JPS6379777A - セラミツクス基板上への被覆体の製造法 - Google Patents

セラミツクス基板上への被覆体の製造法

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Publication number
JPS6379777A
JPS6379777A JP61223710A JP22371086A JPS6379777A JP S6379777 A JPS6379777 A JP S6379777A JP 61223710 A JP61223710 A JP 61223710A JP 22371086 A JP22371086 A JP 22371086A JP S6379777 A JPS6379777 A JP S6379777A
Authority
JP
Japan
Prior art keywords
ceramic
metal
yttria
coating
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61223710A
Other languages
English (en)
Other versions
JPH0510309B2 (ja
Inventor
坂田 君子
忠夫 徳島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Institute for Metals
Original Assignee
National Research Institute for Metals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Institute for Metals filed Critical National Research Institute for Metals
Priority to JP61223710A priority Critical patent/JPS6379777A/ja
Publication of JPS6379777A publication Critical patent/JPS6379777A/ja
Priority to US07/388,096 priority patent/US4911987A/en
Publication of JPH0510309B2 publication Critical patent/JPH0510309B2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、セラミックス基板表面に複合化中間層をプラ
ズマ溶射(真空溶射を含む)し、該中間層を介してその
中間層表面に異種セラミックスあるいは金属を溶射する
ことによって、母材及び被覆材の選択自由度を保持し、
前記セラミックス基板上に絶縁性、誘電惇声電性等種々
の機能をもたせ、しかも被覆層形成中あるいは使用中に
剥離の生じない密着性従来からセラミックス基板にセラ
ミックスを被覆することによって、その母材となるセラ
ミックス材が有する特性に絶縁性あるいは導電性等種々
の機能を付加して機能的に優れた材料を作成する試みが
行なわれている。
しかし、このような材料の大きな欠点は、母材と被覆材
との接着強度が小さいため、外部からの応力が母材に十
分に伝達されず被覆材自身に応力が掛り被覆材が破壊し
たり、剥離する現象を起こし、当初の目的を達成出来る
ものではなかりた。
そこで母材と被覆材の接着の向上を図るために、各種の
手段が講じられている。例えばセラミックス表面をプラ
ストして粗面を形成して溶射したり、また金属基板上へ
のセラミックス溶射法の類推から、下地溶射として、N
i −AI %Ni −AI −Mo、 Ni −Cr
 −AI −Y、 Co −Cr −Ar−Y等が用い
られると考えられているが、これは基板と被覆体との間
の材料物性を考慮したものではない。
半導体分野では、母材にセラミックス材を採用し、金属
をCVDや真空蒸着やスパッタリング法で被覆して導電
性を持たせたり、積層膜を作るなどマイクロエレクトロ
ニクスの分野で1μm以下の薄膜は作らnていたが、1
μm以上の厚さを持つ強固な被覆は類例をみず、前記同
様、その密着性に問題があった。
(発明が解決しようとする問題点) 従来のセラミックス基板上の被覆体及びその製造法によ
れば、母材と被覆材の接着面が単に機械的な噛合いであ
ったり、下地溶射をしても母材と被覆材の組合せくよっ
ては、熱膨張係数の差が大きいため、母材と被覆材の境
