JPH01170088A - Manufacture of molded circuit substrate - Google Patents
Manufacture of molded circuit substrateInfo
- Publication number
- JPH01170088A JPH01170088A JP62329056A JP32905687A JPH01170088A JP H01170088 A JPH01170088 A JP H01170088A JP 62329056 A JP62329056 A JP 62329056A JP 32905687 A JP32905687 A JP 32905687A JP H01170088 A JPH01170088 A JP H01170088A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit film
- molded
- mold
- fitting protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、回路パターンと樹脂成形体とを一体に形成し
たモールド回路基板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a molded circuit board in which a circuit pattern and a resin molded body are integrally formed.
〔従来技術］
従来から、射出成形法を利用して回路パターンを樹脂成
形体にモールドする方法が知られている。[Prior Art] Conventionally, a method has been known in which a circuit pattern is molded into a resin molded body using an injection molding method.
この方法では、まず可撓性の基体シート上に導電ペース
トで回路パターンを印刷する。多層化の場合はその上に
絶縁ペーストで絶縁層を形成した後、更に導電ペースト
で回路パターンを印刷して積層していく、このようにし
て公知の技術により表面に回路パターン層を剥離可能な
状態に形成した転写シートを用意し、この転写シートを
回路パターン側を表にして成形金型のキャビティ内にセ
ットする。その後この金型のキャビティ内に溶融樹脂を
射出して成形を行うことにより、樹脂成形体表面に回路
パターンをモールドするものである。もちろん転写シー
トの如く基体シートのない回路フィルムを直接金型内に
セットする方法もある。In this method, a circuit pattern is first printed on a flexible base sheet using conductive paste. In the case of multi-layering, an insulating layer is formed using insulating paste on top of the insulating layer, and then a circuit pattern is printed and laminated using conductive paste. In this way, the circuit pattern layer can be peeled off from the surface using known techniques. A transfer sheet is prepared, and the transfer sheet is set in the cavity of a molding die with the circuit pattern side facing up. Thereafter, molten resin is injected into the cavity of this mold to perform molding, thereby molding a circuit pattern on the surface of the resin molded body. Of course, there is also a method of directly setting a circuit film without a base sheet, such as a transfer sheet, into a mold.
しかしながらこれらの方法では、金型内にセットされた
回路フィルムが、金型内への樹脂射出時に位置ずれを起
こし、射出成形中にモールドすべき回路フィルムが変形
したり、破損したりするという問題があった。特に高い
射出圧力が要求される大きな樹脂成形体の場合や、リプ
等の凹凸が多い場合、さらには流動性の悪い樹脂を使用
した場合はこの問題が大きかった。However, with these methods, there is a problem that the circuit film set in the mold may be misaligned when resin is injected into the mold, and the circuit film to be molded during injection molding may be deformed or damaged. was there. This problem is particularly serious in the case of large resin moldings that require high injection pressure, in the case of many irregularities such as lips, and in the case of using resins with poor fluidity.
前記問題に鑑み本発明の目的は、回路フィルムの成形金
型内での位置ずれを防止し、かつ所望の位置に精度よく
セットできるモールド回路基板の製造方法を提供するこ
とにある。In view of the above-mentioned problems, an object of the present invention is to provide a method for manufacturing a molded circuit board that can prevent a circuit film from shifting in a mold and set the circuit film in a desired position with high accuracy.
前記目的を達成すべく本発明は、成形金型内に回路パタ
ーンを有する回路フィルムをセットし、樹脂をモールド
成形して樹脂成形体と回路パターンとが一体となったモ
ールド回路基板を製造する方法において、前記成形金型
の回路フィルムセット面に回路フィルムの基準穴に対応
させて位置決め用の嵌合突起を設けておき、該嵌合突起
に前記回路フィルムの基準穴を嵌合させた状態で樹脂の
モールド成形を行うことを特徴とするものである。In order to achieve the above object, the present invention provides a method of manufacturing a molded circuit board in which a circuit film having a circuit pattern is set in a molding die, and a resin is molded to integrate the resin molded body and the circuit pattern. In this step, a fitting protrusion for positioning is provided on the circuit film setting surface of the molding die in correspondence with the reference hole of the circuit film, and the fitting protrusion is fitted into the reference hole of the circuit film. It is characterized by performing resin molding.
〔発明の実施例〕
以下に本発明の実施例を図面を参照して詳細に説明する
。第１図及び第２図は本発明の一実施例を示している。[Embodiments of the Invention] Examples of the present invention will be described in detail below with reference to the drawings. 1 and 2 show an embodiment of the present invention.
まず本発明のモールド回路基板の製造方法においては、
まず、金型内の回路フィルムセット面に、具体的には第
１図の可動金型２の回路フィルムセット面に前もって嵌
合突起３を設けておき、一方、回路パターンを有する回
路フィルムｌにも予め前記嵌合突起３に対応する位置に
基準穴４を設けておく、そしてこの回路フィルム１を前
記可動金型２の回路フィルムセット面にセットする際は
、回路フィルム１の基準穴４を金型の嵌合突起３に嵌合
させてセットした後、型閉を行う、このような状態で固
定金型５に設けたスプル６からゲート８を介して溶融樹
脂をキャビティ７内に射出せしめ、樹脂成形体と回路パ
ターンとが一体となったモールド回路基板を製造するも
のである。First, in the method for manufacturing a molded circuit board of the present invention,
First, a fitting protrusion 3 is provided in advance on the circuit film setting surface of the mold, specifically, on the circuit film setting surface of the movable mold 2 shown in FIG. A reference hole 4 is provided in advance at a position corresponding to the fitting protrusion 3, and when setting this circuit film 1 on the circuit film setting surface of the movable mold 2, the reference hole 4 of the circuit film 1 is After fitting and setting into the fitting protrusion 3 of the mold, the mold is closed. In this state, molten resin is injected into the cavity 7 from the sprue 6 provided on the fixed mold 5 through the gate 8. , a molded circuit board in which a resin molded body and a circuit pattern are integrated is manufactured.
尚、回路フィルム１に設ける基準穴４及び金型側に設け
る嵌合突起３の数やその形状は、回路フィルムｌの大き
さや該回路フィルム１の回路パターンによって適宜法め
られるもので、第１図、第２図のものに限定されるもの
ではない、またここでいう回路フィルムｌとは広い意味
での回路フィルムを指し、例えば基体シート上に回路パ
ターン層を有するフィルム、いわゆる転写フィルムも含
むし、基体シートの省略された回路フィルムをも含んで
いる。さらに前記実施例においては、嵌合突起３をキャ
ビティ７にあって可動金型２側に設けているが、得よう
とするモールド回路基板の形状によっては固定金型５側
に設けても良い。The number and shape of the reference holes 4 provided in the circuit film 1 and the fitting protrusions 3 provided on the mold side are determined as appropriate depending on the size of the circuit film 1 and the circuit pattern of the circuit film 1. The term "circuit film l" as used herein refers to a circuit film in a broad sense, and includes, for example, a film having a circuit pattern layer on a base sheet, a so-called transfer film. However, it also includes a circuit film with no base sheet. Further, in the embodiment described above, the fitting protrusion 3 is provided in the cavity 7 on the movable mold 2 side, but it may be provided on the fixed mold 5 side depending on the shape of the molded circuit board to be obtained.
このように金型側に位置決め用の嵌合突起３を設けてお
き、一方何路フイルムｌ側にもこの嵌合突起３に対応す
る基準穴４を設けておいて、両者を嵌合させた状態でモ
ールドを行うことにより、単に樹脂を射出する際に回路
フィルムｌのずれを防止するのみならず、より精度よく
回路フィルムｌの位置決めが可能となり、もって精度の
良いモールド回路基板を効率良（得ることができる。In this way, a fitting protrusion 3 for positioning is provided on the mold side, and a reference hole 4 corresponding to this fitting protrusion 3 is provided on the multi-layer film l side, and the two are fitted together. By performing molding in this condition, it is possible to not only prevent the circuit film l from shifting when injecting the resin, but also to position the circuit film l with more precision, which allows for highly accurate molded circuit boards to be produced efficiently ( Obtainable.
以上のように本発明によれば、回路フィルムのセット位
置の精度は格段に向上し、かつ射出成形中におけるキャ
ビティ内での前記回路フィルムの位置ずれを防止でき、
もって効率よく、かつ位置精度の高いモールド回路基板
を得ることができる。As described above, according to the present invention, the accuracy of the setting position of the circuit film is significantly improved, and the positional shift of the circuit film within the cavity during injection molding can be prevented.
As a result, a molded circuit board with high efficiency and high positional accuracy can be obtained.
