたときに粗面側での熱放散があり、印刷配
線板の耐熱性が向上する。したがつて、従来印刷
配線板として利用できなかつたポリブチレンテレ
フタレイトが使用可能となり、印刷配線板を安価
に提供することができる。さらに、金属箔の粗面
側を亜酸化銅処理すれば、粗面のままでも長期間
保存でき、またはんだ浴等の熱に対して樹脂側へ
伝導しにくくなるため、耐熱性が一段と高められ
る。 As described above, according to the method of the present invention, one surface of the metal foil is subjected to surface roughening treatment, and a resin substrate is injection molded to this surface and bonded. and resin can be firmly bonded. Furthermore, by roughening the resin side of the metal foil, when the non-rough side of the metal foil is exposed to heat from a solder bath, heat dissipates from the rough side, improving the heat resistance of the printed wiring board. improves. Therefore, polybutylene terephthalate, which could not be used for printed wiring boards in the past, can be used, and printed wiring boards can be provided at low cost. Furthermore, if the rough side of the metal foil is treated with cuprous oxide, it can be stored for a long time even with the rough surface, and heat resistance from soldering baths etc. is less likely to be conducted to the resin side, further increasing heat resistance. .
第１図は本発明の方法の一実施例を適用して製
造している印刷配線板の断面図である。
４……成型板、５……導体箔。
FIG. 1 is a sectional view of a printed wiring board manufactured by applying an embodiment of the method of the present invention. 4...Molded plate, 5...Conductor foil.
Claims (1)
理を施し、この面にポリブチレンテレフタレイト
系の樹脂エラストマーよりなる樹脂基体を射出成
形して接着させ、フレキシブル印刷配線板を形成
することを特徴とする印刷配線板の製造方法。 ２ 金属箔の一方の面を粗面化処理した後に亜酸
化銅処理を施すことを特徴とする特許請求の範囲
第１項記載の印刷配線板の製造方法。[Scope of Claims] 1. One surface of a conductive metal foil is roughened, and a resin base made of a polybutylene terephthalate resin elastomer is injection molded and adhered to this surface to create a flexible material. A method for manufacturing a printed wiring board, the method comprising forming a printed wiring board. 2. The method for manufacturing a printed wiring board according to claim 1, characterized in that one surface of the metal foil is roughened and then subjected to cuprous oxide treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4289878A JPS54135364A (en) | 1978-04-11 | 1978-04-11 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4289878A JPS54135364A (en) | 1978-04-11 | 1978-04-11 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54135364A JPS54135364A (en) | 1979-10-20 |
| JPS641955B2 true JPS641955B2 (en) | 1989-01-13 |
Family
ID=12648840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4289878A Granted JPS54135364A (en) | 1978-04-11 | 1978-04-11 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54135364A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01115556U (en) * | 1988-01-29 | 1989-08-03 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057994A (en) * | 1983-09-09 | 1985-04-03 | 松下電器産業株式会社 | Printed circuit board with printing resistor |
| WO2004041533A1 (en) | 2002-11-08 | 2004-05-21 | Taisei Plas Co., Ltd. | Composite of aluminum alloy and resin composition and process for producing the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946786B2 (en) * | 1975-03-26 | 1984-11-14 | 帝人株式会社 | Adhesion method between metal and polyester sheet |
| JPS5825591B2 (en) * | 1975-11-26 | 1983-05-28 | 東レ株式会社 | Hifukukinzokuseikeihin no seizouhouhou |
-
1978
- 1978-04-11 JP JP4289878A patent/JPS54135364A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01115556U (en) * | 1988-01-29 | 1989-08-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54135364A (en) | 1979-10-20 |
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