JPS6413166U - - Google Patents
Info
- Publication number
- JPS6413166U JPS6413166U JP1987107387U JP10738787U JPS6413166U JP S6413166 U JPS6413166 U JP S6413166U JP 1987107387 U JP1987107387 U JP 1987107387U JP 10738787 U JP10738787 U JP 10738787U JP S6413166 U JPS6413166 U JP S6413166U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- emitting device
- light emitting
- current limiting
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 6
- 239000000919 ceramic Substances 0.000 claims 1
- 238000009966 trimming Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Description
第1図ないし第5図は本考案によるLED発光
装置の実施例を示すもので、第1図は第1実施例
の断面図、第2図は第1図の平面図、第3図は第
1図の底面図、第4図は電気回路図、第5図は第
2実施例の断面図、第6図は特性図である。1…
…基板、2……表面、3……接続線、4……LE
Dチツプ搭載部、5……金パツド、6……接続部
、7……LED、8……リード線、9……スルー
ホール、10……裏面、11……接続線、12…
…電流制限抵抗、13……接続部、14……電源
、15,16……端子。
装置の実施例を示すもので、第1図は第1実施例
の断面図、第2図は第1図の平面図、第3図は第
1図の底面図、第4図は電気回路図、第5図は第
2実施例の断面図、第6図は特性図である。1…
…基板、2……表面、3……接続線、4……LE
Dチツプ搭載部、5……金パツド、6……接続部
、7……LED、8……リード線、9……スルー
ホール、10……裏面、11……接続線、12…
…電流制限抵抗、13……接続部、14……電源
、15,16……端子。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 複数個のLEDを基板上に配置してなる発
光装置において、前記LEDと電流制限抵抗との
直列回路を2個以上並列に接続し、前記電流制限
抵抗をトリミングすることによつてその抵抗値を
調節し目的の発光強度を得るようにしたことを特
徴とするLED発光装置。 (2) 基板はセラミツク基板とし、この基板に厚
膜印刷によつて配線および制限抵抗を形成し、L
EDチツプを搭載したことを特徴とする実用新案
登録請求の範囲第1項記載のLED発光装置。 (3) 基板はPCBを用い、電流制限抵抗はチツ
プ抵抗を用いてモールドタイプLEDを搭載した
ことを特徴とする実用新案登録請求の範囲第1項
記載のLED発光装置。 (4) LEDと電流制限抵抗は基板の表裏に別々
に設けたことを特徴とする実用新案登録請求の範
囲第1項記載のLED発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987107387U JPS6413166U (ja) | 1987-07-13 | 1987-07-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987107387U JPS6413166U (ja) | 1987-07-13 | 1987-07-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6413166U true JPS6413166U (ja) | 1989-01-24 |
Family
ID=31341753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987107387U Pending JPS6413166U (ja) | 1987-07-13 | 1987-07-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6413166U (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007129062A (ja) * | 2005-11-04 | 2007-05-24 | Koa Corp | Led光源装置 |
US7286148B2 (en) | 2004-02-10 | 2007-10-23 | Seiko Epson Corporation | Line head and image forming apparatus incorporating the same |
JP2013143372A (ja) * | 2012-01-06 | 2013-07-22 | Lextar Electronics Corp | 照明回路及びそれを備える照明装置 |
JP2021148310A (ja) * | 2020-03-16 | 2021-09-27 | 株式会社富士通ゼネラル | 空気調和機 |
-
1987
- 1987-07-13 JP JP1987107387U patent/JPS6413166U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7286148B2 (en) | 2004-02-10 | 2007-10-23 | Seiko Epson Corporation | Line head and image forming apparatus incorporating the same |
JP2007129062A (ja) * | 2005-11-04 | 2007-05-24 | Koa Corp | Led光源装置 |
JP2013143372A (ja) * | 2012-01-06 | 2013-07-22 | Lextar Electronics Corp | 照明回路及びそれを備える照明装置 |
JP2021148310A (ja) * | 2020-03-16 | 2021-09-27 | 株式会社富士通ゼネラル | 空気調和機 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3741512B2 (ja) | Ledチップ部品 | |
JPS6170306U (ja) | ||
JPS6413166U (ja) | ||
JPH0343208U (ja) | ||
JPS6113958U (ja) | 発光ダイオ−ドランプ | |
JPH0465465U (ja) | ||
JPH0416457Y2 (ja) | ||
JPH0528782Y2 (ja) | ||
JPH0455797U (ja) | ||
JPH0276046U (ja) | ||
JPH01163343U (ja) | ||
JPS61111165U (ja) | ||
JPH01100176U (ja) | ||
JPH0191550U (ja) | ||
JPH01155665U (ja) | ||
JPS58193517U (ja) | 発光式メンブレンスイツチ | |
JPH031465U (ja) | ||
JPS61158974U (ja) | ||
JPH01110456U (ja) | ||
JPS60176476U (ja) | 発光ダイオ−ド式表示灯 | |
JPH0284350U (ja) | ||
JPS6284944U (ja) | ||
JPS6321038U (ja) | ||
JPS6413167U (ja) | ||
JPS61119370U (ja) |