JPS622592A - Manufacture of smoothing type circuit module - Google Patents
Manufacture of smoothing type circuit moduleInfo
- Publication number
- JPS622592A JPS622592A JP14050285A JP14050285A JPS622592A JP S622592 A JPS622592 A JP S622592A JP 14050285 A JP14050285 A JP 14050285A JP 14050285 A JP14050285 A JP 14050285A JP S622592 A JPS622592 A JP S622592A
- Authority
- JP
- Japan
- Prior art keywords
- circuit module
- resin
- manufacture
- film
- type circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は平滑型回路モジュールのコネクタ一部を改良し
た製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a manufacturing method in which a part of the connector of a smooth circuit module is improved.
［発明の技術的背景とその問題点］
一般に平滑型回路モジュールは、チップ型部品を液状樹
脂で硬化させ、導電性樹脂で導体パターンを形成し、し
かる後導電性ペーストで、コネクターを形成する。そし
て端子部において導電ペーストでそのまま、金属板コネ
クターを接合させる。[Technical Background of the Invention and Problems Therewith] In general, a smooth circuit module is produced by curing a chip type component with a liquid resin, forming a conductive pattern with a conductive resin, and then forming a connector with a conductive paste. Then, the metal plate connector is directly connected to the terminal portion using conductive paste.
しかし導電性が弱いのですぐに破損してしまうという欠
点があった。そこで金属板コネクターとの接合を強化す
るためには導電性が導電ペーストよりもよく、しかも接
合の際に端子部の導電物が破損しないものが要求されて
きた。現在フレキシブルプリント板においては、Ａｕメ
ッキ等でほどこされているが、平滑型回路モジュールに
おいては、コネクターは製造されてなく、コネクターの
必要性がなお一層必要とされ他の機器等への接続が出来
ることが見込まれる。しかしながら前記で示したように
導体ペーストを印刷してコネクターを構成すると印刷し
た部分の破ＩＢが生じるためあまり信頼性が良いとは言
えない。そこで前記に示した様に端子部にフレキシブル
プリント板のコネクターの構成と同様に端子部にＡｕメ
ッキ等でほどこし、端子部の破損が生じないよう且つ導
電性の良いもので欠点をなくすためになされたものであ
る。However, it has the disadvantage of being easily damaged due to its weak conductivity. Therefore, in order to strengthen the bond with metal plate connectors, there has been a need for a material that has better conductivity than conductive paste and that does not damage the conductive material in the terminal portion during bonding. Currently, flexible printed boards are coated with Au plating, etc., but connectors are not manufactured for smooth circuit modules, and the need for connectors is even greater, as they can be connected to other devices. It is expected that However, as shown above, if a connector is constructed by printing a conductive paste, the printed portion will break, so it cannot be said that the reliability is very good. Therefore, as shown above, the terminal part is coated with Au plating, etc. in the same way as the structure of the flexible printed board connector, so that the terminal part is not damaged and has good conductivity to eliminate the defects. It is something that
［発明の目的］
本発明の目的は、コネクター接続の際に端子部の破損が
なく、且つ導電性のよい導体で構成できる平滑型回路モ
ジュールの製造方法を提供することを目的とする。[Object of the Invention] An object of the present invention is to provide a method for manufacturing a smooth circuit module that does not cause damage to terminal portions during connector connection and can be constructed from a conductor with good conductivity.
［発明の概要］ 本発明の概要を第１図をもって詳述する。[Summary of the invention] The outline of the present invention will be explained in detail with reference to FIG.
まず粘着性を有するフィルム（２） （３）上にチップ
型電子部品（１）とサスペーサ−（４）を配置し、液状
樹脂を注入し、実間を充填した後、前記液状樹脂（例え
ば熱硬化性樹脂や紫外線硬化樹脂等）を硬化させ、前記
支持体及びサスペーサ−を除去させ、熱硬化性樹脂は加
熱処理によって硬化し、紫外線硬化樹脂は紫外線光によ
り硬化させるものである。First, a chip-type electronic component (1) and a spacer (4) are placed on an adhesive film (2) (3), and a liquid resin is injected to fill the actual space. A thermosetting resin, an ultraviolet curable resin, etc.) is cured, and the support and a spacer are removed, a thermosetting resin is cured by heat treatment, and an ultraviolet curable resin is cured by ultraviolet light.
この状態は各部品の電極部が露出している状態である。In this state, the electrode portions of each component are exposed.
この状態に電極面が露出している面に導体路を形成する
。In this state, a conductor path is formed on the surface where the electrode surface is exposed.
ここで用いる導体としては、樹脂にＡｇ、Ｃｕ。The conductors used here include resin, Ag, and Cu.
