JPS641292A - Manufacture of reinforced flexible wiring board - Google Patents

Manufacture of reinforced flexible wiring board

Info

Publication number
JPS641292A
JPS641292A JP62157269A JP15726987A JPS641292A JP S641292 A JPS641292 A JP S641292A JP 62157269 A JP62157269 A JP 62157269A JP 15726987 A JP15726987 A JP 15726987A JP S641292 A JPS641292 A JP S641292A
Authority
JP
Japan
Prior art keywords
substrate
wiring board
flexible wiring
board
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62157269A
Other languages
Japanese (ja)
Other versions
JPH011292A (en
JPH0787263B2 (en
Inventor
Yutaka Hibino
Toshihide Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP62157269A priority Critical patent/JPH0787263B2/en
Publication of JPH011292A publication Critical patent/JPH011292A/en
Publication of JPS641292A publication Critical patent/JPS641292A/en
Publication of JPH0787263B2 publication Critical patent/JPH0787263B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To largely improve productivity and functionality by integrally molding a flexible wiring board and a reinforcing unit by injection molding.
CONSTITUTION: A flexible wiring board 1 is formed by forming a conductor circuit 3 on one side face of a flexible base substrate 2, and forming an insulating layer 4 of a coverage material except a terminal, a land thereon. A plurality of fine through holes 5 are formed at the substrate 2 except that formed with the circuit 3 of the board 1. Such a board 1 is set in an injection metal mold, a reinforcing unit 6 is formed by injection molding an engineering plastic melted at a high temperature at the position required to reinforce the substrate 2, part is press-fitted to the hole 5 of the substrate 2, and a rivet-like state 5a is formed at opposite side. Thus, an assembly to an electronic equipment is facilitated, and, in some cases, can be integrated with a case of the equipment.
COPYRIGHT: (C)1989,JPO&Japio
JP62157269A 1987-06-23 1987-06-23 Manufacturing method of reinforced flexible wiring board Expired - Fee Related JPH0787263B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157269A JPH0787263B2 (en) 1987-06-23 1987-06-23 Manufacturing method of reinforced flexible wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157269A JPH0787263B2 (en) 1987-06-23 1987-06-23 Manufacturing method of reinforced flexible wiring board

Publications (3)

Publication Number Publication Date
JPH011292A JPH011292A (en) 1989-01-05
JPS641292A true JPS641292A (en) 1989-01-05
JPH0787263B2 JPH0787263B2 (en) 1995-09-20

Family

ID=15645962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157269A Expired - Fee Related JPH0787263B2 (en) 1987-06-23 1987-06-23 Manufacturing method of reinforced flexible wiring board

Country Status (1)

Country Link
JP (1) JPH0787263B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093731A (en) * 2005-09-27 2007-04-12 Sumitomo Electric Ind Ltd Method of manufacturing optical connecting component, and optical connecting component
JP2010178430A (en) * 2009-01-27 2010-08-12 Autonetworks Technologies Ltd Circuit component and electric connection box
CN106061235A (en) * 2016-07-08 2016-10-26 深圳市信维通信股份有限公司 FPC assembling tool and assembling method thereof
JP2017522583A (en) * 2014-05-09 2017-08-10 レオンハード クルツ シュティフトゥング ウント コー． カーゲー Multilayer body and method for producing the same
US10021787B2 (en) 2014-06-23 2018-07-10 Murata Manufacturing Co., Ltd. Resin substrate combined structure
US11029557B2 (en) 2017-11-08 2021-06-08 Fujifilm Corporation Optical laminate film and organic electroluminescent display device
US11435511B2 (en) 2017-11-08 2022-09-06 Fujifilm Corporation Optical laminate film and organic electroluminescent display device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55134386A (en) * 1979-04-06 1980-10-20 Citizen Watch Co Ltd Circuit substrate for electronic watch

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55134386A (en) * 1979-04-06 1980-10-20 Citizen Watch Co Ltd Circuit substrate for electronic watch

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093731A (en) * 2005-09-27 2007-04-12 Sumitomo Electric Ind Ltd Method of manufacturing optical connecting component, and optical connecting component
JP4631640B2 (en) * 2005-09-27 2011-02-16 住友電気工業株式会社 Optical connecting component manufacturing method and optical connecting component
JP2010178430A (en) * 2009-01-27 2010-08-12 Autonetworks Technologies Ltd Circuit component and electric connection box
JP2017522583A (en) * 2014-05-09 2017-08-10 レオンハード クルツ シュティフトゥング ウント コー． カーゲー Multilayer body and method for producing the same
US10021787B2 (en) 2014-06-23 2018-07-10 Murata Manufacturing Co., Ltd. Resin substrate combined structure
CN106061235A (en) * 2016-07-08 2016-10-26 深圳市信维通信股份有限公司 FPC assembling tool and assembling method thereof
US11029557B2 (en) 2017-11-08 2021-06-08 Fujifilm Corporation Optical laminate film and organic electroluminescent display device
US11435511B2 (en) 2017-11-08 2022-09-06 Fujifilm Corporation Optical laminate film and organic electroluminescent display device

Also Published As

Publication number Publication date
JPH0787263B2 (en) 1995-09-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees