JP2020512691A - 高い腐食性又は浸食性の半導体処理用途に使用するためのセラミック材料アセンブリ - Google Patents
高い腐食性又は浸食性の半導体処理用途に使用するためのセラミック材料アセンブリ Download PDFInfo
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Abstract
Description
この出願は、この引用により本明細書にその内容全体が組み込まれる2017年3月21日出願のElliot他に付与された米国仮特許出願第62/474,597号に対する優先権を主張するものである。
121 内部通路
122 接合層
123 ディスク
Claims (35)
- 高度に浸食性の環境に使用するための半導体処理チャンバ構成要素であって、
1又は2以上の識別された高摩耗露出面を有する構造的支持部分と、
1又は2以上の磨耗表層と、
前記1又は2以上の磨耗表層を前記構造的支持部分に接合し、金属アルミニウムを含む1又は2以上の接合層と、
を含むことを特徴とする半導体処理チャンバ構成要素。 - 前記構造的支持部分は、アルミナを含むことを特徴とする請求項1に記載の半導体処理チャンバ構成要素。
- 前記構造的支持部分は、窒化アルミニウムを含むことを特徴とする請求項1に記載の半導体処理チャンバ構成要素。
- 前記1又は2以上の表層は、サファイアを含むことを特徴とする請求項2に記載の半導体処理チャンバ構成要素。
- 前記1又は2以上の表層は、サファイアを含むことを特徴とする請求項3に記載の半導体処理チャンバ構成要素。
- 前記接合層は、99重量%よりも多い金属アルミニウムを含むことを特徴とする請求項4に記載の半導体処理チャンバ構成要素。
- 前記接合層は、99重量%よりも多い金属アルミニウムを含むことを特徴とする請求項5に記載の半導体処理チャンバ構成要素。
- 産業構成要素が、注入器ノズルであり、
前記構造的支持部分は、内部通路を含む、
ことを特徴とする請求項4に記載の半導体処理チャンバ構成要素。 - 産業構成要素が、注入器ノズルであり、
前記構造的支持部分は、内部通路を含む、
ことを特徴とする請求項5に記載の半導体処理チャンバ構成要素。 - 半導体処理チャンバ構成要素が、フォーカスリングであり、
前記構造的支持部分は、カラー及びフォーカスチューブを含み、
前記1又は2以上の磨耗表層は、前記フォーカスチューブの内面に接合される、
ことを特徴とする請求項1に記載の半導体処理チャンバ構成要素。 - 前記構造的支持部分は、アルミナを含むことを特徴とする請求項10に記載の半導体処理チャンバ構成要素。
- 前記構造的支持部分は、窒化アルミニウムを含むことを特徴とする請求項10に記載の半導体処理チャンバ構成要素。
- 前記1又は2以上の表層は、サファイアを含むことを特徴とする請求項11に記載の半導体処理チャンバ構成要素。
- 前記1又は2以上の表層は、サファイアを含むことを特徴とする請求項12に記載の半導体処理チャンバ構成要素。
- 処理中にウェーハを支持するようになったエッジリングであることを特徴とする請求項1に記載の半導体処理チャンバ構成要素。
- 前記構造的支持部分は、アルミナを含むことを特徴とする請求項15に記載の半導体処理チャンバ構成要素。
- 前記1又は2以上の表層は、サファイアを含むことを特徴とする請求項16に記載の半導体処理チャンバ構成要素。
- 前記構造的支持部分は、窒化アルミニウムを含むことを特徴とする請求項15に記載の半導体処理チャンバ構成要素。
- 前記1又は2以上の表層は、サファイアを含むことを特徴とする請求項18に記載の半導体処理チャンバ構成要素。
- 高度に浸食性の環境に使用するようになったフォーカスリングであって、
カラーと、
フォーカスチューブと、
前記カラーを前記チューブに接合し、金属アルミニウムを含む接合層と、
を含むことを特徴とするフォーカスリング。 - 前記カラーは、アルミナを含むことを特徴とする請求項20に記載のフォーカスリング。
- 前記フォーカスチューブは、サファイアを含むことを特徴とする請求項21に記載のフォーカスリング。
- 前記カラーは、窒化アルミニウムを含むことを特徴とする請求項20に記載のフォーカスリング。
- 前記フォーカスチューブは、サファイアを含むことを特徴とする請求項23に記載のフォーカスリング。
- 高度に浸食性の環境に使用するための半導体処理チャンバ構成要素を製造する方法であって、
1又は2以上の摩耗表層を半導体チャンバ処理構成要素主支持構造体の上に該1又は2以上の摩耗表層と該支持構造体の間に配置されて金属アルミニウムを含む1又は2以上のろう付け層を用いて配置する段階と、
事前ろう付けサブアセンブリを処理チャンバの中に置く段階と、
前記処理チャンバから酸素を除去する段階と、
770Cよりも高い温度まで加熱することによって前記摩耗表層を前記主支持構造体に接合し、それによって気密接合部を用いて該摩耗表層を該主支持構造体に接合する段階と、
を含むことを特徴とする方法。 - 前記処理チャンバから酸素を除去する前記段階は、前記構成要素の前記加熱中に1x10E−4よりも低い圧力まで真空を印加する段階を含むことを特徴とする請求項25に記載の方法。
- 前記主支持構造体は、窒化アルミニウムを含むことを特徴とする請求項25に記載の方法。
- 前記1又は2以上の表層は、サファイアを含むことを特徴とする請求項27に記載の方法。
- 前記ろう付け層は、99重量%よりも多い金属アルミニウムを含むことを特徴とする請求項28に記載の方法。
- 前記主支持構造体は、アルミナを含むことを特徴とする請求項25に記載の方法。
- 前記1又は2以上の表層は、サファイアを含むことを特徴とする請求項30に記載の方法。
- 前記ろう付け層は、99重量%よりも多い金属アルミニウムを含むことを特徴とする請求項31に記載の方法。
- 前記接合温度は、770−1200Cの範囲にあることを特徴とする請求項32に記載の方法。
- 前記ろう付け層は、99重量%よりも多い金属アルミニウムを含むことを特徴とする請求項25に記載の方法。
- 前記接合温度は、770−1200Cの範囲にあることを特徴とする請求項34に記載の方法。
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