Ａｇ−Ｐｄ、Ａｊ！、Ａｕ等の金属粉あるいは、それら
の合金物、あるいは、ＳｉＣ等の半導体粉及びカーボン
粉、等を混練した導電ペーストもしくはＡｊ！、Ｃｕ、
Ｍｏ等の金属を蒸着した薄膜導体を用いる。さらに導体
路の形成法としては導電ベーストを用いる場合には、ス
クリーン印刷、テッスベンサーによる描画等を用いる場
合には、フォトリソグラフティにより所望の導体路を形
成することができ特に限定されるものではない。Ag-Pd, Aj! , a conductive paste made by kneading metal powders such as Au, alloys thereof, semiconductor powders such as SiC, carbon powders, etc., or Aj! , Cu,
A thin film conductor on which a metal such as Mo is vapor-deposited is used. Furthermore, the method for forming the conductor path is not particularly limited, and can be formed by using a conductive base, screen printing, drawing by Tessbenser, or photolithography.
ここで粘着性を帯びたフィルムとは粘着層と支持体とな
るフィルム層からなり、チップ部品の電極面を樹脂面と
同一面に露出するために液状樹脂が前記チップ部品の電
極部に流れ込まないようにするためのものであり、部品
に対して密着性を確保できるものであって液状樹脂に浸
されないものであればよく、ゲル状態のシリコーン樹脂
、酢ビ−エチレンコポリマー、加熱状態のポリエチレン
フィルム等が好適である。またここで、こ、の粘着物の
支持体はフィルムだけでなくシート状或いは固い板状の
金属、プラスチック製のもので良い。The adhesive film here consists of an adhesive layer and a film layer that serves as a support, and because the electrode surface of the chip component is exposed on the same surface as the resin surface, the liquid resin does not flow into the electrode part of the chip component. Any material that can ensure adhesion to the parts and will not be immersed in liquid resin is sufficient, such as silicone resin in gel state, vinyl acetate-ethylene copolymer, and polyethylene film in heated state. etc. are suitable. Further, the support for this adhesive material may be not only a film but also a sheet-like or hard plate-like material made of metal or plastic.
液状樹脂とは室温で液状のものばかりでなく、加熱状態
で液状になるものでよい。好適には、液状エポキシ樹脂
、紫外線硬化性樹脂組成物、不飽和ポリエステル樹脂が
取り扱いやすいが特に限定されるものではない。The liquid resin is not only one that is liquid at room temperature, but also one that becomes liquid when heated. Suitably, liquid epoxy resins, ultraviolet curable resin compositions, and unsaturated polyester resins are easy to handle, but are not particularly limited.
また、ここで行なうメッキ法とは、金属メッキのことを
指す。Furthermore, the plating method used here refers to metal plating.
［発明の効果］
本発明で得られた効果は、コネクター接合の際の端子部
の破損がなくなり、且つ導電性が良好な導体が得られる
。[Effects of the Invention] The effects obtained by the present invention are that damage to the terminal portion during connector joining is eliminated, and a conductor with good electrical conductivity can be obtained.
第１図（ａ）のように１００μｍのマイラーフィルム上
に２０μｍ厚の酢ビ−エチレンコーポリマ一層を形成し
たフィルムを用意し、所定の位置に各電子部品を搭載し
若干加温しながら加圧した。As shown in Figure 1 (a), a film made of a single layer of 20 μm thick vinyl acetate-ethylene copolymer formed on a 100 μm Mylar film is prepared, each electronic component is mounted in a predetermined position, and pressure is applied while heating it slightly. did.
次いで四方面に型枠をとり、そこに紫外線硬化樹脂（商
品名ＵＶＸ−Ｅ２１１製造元■スリーボンド）を注入し
てその上からフィルムでコーティングさせて硬化する（
第１図（Ｃ））。その後フィルムをひきはがすと第１図
（ｄ）の様に電極面が面一な状態が得られた。Next, take a formwork on all sides, inject an ultraviolet curing resin (product name UVX-E211 manufacturer: Three Bond) into it, coat it with a film and cure it (
Figure 1 (C)). Thereafter, when the film was peeled off, the electrode surface was flush as shown in FIG. 1(d).
次いで銀ペースト（商品名Ｃｏｎｄｕｃｔｏｒ ｐａｓ
ｔｅ ＃６８３８デュポン製）を所定のパターン状に表
面印刷を行なっ°た後１５０℃ＩＨで加熱硬化させた。Next, silver paste (product name: Conductor paste)
After surface printing was performed on the surface of the material (#6838 manufactured by DuPont) in a predetermined pattern, it was cured by heating at 150° C. IH.
さらにＵＶ硬化レジスト（商品名ソルダレジスト１５０
Ｂ製造元太陽インキ■）を得られた回路モジュールに端
子部のみ残しコーディングさせ紫外線光により加熱硬化
した。Furthermore, UV curing resist (product name Solder Resist 150)
The resulting circuit module (manufacturer B: Taiyo Ink ■) was coated with only the terminal portions remaining, and then heated and cured with ultraviolet light.