第１図は本発明の一実施例に係わる成形金型の縦断面図
、第２図は前記第１図のキャビティ部の拡大斜視図であ
る。
１〜回路フィルム ２〜可動金型 ３〜嵌合突起 ４〜
基準穴 ５〜固定金型FIG. 1 is a longitudinal sectional view of a molding die according to an embodiment of the present invention, and FIG. 2 is an enlarged perspective view of the cavity portion of FIG. 1. 1~Circuit film 2~Movable mold 3~Fitting protrusion 4~
Reference hole 5 ~ Fixed mold
Claims (1)
トし、樹脂をモールド成形して樹脂成形体と回路パター
ンとが一体となったモールド回路基板を製造する方法に
おいて、前記成形金型の回路フィルムセット面に回路フ
ィルムの基準穴に対応させて位置決め用の嵌合突起を設
けておき、該嵌合突起に前記回路フィルムの基準穴を嵌
合させた状態で樹脂のモールド成形を行うことを特徴と
するモールド回路基板の製造方法。In a method of manufacturing a molded circuit board in which a circuit film having a circuit pattern is set in a mold and a resin is molded to integrate a resin molded body and a circuit pattern, the circuit film set of the mold is A fitting protrusion for positioning is provided on the surface corresponding to the reference hole of the circuit film, and resin molding is performed with the fitting protrusion fitted to the reference hole of the circuit film. A method for manufacturing a molded circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62329056A JP2516650B2 (en) | 1987-12-25 | 1987-12-25 | Molded circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62329056A JP2516650B2 (en) | 1987-12-25 | 1987-12-25 | Molded circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01170088A true JPH01170088A (en) | 1989-07-05 |
| JP2516650B2 JP2516650B2 (en) | 1996-07-24 |
Family
ID=18217118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62329056A Expired - Fee Related JP2516650B2 (en) | 1987-12-25 | 1987-12-25 | Molded circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2516650B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5316463A (en) * | 1992-11-24 | 1994-05-31 | Neu Dynamics Corporation | Encapsulating molding equipment |
| US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
| US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
| JP2020191372A (en) * | 2019-05-21 | 2020-11-26 | 日本発條株式会社 | Resin mold circuit body, mold, manufacturing method, and circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288489A (en) * | 1985-06-17 | 1986-12-18 | キヤノン株式会社 | Manufacture of molded circuit board |
| JPS6297813A (en) * | 1985-10-25 | 1987-05-07 | Hitachi Ltd | Molding tool |
-
1987
- 1987-12-25 JP JP62329056A patent/JP2516650B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288489A (en) * | 1985-06-17 | 1986-12-18 | キヤノン株式会社 | Manufacture of molded circuit board |
| JPS6297813A (en) * | 1985-10-25 | 1987-05-07 | Hitachi Ltd | Molding tool |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5316463A (en) * | 1992-11-24 | 1994-05-31 | Neu Dynamics Corporation | Encapsulating molding equipment |
| US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
| US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
| US5484274A (en) * | 1992-11-24 | 1996-01-16 | Neu Dynamics Corp. | Encapsulation molding equipment |
| JP2020191372A (en) * | 2019-05-21 | 2020-11-26 | 日本発條株式会社 | Resin mold circuit body, mold, manufacturing method, and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2516650B2 (en) | 1996-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4402135A (en) | Method of forming a circuit board | |
| US5003693A (en) | Manufacture of electrical circuits | |
| JPH01170088A (en) | Manufacture of molded circuit substrate | |
| JPS6318224U (en) | ||
| JPH0730152A (en) | Molding method for electronic component mounted on board and board structure for molding | |
| JPH0379317A (en) | Plastic molded product | |
| JP2000025069A (en) | Production of insert resin molded circuit board | |
| JPS6146049B2 (en) | ||
| JPH0774451A (en) | Manufacture of circuit board | |
| JPH02139216A (en) | Molding method of three-dimensional molding circuit | |
| JP2514818B2 (en) | Resin sealing method for integrated circuit board | |
| MY130758A (en) | Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch subnstrate, and a switch substrate | |
| JPH0665756B2 (en) | Partial plastic molded article and its manufacturing method | |
| JPS63200592A (en) | Manufacture of molded three-dimensional printed circuit | |
| JPH07205214A (en) | Mold for ball grid array | |
| JPS5664446A (en) | Method of molding synthetic resin insert for metal terminal, metal terminal and mold | |
| JPH043772Y2 (en) | ||
| JPH0194691A (en) | Printed circuit board and manufacture thereof | |
| JPH0414858B2 (en) | ||
| JPH05275915A (en) | Production of antenna module | |
| JPS587897A (en) | Method of producing circuit wiring board | |
| JPH0242792A (en) | Manufacture of printed wiring board | |
| KR200210426Y1 (en) | Die apparatus for moulding button assembly having a plurality of buttons | |
| JPH01266789A (en) | Manufacture of molded circuit board | |
| JPS6464391A (en) | Manufacture of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |