JPS6375569A - Tester for substrate inspection - Google Patents
Tester for substrate inspectionInfo
- Publication number
- JPS6375569A JPS6375569A JP22049486A JP22049486A JPS6375569A JP S6375569 A JPS6375569 A JP S6375569A JP 22049486 A JP22049486 A JP 22049486A JP 22049486 A JP22049486 A JP 22049486A JP S6375569 A JPS6375569 A JP S6375569A
- Authority
- JP
- Japan
- Prior art keywords
- spring
- movable contact
- pin
- contact pin
- super
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 title description 3
- 239000000523 sample Substances 0.000 claims abstract description 18
- 238000005259 measurement Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001000 nickel titanium Inorganic materials 0.000 abstract description 2
- 230000009466 transformation Effects 0.000 abstract description 2
- 230000001788 irregular Effects 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、実装前のプリント基板や実装後のプリント基
板等の検査をする基板検査用テスタに関するものである
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a tester for inspecting a printed circuit board before mounting, a printed circuit board after mounting, and the like.
（従来技術）
近年、プリント基板の集積度が高くなるにつれ、イの信
頼性試験に係る作業量が増加してさている。(Prior Art) In recent years, as the degree of integration of printed circuit boards has increased, the amount of work involved in reliability testing has increased.
これに伴い、基板パターンのオープン・ショッートヂエ
ツク、実装部品の良否判定、接続箇所のヂエツク等を速
やかに行うためのインサーキットテスタなどが広く使用
されるようになってさた。Along with this, in-circuit testers and the like have come into widespread use for quickly performing open shot checks of board patterns, determining the quality of mounted components, and checking connections.
第３図及び第４図はインリートキラ１−テスタ。Figures 3 and 4 are Inreet Killa 1-Tester.
ボードテスタ等の測定端末を示したもので、板状の支持
フレーム１に多数のピンプローブ２を小ピツチで貫通支
持させ、支持フレーム１を加工させて検査用基板３の各
部に各ピンブｒｊ−ブ２の先端の可動］ンタクトピン４
を圧接させ、各ピンプ］］−ブ２より測定コード５を介
して信号をとり出し、解析して各検査箇所の良否を判定
するようになっている。なお、６は検査用基板３に実装
されている電子部品である。This figure shows a measurement terminal such as a board tester, in which a large number of pin probes 2 are supported through a plate-shaped support frame 1 at small pitches, and the support frame 1 is processed to attach each pin probe rj- to each part of the test board 3. Movable tip of pin 2] Contact pin 4
are brought into pressure contact with each other, and a signal is taken out from each pimp 2 via a measurement cord 5 and analyzed to determine the quality of each inspection location. Note that 6 is an electronic component mounted on the inspection board 3.
近年、更に高密度実装を行うため、第４図に示づように
、基板３の表面へも実装を行う、所謂り一−フェス・マ
ウン１〜・チクノロシイ（ＳＭＴ）が増えできており、
この場合、検査は図示のように基板３の部品実装面側よ
り行わざるを得ない。このようにして検査を行うと、場
所によっては可動コンタクトビン４が電子部品６の上に
乗り上げるところと、基板３の表面に接するところとが
生じる。In recent years, in order to achieve even higher density mounting, so-called face mounting technology (SMT), which also performs mounting on the surface of the board 3, has been increasing, as shown in Figure 4.
In this case, the inspection must be performed from the component mounting surface side of the board 3 as shown in the figure. When the inspection is performed in this manner, the movable contact pin 4 may ride on the electronic component 6 at some places and come into contact with the surface of the board 3 depending on the location.
