JPS6454793A - Manufacture of insulating substrate with conductive layer - Google Patents
Manufacture of insulating substrate with conductive layerInfo
- Publication number
- JPS6454793A JPS6454793A JP21172687A JP21172687A JPS6454793A JP S6454793 A JPS6454793 A JP S6454793A JP 21172687 A JP21172687 A JP 21172687A JP 21172687 A JP21172687 A JP 21172687A JP S6454793 A JPS6454793 A JP S6454793A
- Authority
- JP
- Japan
- Prior art keywords
- layers
- substrate
- electric circuit
- conductive layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
PURPOSE:To simply form a through hole circuit having high reliability accurately at a predetermined position without necessity of the step of opening with wrong workability by forming a temporary substrate between conductive layers having conductive layers on both sides and transferring it to the substrate formed with the conductive layer. CONSTITUTION:Electric circuit copper layers 2, 2' of rear pattern of a wiring pattern are formed on temporary substrates 1, 1; of insulating substrate with conductive layers. Protrusion 1a is formed at a position corresponding to a through hole electric circuit on the substrate 1, a connecting copper layer 2a is formed on the protrusion 1a, and both copper layers 2, 2a are connected to each other. The substrates 1, 1' are disposed in a substrate molding metal mold 3 to face the layers 2, 2a, which are pressed by the mold 3 to be connected. Then, an insulating molding material P, such as resin is poured from an inlet 3c between the layers 2 and 2a to form a substrate 4. Then, the layers 2, 2a are used as through hole electric circuit to be electrically connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21172687A JPS6454793A (en) | 1987-08-26 | 1987-08-26 | Manufacture of insulating substrate with conductive layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21172687A JPS6454793A (en) | 1987-08-26 | 1987-08-26 | Manufacture of insulating substrate with conductive layer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6454793A true JPS6454793A (en) | 1989-03-02 |
Family
ID=16610584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21172687A Pending JPS6454793A (en) | 1987-08-26 | 1987-08-26 | Manufacture of insulating substrate with conductive layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6454793A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007129273A (en) * | 2007-02-23 | 2007-05-24 | Matsushita Electric Works Ltd | Method for manufacturing led display apparatus |
-
1987
- 1987-08-26 JP JP21172687A patent/JPS6454793A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007129273A (en) * | 2007-02-23 | 2007-05-24 | Matsushita Electric Works Ltd | Method for manufacturing led display apparatus |
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