界面に熱的応力歪が発生し、またもろい金属間化合物が
出来たりして本質的な密着性の解決法にはならなかった
。その為、3〜4 Kg/−の強度が常識的であった。
(問題点を解決するための手段及び作用)本発明は、上
記に鑑みてなされたものであり、基板材及び当該基板材
が有する機能に加えて、被覆材が有する機能を付加して
選択自由度を大きく保持しながら、特に密着性に優れた
セラミックス基板上への被覆体及びその製−造法を提供
するために、セラミックス基板材と金属あるいは溶射複
合セラミックスとの間に酸化物と前記金属主成分粉末あ
るいは溶射セラミックス主成分粉末とからなる複合体で
ある中間層を介在させて、具体的にはセラミックス基板
上に中間層を直接溶射(真空溶射も含む)し、その上に
複合セラミックス粉を溶射被覆し、前記セラミックス基
板と中間層との界面では、化学的な反応層及び投錨効果
により、一方前記中間層と溶射金属との界面では同種金
属の相互拡散あるいはもろくない異種金属間化合物によ
って、あるいは前記中間層と溶射セラミックスとの界面
では反応層によって接合する様に基板と被覆体の多様な
組合わせに対応したセラミックス基板上への被覆体及び
その製造法を提供するものである。
(実施例) 以下、本発明によるセラミックス基板上への被覆体及び
その製造法を詳細に説明する。
本発明は、セラミックス基板上に金属あるいは前記セラ
ミックスと異種セラミックスをプラズマ溶射(この場合
真空溶射も含む)する際に、当該構成体の中間に複合化
中間層を介在させ、該複合化中間層と前記構成体の界面
において、その組み合わせに起因する特有の接合体を有
することによって密着性のよいセラミックス基板上への
被覆体及びその製造法を提供するものである。
本発明によると、基板、中間層及び被覆体の各構成体の
材料はその組み合わせKより種々選択されるものである
が、基板セラミックス及び被覆体用金属は特に限定しな
いが、被覆用セラミックス材料は、例えば、基板との熱
膨張率の差を小さく押さえたり、あるいは溶射性の向上
を図る丸め、複合化して、その組合せにより生ずる特有
の性質も制御することが必要である。
一方、前記複合化中間層は、基板セラミックスと被覆体
の組み合わせによっては、中間層を介在させずにセラミ
ックス基板上に被覆体を直接溶射するか、あるいはセラ
ミックス基板が酸化物(A1203系、ZrO2系、8
i02系、TiO2系、NbtOs系、にρ系等)、炭
化物(TiC系、Nbs系、WE系)あるいは窒化物(
AIN系、TiN系、NbN系)の場合にあっては、溶
射金属主成分又は溶射セラミックス基板上主成分くイツ
トリア(y、o、 o〜20Mol%)単独若しくはイ
ットリ゛ア(YzOs )に基板セラミックス成分の一
部を添加したもの、あるいは又、低級酸化物を添加した
ものを中間層として選択される。
更に、セラミックス基板がSiC系、Si3Na系の場
合にあっては、活性金属(Ti 、AI、Nb、Cu)
を中間層として溶射するか、あるいは又、前記活性金属
にイツトリア(Y2O20〜20 Mol%)単独、若
しくはイツトリア(Y2O2)にλ1203.8i02
、Ca0%ZrO2、MgO,CeO2等t 添加シf
r−4のを中間層として選択される。
以上の各構成体の組み合わせによって基板セラミックス
の加工処理(投錨)をした表面に前記複合化中間層をA
rガス、HeガスあるいはAr −N2ガス等不活性ガ
スを介して所定条件で溶射し、その後、基板セラミック
スと異なった機能、例えば、絶縁性、誘導性、磁性、導
電性、耐熱性、耐摩耗性および伝熱性等を有する被覆用
の金属(例えば、鉄系材料、非鉄系材料、A1合金、C
u合金、貴金属、耐熱性材料等)、あるいは異種セラミ
ックスを前記同様所定条件によって溶射し、セラミック
ス基板上に所定の機能を有する被覆体を生成することが
できる。
以上述べた本願によるセラミックス基板上への被覆体及
びその製造法を構成する各々の材料の組み合わせ及びそ
の界面での反応を表示したのが表−1である。
表−1 〔セラミックス基板上への金属溶射〕 〔セラミックス基板上への異種セラミックス溶射〕この
ようKして得られたセラミックス被覆体の性質は、特に
粉末組成の適当な選択及び粉末の物理的性質の制御およ
び溶射条件の選択によって制御する事が出来、これらの
選択により所望な性質を有する材料を得ることが出来る
。更に1本発明によると、セラミックス基板表面に単一
の材料の被覆体を構成する必要はなく、目的に応じて機
能性を持たせた金属及び異種セラミックスを組み合わせ
パターン化あるいは積層して機能性を持たせることが可