（発明が解決しようとする問題点）
しかしながら、このように各可動コンタクトピン４の接
触先が基板３十の突出部や基板面等のように異なると、
各可動コンタクトピン４のストロークが責なる。従来の
バネは弾性変形域が小さく（例えば、歪０．２％以下）
、従って弾性変形域内での使用を考えた場合、例えば接
触先が基板面であるコンタクトビン４が電気的に必要最
低限の接触圧を得るようバネを変形させた際に、接触先
が基板３上の突出部に当っている他のコンタク１−ビン
４のバネの歪が０．２％以内に納まるようにしなければ
ならず、ストロークが大きくとれない等の設泪」ユの問
題点があった。(Problems to be Solved by the Invention) However, if the contact points of each movable contact pin 4 are different, such as the protrusion of the board 30 or the board surface,
The stroke of each movable contact pin 4 is responsible. Conventional springs have a small elastic deformation range (for example, strain of 0.2% or less)
Therefore, when considering use within the elastic deformation range, for example, when the contact pin 4 whose contact point is the substrate surface deforms the spring so as to obtain the minimum electrical contact pressure, the contact point is the substrate surface. It is necessary to keep the distortion of the spring of the other contactor 1-bin 4 that is in contact with the upper protrusion part to within 0.2%, and there are problems with the installation such as not being able to take a large stroke. Ta.
本発明の目的は、各可動コンタクトピンのストロークを
大きくとれる基板検査用テスタを提供することにある。An object of the present invention is to provide a board inspection tester that allows each movable contact pin to have a large stroke.
（問題点を解決するための手段）
上記の目的を達成するための本発明の構成を、実施例に
対応する第１図を参照して説明すると、本発明は板状の
支持フレーム１に多数のピンプローブ２が支持され、前
記各ピンプローブ２の各可動コンタクトピン４はバネ７
によって突出方向に付勢されている基板検査用テスタに
おいて、前記各ピンプローブ２で前記各可動コンタクト
ピン１を付勢している前記バネ７として超弾性バネが使
用されていることを特徴とする。(Means for Solving the Problems) The structure of the present invention for achieving the above object will be explained with reference to FIG. 1 corresponding to an embodiment. pin probes 2 are supported, and each movable contact pin 4 of each pin probe 2 is supported by a spring 7.
The board inspection tester is biased in the projecting direction by a superelastic spring as the spring 7 biasing each movable contact pin 1 in each pin probe 2. .
（作用）
このように各ピンプローブ２の可動コンタクトピン４を
付勢するバネ７として超弾性バネを使用すると、各可動
コンタクトピン４のストロークを人ぎくとることができ
る。(Function) When a superelastic spring is used as the spring 7 for biasing the movable contact pin 4 of each pin probe 2 in this way, the stroke of each movable contact pin 4 can be controlled.
（実施例）
以下本発明の実施１例を図面を参照して詳細に説明する
。本実施例の基板検査用テスタは、第３図に示すように
して支持フレーム１に支持されている多数のピンプロー
ブ２において、各可動コンタクトピン４を付勢している
バネ７として超弾性バネを使用している。即ら、ピンプ
ローブ２は、支持フレーム１を貫通してこれに支持され
ている絶縁スリーブ８を有し、該絶縁スリーブ８内の先
端側には可動コンタクトビン４が摺動自在に挿入されて
いる。絶縁スリーブ８の基端側にはバネ受けを兼ねた電
極９が支持され、該電極９には測定コード５が接続され
ている。絶縁スリーブ８内には可動コンタクトピン４を
付勢する超弾性バネ７が収納され、その両端は電極９と
可動コンタクトピン４とに当接されている。可動コンタ
クトピン４ど電極９とはリード線１０で接続されている
。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings. The circuit board inspection tester of this embodiment has a large number of pin probes 2 supported on a support frame 1 as shown in FIG. are using. That is, the pin probe 2 has an insulating sleeve 8 that passes through the support frame 1 and is supported by the same, and a movable contact pin 4 is slidably inserted into the distal end side of the insulating sleeve 8. There is. An electrode 9 which also serves as a spring holder is supported on the proximal end side of the insulating sleeve 8, and the measurement cord 5 is connected to the electrode 9. A superelastic spring 7 that biases the movable contact pin 4 is housed in the insulating sleeve 8, and both ends of the spring 7 are in contact with the electrode 9 and the movable contact pin 4. The movable contact pin 4 is connected to the electrode 9 by a lead wire 10.