次いで銀ペーストで印刷された端子部Ａｕメッキ液（商
品名アトメックス製造元エンゲルハルト）を６０℃５分
浸し、Ａｕメッキを施し３０分乾燥させて完成する。Next, the terminal portion printed with silver paste is immersed in Au plating solution (trade name: Atomex, manufactured by Engelhardt) at 60°C for 5 minutes, Au plating is applied, and the terminal is dried for 30 minutes to complete.
以上のように本発明によれば、回路モジュールの端子部
に金属メッキを施すことによりコネクターとの接続の際
端子部の破損がなくなり、且つ製造工程が比較的簡単に
できるという利点がある。As described above, according to the present invention, metal plating is applied to the terminal portions of the circuit module, so that there is no damage to the terminal portions when connected to a connector, and the manufacturing process is relatively simple.
なお本発明は上記に示した実施例に限定されるものでな
く、各部の材質工程の順序、形状等、本発明の要旨を逸
脱しない範囲で種々変更できる。It should be noted that the present invention is not limited to the embodiments shown above, and various changes may be made in the material process order, shape, etc. of each part without departing from the gist of the present invention.
第１図は本発明の詳細な説明するための工程の断面図、
第２図はコネクターと基板との接合図である。
（１）：チップ型電子部品。
（２）：支持体フィルム。
（３）二粘着物。
（４）：サスペーサ−。
（５）：液状樹脂。
（６）：コーティング用フィルム。
（７）：導体線路パターン。
（８）：ＵＶ硬化レジスト。
（９）：金属メッキ。
（ｔｏ）：ＣＲコネクタ。
代理人弁理士 則近 憲佑（ほか１名）（Ｃ）
（ｔ’）
（Ｉ）
第１ＩＩFIG. 1 is a cross-sectional view of the process for explaining the present invention in detail;
FIG. 2 is a diagram showing the connection between the connector and the board. (1): Chip type electronic component. (2): Support film. (3) Two sticky substances. (4): Suspender. (5): Liquid resin. (6): Film for coating. (7): Conductor line pattern. (8): UV curing resist. (9): Metal plating. (to): CR connector. Representative Patent Attorney Kensuke Norichika (and 1 other person) (C) (t') (I) No. 1II
Claims (1)
を配置し、液状樹脂を注入し空間を充填した後、前記液
状樹脂を硬化させ前記支持体を除去し、さらに導電性樹
脂で導体パターンを形成する平滑回路モジュールの製造
方法において、端子部に金属メッキを施こすようにした
ことを特徴とする平滑型回路モジュールの製造方法A chip-type electronic component is placed at a predetermined position on an adhesive support, a liquid resin is injected to fill the space, the liquid resin is cured, the support is removed, and a conductive pattern is formed with a conductive resin. A method for manufacturing a smooth circuit module, characterized in that the terminal portions are plated with metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14050285A JPS622592A (en) | 1985-06-28 | 1985-06-28 | Manufacture of smoothing type circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14050285A JPS622592A (en) | 1985-06-28 | 1985-06-28 | Manufacture of smoothing type circuit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS622592A true JPS622592A (en) | 1987-01-08 |
Family
ID=15270129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14050285A Pending JPS622592A (en) | 1985-06-28 | 1985-06-28 | Manufacture of smoothing type circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622592A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645023A (en) * | 1987-06-26 | 1989-01-10 | Nissha Printing | Manufacture of resin mold having electronic parts |
| JPH01209791A (en) * | 1988-02-18 | 1989-08-23 | Niles Parts Co Ltd | Composite circuit substrate and manufacture thereof |
| JPH0256360U (en) * | 1988-10-19 | 1990-04-24 | ||
| JP2002513209A (en) * | 1998-04-28 | 2002-05-08 | テッセラ・インコーポレーテッド | Encapsulation of microelectronic assemblies |
| JP5911144B2 (en) * | 2010-07-02 | 2016-04-27 | 国立研究開発法人産業技術総合研究所 | Micro mechanical system |
-
1985
- 1985-06-28 JP JP14050285A patent/JPS622592A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645023A (en) * | 1987-06-26 | 1989-01-10 | Nissha Printing | Manufacture of resin mold having electronic parts |
| JPH01209791A (en) * | 1988-02-18 | 1989-08-23 | Niles Parts Co Ltd | Composite circuit substrate and manufacture thereof |
| JPH0256360U (en) * | 1988-10-19 | 1990-04-24 | ||
| JP2002513209A (en) * | 1998-04-28 | 2002-05-08 | テッセラ・インコーポレーテッド | Encapsulation of microelectronic assemblies |
| JP5911144B2 (en) * | 2010-07-02 | 2016-04-27 | 国立研究開発法人産業技術総合研究所 | Micro mechanical system |
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