JP2551196B2 - Transfer sheet for injection molded printed circuit boards - Google Patents
Transfer sheet for injection molded printed circuit boardsInfo
- Publication number
- JP2551196B2 JP2551196B2 JP2084727A JP8472790A JP2551196B2 JP 2551196 B2 JP2551196 B2 JP 2551196B2 JP 2084727 A JP2084727 A JP 2084727A JP 8472790 A JP8472790 A JP 8472790A JP 2551196 B2 JP2551196 B2 JP 2551196B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer sheet
- printed circuit
- film
- carrier film
- molded printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14827—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、効率よく射出成形プリント基板を得る為の
転写シートに関するものである。TECHNICAL FIELD The present invention relates to a transfer sheet for efficiently obtaining an injection-molded printed circuit board.
従来の技術 転写法による射出成形プリント配線板を得る方法とし
ては、導電性及び絶縁性ペーストとを用いて積層印刷さ
れた積層回路ユニットを形成した転写シートを用いる方
法（特開昭63−219189）や導電性インクの溶剤により侵
される材料からなる剥離層、保護層、導電性インクより
なる印刷回路を設けた転写シートを用いる方法（特開昭
63−257293）が、また、上記方法の電気的特性、耐熱性
等の問題点を解決する方法として、本発明者らにより、
銅箔を特定の離型層（粘着剤）によりキャリアフィルム
に積層し、エッチング法で回路化して用いる方法（特願
平01−161383号）が提案されている。2. Description of the Related Art As a method for obtaining an injection-molded printed wiring board by a transfer method, a method using a transfer sheet on which a laminated circuit unit is printed by using conductive and insulating pastes (JP-A-63-219189) And a method of using a transfer sheet provided with a release layer made of a material that is corroded by a solvent of a conductive ink, a protective layer, and a printed circuit made of a conductive ink (Japanese Patent Laid-Open No. Sho 61-206).
63-257293), as a method of solving the problems of the electrical characteristics, heat resistance and the like of the above method, the present inventors have
There is proposed a method (Japanese Patent Application No. 01-161383) in which a copper foil is laminated on a carrier film with a specific release layer (adhesive), and is formed into a circuit by an etching method.
発明が解決しようとする課題 しかしながら、導電ペーストを使用した転写シートの
場合には、ペースト自身の耐熱性が低く、射出された樹
脂により回路が流れてしまうという問題点があった。
又、前述した銅箔回路による転写シートを使用した場合
でも、射出成形時に使用する樹脂にガラス繊維等を充填
したために流動性が悪くなった場合や、ゲートの種類等
により、局部的に、負荷が大きくなると、射出時の衝撃
により第２図に例示するごとくキャリアフィルムと離型
層間に剥離が生じ、結果として回路損傷に到ってしまう
という恐れがあった。この回路損傷は特にゲート周辺部
において発生する確率が高い。本発明は、キャリアフィ
ルムと、離型層との密着力を高め上述の問題を解決する
ことを目的とするものである。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the case of a transfer sheet using a conductive paste, there is a problem that the heat resistance of the paste itself is low and a circuit flows due to the injected resin.
Even when the transfer sheet using the copper foil circuit described above is used, if the resin used for injection molding has a poor fluidity due to glass fiber or the like, or the type of gate, etc. When the value of γ becomes large, there is a risk that the impact at the time of injection causes peeling between the carrier film and the release layer as illustrated in FIG. 2, resulting in circuit damage. This circuit damage is particularly likely to occur in the peripheral area of the gate. An object of the present invention is to improve the adhesion between a carrier film and a release layer and solve the above problems.
課題を解決するための手段 上記の様なキャリアフィルムと、離型層との剥離を防
止する手段としては、キャリアフィルム表面の接着力向
上処理、あるいは離型層自体の組成改良により接着力を
向上させる方法が考えられる。Means for Solving the Problem As a means for preventing peeling between the carrier film and the release layer as described above, the adhesive force is improved by treating the surface of the carrier film for improving the adhesive force or improving the composition of the release layer itself. The method of making it possible is considered.
後者の方法は、離型層として要求される他の特性の低
下例えば、耐熱性の低下、銅箔回路との離型性の不良化
等の恐れがあり適切な方法とはいえない。The latter method is not an appropriate method because there is a risk of deterioration of other properties required for the release layer, for example, deterioration of heat resistance and deterioration of releasability from the copper foil circuit.
前者の方法は離型層特性を変化させることないことか
ら表面の接着力向上処理につき種々検討した。その結果
フィルムの表面を粗化することにより目的を達成するこ
とを見い出した。特に表面粗度を表面粗さ計で測定した
ときのRmaxが少なくとも0.5μｍ以上、好ましくは1.5μ
ｍないし5.0μｍのものを使用することによりアンカー
効果等により非常に優れた接着力向上が得られ、この様
な表面粗化処理フィルムを転写シートに使用すること
で、前述の問題点を解決できる事を見い出し本発明を完
成するに至ったものである。尚、0.5μｍ未満では充分
なアンカー効果が得られず、また5.0μｍを超えるとフ
ィルムの表面が粗くなりすぎ、転写フィルム形成上好ま
しくない。Since the former method does not change the release layer characteristics, various treatments for improving the surface adhesive strength were investigated. As a result, it has been found that the object is achieved by roughening the surface of the film. In particular, Rmax when measuring the surface roughness with a surface roughness meter is at least 0.5 μm or more, preferably 1.5 μm.
By using a film having a thickness of m to 5.0 μm, an extremely excellent adhesion can be obtained due to the anchor effect and the like, and by using such a surface roughening treatment film as a transfer sheet, the above-mentioned problems can be solved. They have found things and completed the present invention. If it is less than 0.5 μm, a sufficient anchor effect cannot be obtained, and if it exceeds 5.0 μm, the surface of the film becomes too rough, which is not preferable for forming a transfer film.
転写シートは常法に従って形成すればよいが以下その
方法についてその概要を説明する。The transfer sheet may be formed according to a conventional method, and the outline of the method will be described below.
まずキャリアフィルムとして離形層と接する側の面
が、0.5μｍの粗さをもつように表面粗化を施こしたプ
ラスチックフィルムを用いる。フィルムの材質としては
モールド回路の成形温度を考慮してPET（ポリエチレン
テレフタレート樹脂）、PI（ポリイミド樹脂）、PC（ポ
リカーボネート樹脂）、PES（ポリエーテルサルフォン
樹脂）、PEI（ポリエーテルイミド樹脂）等から適宜選
択し使用すればよい。フィルム厚みについても任意に選
択される。First, as the carrier film, a plastic film whose surface is in contact with the release layer has a roughness of 0.5 μm is used. PET (polyethylene terephthalate resin), PI (polyimide resin), PC (polycarbonate resin), PES (polyether sulfone resin), PEI (polyetherimide resin), etc. are taken into consideration as the material of the film considering the molding temperature of the molded circuit. Can be selected from the above and used. The film thickness is also arbitrarily selected.
次いで、このフィルムの粗化面にローラーコーター等
を用いて離型剤を塗布、次いで乾燥する。離型剤として
は、エポキシ樹脂、アミン系硬化剤、ポリビニルホルマ
ール樹脂等の混合物が好適に使用される。次いで、銅箔
の粗化面を表面側になる様にして、キャリアフィルムと
加熱圧着して積層シートを得る。Next, a release agent is applied to the roughened surface of this film using a roller coater or the like, and then dried. As the release agent, a mixture of epoxy resin, amine curing agent, polyvinyl formal resin and the like is preferably used. Next, the roughened surface of the copper foil is placed on the front side, and thermocompression bonding is performed with the carrier film to obtain a laminated sheet.
この積層シートの銅箔面に、エッチングレジストをス
クリーン印刷法によってパターン形成を行なう。ドライ
フィルムを用いた写真法によっても良い。次いで、塩化
第２銅等のエッチング液を用いて、不要部の銅を除去し
銅回路を得る。The copper foil surface of this laminated sheet is patterned with an etching resist by screen printing. A photographic method using a dry film may be used. Next, an unnecessary portion of copper is removed by using an etching solution such as cupric chloride to obtain a copper circuit.
また、銅回路上に、成形品樹脂と充分な接着力を持た
せる為に、ポリエステル系接着剤、ポリビニルホルマー
ル系接着剤等の接着剤を、スクリーン印刷により積層印
刷しても良い。Further, an adhesive such as a polyester-based adhesive or a polyvinyl formal-based adhesive may be laminated and printed by screen printing on the copper circuit in order to have sufficient adhesive strength with the molded product resin.
上記方法により目的とする転写シートが得られる。 The desired transfer sheet is obtained by the above method.
実施例 以下実施例に基づいて具体的に示す。Examples Hereinafter, specific examples will be described.
実施例1. キャリアフィルムとして、表面粗化した厚さ50μｍの
PETフィルム（帝人（株）製マットフィルムNS−50）を
用いた。その表面新さを触針法（ミツトヨ（株）製サー
フテスト201使用）で測定したところ、Rmaxは2.8μｍで
あった、このキャリアフィルムを用いて、常法により転
写シートを作成した。この転写シートを用い、8mmΦの
ダイレクトゲートを有する金型の中にセットし、表−１
に示した樹脂を用い、表−１に示した成形条件で転写成
形を行ない、特に剥離を起こりやすいゲート周辺のキャ
リアフィルムと離型層の剥離の状態（回路の損傷）を調
べた。Example 1. As a carrier film, a surface-roughened film having a thickness of 50 μm was used.
A PET film (matte film NS-50 manufactured by Teijin Ltd.) was used. When the surface freshness was measured by a stylus method (using Surftest 201 manufactured by Mitutoyo Corporation), Rmax was 2.8 μm. Using this carrier film, a transfer sheet was prepared by a conventional method. Using this transfer sheet, set it in a mold with a direct gate of 8 mmΦ, and
Transfer molding was carried out under the molding conditions shown in Table 1 using the resin shown in Table 1, and the state of peeling between the carrier film and the release layer around the gate (damage of the circuit), which is particularly likely to cause peeling, was examined.
その評価結果は比較例１（後述）の評価結果と共に表
−２に示す。 The evaluation results are shown in Table 2 together with the evaluation results of Comparative Example 1 (described later).
比較例１ キャリアフィルムとして表面粗化を施こしていない厚
さ50μｍのPETフィルム（帝人（株）製）を用いて実施
例１と同様に転写成形を行ないゲート周辺でのキャリア
フィルムと離型層の剥離の状態を調査した。尚、上記フ
ィルムの表面粗度を測定したところそのRmaxは0.3μｍ
であった。Comparative Example 1 Using a PET film (manufactured by Teijin Ltd.) having a thickness of 50 μm and not subjected to surface roughening as a carrier film, transfer molding was carried out in the same manner as in Example 1, and the carrier film and the release layer around the gate. The state of peeling was investigated. When the surface roughness of the above film was measured, its Rmax was 0.3 μm.
Met.
＊１基材樹脂の種類及びガラスファイバ（GF）含量 基材樹脂 GF含量 PC（ポリカーボネート樹脂）：帝人化成 パンライト
GN−3130 30％ PPS（ポリフエニレンサルファイド樹脂）：東レ トレ
リナ Ａ−504 40％ PES（ポリエーテルスルホン樹脂）：三井東圧 Victrex
4101G GL−20 20％ PEI（ポリエーテルイミド樹脂）：エンジニアリング・
プラスチック ULTEM＃2200 20％ 発明の効果 本発明によりキャリアフィルムと離型層界面の接着力
向上をはかることにより、悪条件下での転写成形でも、
安定して良好な成形を行なうことが可能となる。 * 1 Types of base resin and glass fiber (GF) content Base resin GF content PC (polycarbonate resin): Teijin Chemicals Panlite
GN-3130 30% PPS (Polyphenylene sulfide resin): Toray
Lina A-504 40% PES (Polyethersulfone resin): Mitsui Toatsu Victrex
4101G GL-20 20% PEI (Polyetherimide resin): Engineering
Plastic ULTEM # 2200 20% Effect of the invention Adhesion between the carrier film and the release layer interface according to the invention
By making improvements, even in transfer molding under adverse conditions,
It becomes possible to perform stable and favorable molding.
第１図は金型を用いた成形時の転写シートの固定の状態
を、第２図は第１図に示した同シートのゲート附近の拡
大図で、従来のキャリアフィルムを使用したときのゲー
トからの流入する樹脂圧などによりパターンが剥離する
状態を示す図である。Fig. 1 shows the fixed state of the transfer sheet during molding using a mold, and Fig. 2 is an enlarged view near the gate of the same sheet shown in Fig. 1, which shows the gate when a conventional carrier film is used. It is a figure which shows the state which a pattern peels by the resin pressure etc. which flow in from.
Claims (2)
び接着剤層を積層して構成される射出成形プリント基板
用転写シートにおいて、キャリアフィルムの離型層と接
する側の面を表面粗化したフィルムを使用することを特
徴とする、射出成形プリント基板用転写シート。1. A transfer sheet for an injection-molded printed circuit board, which is formed by laminating a carrier film, a release layer, a copper foil circuit and an adhesive layer, and roughens the surface of the carrier film on the side in contact with the release layer. A transfer sheet for an injection-molded printed circuit board, characterized by using the above-mentioned film.
で測定したときその最大高さ（Rmax）が0.5μｍ以上で
ある事を特徴とする、請求項第１項記載の射出成形プリ
ント基板用転写シート。2. The injection-molded printed circuit board according to claim 1, wherein the surface roughness of the carrier film is 0.5 μm or more when measured with a surface roughness meter. Transfer sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2084727A JP2551196B2 (en) | 1990-03-30 | 1990-03-30 | Transfer sheet for injection molded printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2084727A JP2551196B2 (en) | 1990-03-30 | 1990-03-30 | Transfer sheet for injection molded printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03283696A JPH03283696A (en) | 1991-12-13 |
| JP2551196B2 true JP2551196B2 (en) | 1996-11-06 |
Family
ID=13838721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2084727A Expired - Lifetime JP2551196B2 (en) | 1990-03-30 | 1990-03-30 | Transfer sheet for injection molded printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2551196B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6946205B2 (en) * | 2002-04-25 | 2005-09-20 | Matsushita Electric Industrial Co., Ltd. | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same |
-
1990
- 1990-03-30 JP JP2084727A patent/JP2551196B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03283696A (en) | 1991-12-13 |
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