能である。
(実施例1) ジルコルア系セラミックス基板上に、複合化中間層Fe
 −25Mo 1%FeOを溶射条件Arガス100s
cFH、Heガス205cFH、50V 、 700A
 、溶射距離100■で3分間溶射後、Feを溶射条件
Mガス100(実施例2) 中間層T i −5Mo 1%Y2O5を溶射条件Ar
カス100scFH,Heガス20 acFH、50v
、 700A 、溶射距離100■で3分間溶射後、T
iを溶射条件Arガス100+)。
(実施例3) アルミナ系セラミックス基板上に、複合化中間層Cu 
−5Mo 1%Y2O3を溶射条件Arガス100sc
FH、Heガス205cFH,50V 、 700A 
、溶射距離100■で3分間溶射後、Cuを溶射条件A
rガス(実施例4) チタニア系セラミックス基板上に、複合化中間層AI 
−5Mo 1%Y2O3を溶射条件Arカス100sc
F)LHeガス20scFH,50V、750A、溶射
距離100■で3分間溶射後、Cuを溶射条件Arガス
100鱈で3分間溶射し九(@4)。
(実施例5) アルミナ系セラミックス基板上に、複合化中間層Al−
ZrO2を溶射し念後、部分安定化ジルコニア(PSZ
)を、溶射条件Arガス100SCFIH1(実施例6
) 部分安定化ジルコニア(psz)基板上に、複(実施例
7) アルミナ系セラミックス基板上に、複合化(実施例8) アルミナ系セラミックス基板上に、複合化(実施例9) アルミナ系セラミックス基板上に、複合化(実施例10
) アルミナ系セラミックス基板よに、複合化(実施例11
) PSz基板上に、マスクを用いてCuのパターンを直接
溶射し、その上にP8Z、さらKCuのパターン、P8
Zというように積層溶射することができる。
以上の実施例1〜10の被覆体に治具を接着剤(アルダ
イ)AI)で取り付けてテストピースを作製して引張強
度を測定したが、何れも接着剤の部分で破断したため、
7今/−以上の引張強度を持ち、従来の引張強度の3〜
4に2/−程度に比べ何れも接着性がよかった。
又、図1〜10は以上の実施例1〜10の接合−で 面界隅の接合状態を光学顕微鏡写真妻示したものである
(発明の効果) 以上説明した通り、本発明のセラミックス基板上への被
覆体及びその製造法によれば、セラミックス基板材と金
属あるいは溶射セラミックスとの間に酸化物と前記金属
主成分粉末あるいは溶゛射セラきツクス主成分粉末とを
′混合した複合体である中間層を介在させて、具体的K
tiセラミックス基板上に中間層を直接溶射(真空溶射
も含む)するか、あるいは塗布後に加熱処理し、その上
に複合セラミックス粉を溶射被覆し、前記セラミックス
基板と中間層との界面では、反応層及び投錨効果により
、一方前記中間層と溶射金属との界面では同種金属相互
拡散あるいは異種金属間化合物によりて、あるいは前記
中間層と溶射セラミ・クスとの界面毎は反応層によ・て
接合する様に各構成体を種々選択するようにしたため、
基板材及び当該基板材が有する機能に加えて、被覆材が
有する機能を付加して選択自由度を大きく保持しながら
、特に密着性に優れたセラミックス基板上への被覆体及
びその製造法を提供することができる。
【図面の簡単な説明】
第1図はジルコニア系セラミックス基板上に中間m F
e01被覆体Feの試料断面の光学顕微鏡像、第2図は
アルミナ系セラミックス基板上に中間rN Ti−Yz
03被覆体Tiの試料断面の光学顕微鏡像、第3図はア
ルミナ系セラミックス基板上にCu−Y2O3の中間層
KCut溶射した試料断面の光学顕微鏡像、第4図はチ
タニア系セラミックス基板上にAI−’ho3の中間層
KAIを溶射した試料断面の光学顕微鏡像、第5図はア
ルミナ系セラミックス基板上にAI −ZrO2に部分
安定化ジルコニア(PSZ)を溶射した試料断面の光学
顕微鏡像、第6図はPSz基板上K Ti−ZrChの
中間層にTiCを溶射した試料断面の光学顕微鏡像、第
7図はアルミナ系セラミックス基板上にTi −Y2O
3の中間層にTiNを溶射した試料断面の光学顕微鏡像
、第8図はアルミナ系セラミックス基板上K Ti−Y
2O3溶射後、前を溶射した試料断面の光学顕微鏡像、
第9図はアルミナ系セラミックス基板上KTi−Y2O
3溶射後、5iC−Y2O3を溶射した試料断面の光学
顕微鏡像、第10図はアルミナ系セラミックス基板上K
Ti−Y2O3溶射後、5i3Nn −Y2O3を溶射
した試料断面の光学顕微鏡像。 特許出願人 科学技術庁金属材料技術研究所長中  川
  龍  − 手続補正書 昭和62年 6 月 77 日