超弾性バネ７としては、例えばＮｉ−Ｔｉ合金バネのよ
うな形状記憶バネを使用する。この場合、形状記憶バネ
の変態点を、例えば室温以下に設定しておき、使用環境
では形状記憶バネが超弾性効果を発揮するＪ：うにする
。このときの形状記憶バネの応力（σ）−歪（ε）曲線
は、第２図に示すようになり、通常のバネに比べ回復可
能な変形岨は数倍〜１０倍にもなる。As the superelastic spring 7, a shape memory spring such as a Ni-Ti alloy spring is used, for example. In this case, the transformation point of the shape memory spring is set, for example, below room temperature, so that the shape memory spring exhibits a superelastic effect in the usage environment. The stress (σ)-strain (ε) curve of the shape memory spring at this time is as shown in FIG. 2, and the recoverable deformation slope is several to ten times that of a normal spring.
従って、超弾性バネ７を使用したピンプローブ２によれ
ば、第４図のように被測定面に凹凸があっても大きなス
トロークがとれ、何ら問題がない。Therefore, according to the pin probe 2 using the superelastic spring 7, even if the surface to be measured has irregularities as shown in FIG. 4, a large stroke can be taken without any problem.
（発明の効果）
以上説明したように本発明に係る基板検査用テスタでは
、各ピンプローブで可動コンタクトピンを付勢づるバネ
として超弾性バネを使用したので、従来のものに比べ各
可動コンタクトピンのストロークを非常に大ぎくどれ、
接触相手に凹凸があっても何ら問題がなく、測定に使用
できる範囲が広がる利点がある。(Effects of the Invention) As explained above, in the board inspection tester according to the present invention, a superelastic spring is used as a spring to bias the movable contact pins in each pin probe. Make the stroke very hard,
There is no problem even if the contact partner has irregularities, and the advantage is that the range that can be used for measurement is expanded.
第１図は本発明に係る基板検査用テスタで用いているピ
ンプローブの一例を示す縦断面図、第２図は超弾性バネ
の応力−歪特性図、第３図は基板検査用テスタの一例の
斜視図、第４図は同テスタの検査状態の概念図である。
１・・・支持フレーム、２・・・ピンプローブ、３・・
・検査用基板、４・・・可動コンタクトピン、６・・・
電子部品、７・・・超弾性バネ。
第１図 箱２図
竿４図Fig. 1 is a vertical cross-sectional view showing an example of a pin probe used in a tester for board inspection according to the present invention, Fig. 2 is a stress-strain characteristic diagram of a superelastic spring, and Fig. 3 is an example of a tester for board inspection. FIG. 4 is a conceptual diagram of the testing state of the tester. 1...Support frame, 2...Pin probe, 3...
・Inspection board, 4... Movable contact pin, 6...
Electronic components, 7... Super elastic springs. Figure 1 Box 2 Figure Rod 4 Figure
Claims (1)
前記各ピンプローブの各可動コンタクトピンはバネによ
って突出方向に付勢されている基板検査用テスタにおい
て、前記各ピンプローブで前記各可動コンタクトピンを
付勢している前記バネとして超弾性バネが使用されてい
ることを特徴とする基板検査用テスタ。A large number of pin probes are supported on a plate-shaped support frame.
Each movable contact pin of each of the pin probes is biased in a protruding direction by a spring.In the board inspection tester, a superelastic spring is used as the spring that biases each of the movable contact pins of each of the pin probes. A board inspection tester characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22049486A JPS6375569A (en) | 1986-09-18 | 1986-09-18 | Tester for substrate inspection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22049486A JPS6375569A (en) | 1986-09-18 | 1986-09-18 | Tester for substrate inspection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6375569A true JPS6375569A (en) | 1988-04-05 |
Family
ID=16751937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22049486A Pending JPS6375569A (en) | 1986-09-18 | 1986-09-18 | Tester for substrate inspection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6375569A (en) |
-
1986
- 1986-09-18 JP JP22049486A patent/JPS6375569A/en active Pending
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