Claims (5)

    【特許請求の範囲】
  1. (1)セラミックス基板表面に金属又は異種複合セラミ
    ックスで被覆されたセラミックス基板の被覆体において
    、 前記セラミックス基板と、前記金属又は被 覆複合セラミックスの中間に、 (a)被覆金属主成分に、イットリア単独若しくはイッ
    トリアに基板セラミックスの一部 を添加したもの (b)被覆金属主成分に、低級酸化物を添加したもの (c)活性金属にイットリア単独若しくはイットリアに
    基板セラミックスの一部若しくは イットリアにAl_2O_3、SiO_2、CaO、Z
    rO_2、MgO、CeO_2を添加したもの (d)活性金属に低級酸化物を添加したもの(e)被覆
    セラミックスにイットリア単独若しくはイットリアに基
    板セラミックスの一部 を添加したもの (f)介在しない のいづれかの複合化中間層を介在させ、 該複合化中間層と被覆複合セラミックスの 界面では化学的に接合され、複合化中間層と前記金属の
    界面においては両構成体に存する同種金属の相互拡散又
    は異種金属間化合物の接合によって、 複合化中間層とセラミックス基板の界面に おいては化学的に接合されることを特徴とするセラミッ
    クス基板上への被覆体。
  2. (2)セラミックス基板表面に金属又は異種複合セラミ
    ックスで被覆されたセラミックス基板の被覆体において
    、 前記セラミックス基板と、前記金属又は被 覆複合セラミックスの中間に、 (a)被覆金属主成分に、イットリア単独若しくはイッ
    トリアに基板セラミックスの一部 を添加したもの (b)被覆金属主成分に、低級酸化物を添加したもの (c)活性金属にイットリア単独若しくはイットリアに
    基板セラミックスの一部若しくは イットリアにAl_2O_3、SiO_2、CaO、Z
    rO_2、MgO、CeO_2を添加したもの (d)活性金属に低級酸化物を添加したもの(e)被覆
    セラミックスにイットリア単独若しくはイットリアに基
    板セラミックスの一部 を添加したもの (f)介在しない のいづれかの複合化中間層を溶射し、界面において投錨
    及び化学的に接合する工程と、 積層した前記複合化中間層の表面に金属又 は被覆複合セラミックスを溶射し、複合化中間層と被覆
    複合セラミックスの界面では化学的に接合する工程と、
    複合化中間層と前記金属の界面においては両構成体に存
    する同種金属の相互拡散又は異種金属間化合物の接合す
    る工程とを特徴とするセラミックス被覆体の製造法。
  3. (3)被覆複合セラミックスは酸化物系、炭化物系及び
    窒化物系からなる特許請求の範囲委細第1項および第2
    項のいづれかに記載のセラミックス基板への被覆体。
  4. (4)複合化中間層は溶射金属の主成分若しくは溶射セ
    ラミックス主成分と、0〜20Mol%イットリア若し
    くは0〜20Mol%イットリアと0〜10Mol%基
    板セラミックス主成分、若しくは溶射金属主成分と10
    〜80Mol%の低級酸化物である特許請求の範囲第1
    項および第2項いづれか記載のセラミックス基板上への
    被覆体。
  5. (5)複合化中間層はセラミックス基板がSiCあるい
    はSi_3N_4であるときは、活性金属および0〜2
    0Mol%イットリア単独あるいは0〜20Mol%イ
    ットリアにAl_2O_3、CaO、SiO_2、Zr
    O_2、MgO、CeO_2を添加した特許請求の範囲
    第1項および第2項のいづれかに記載のセラミックス基
    板上への被覆体。
JP61223710A 1986-09-24 1986-09-24 セラミツクス基板上への被覆体の製造法 Granted JPS6379777A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61223710A JPS6379777A (ja) 1986-09-24 1986-09-24 セラミツクス基板上への被覆体の製造法
US07/388,096 US4911987A (en) 1986-09-24 1989-08-01 Metal/ceramic or ceramic/ceramic bonded structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61223710A JPS6379777A (ja) 1986-09-24 1986-09-24 セラミツクス基板上への被覆体の製造法

Publications (2)

Publication Number Publication Date
JPS6379777A true JPS6379777A (ja) 1988-04-09
JPH0510309B2 JPH0510309B2 (ja) 1993-02-09

Family

ID=16802451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61223710A Granted JPS6379777A (ja) 1986-09-24 1986-09-24 セラミツクス基板上への被覆体の製造法

Country Status (2)

Country Link
US (1) US4911987A (ja)
JP (1) JPS6379777A (ja)

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Also Published As

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US4911987A (en) 1990-03-27
JPH0510309B2 (ja) 1993-02-09

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