JPS63169038A - Probe card - Google Patents
Probe cardInfo
- Publication number
- JPS63169038A JPS63169038A JP66287A JP66287A JPS63169038A JP S63169038 A JPS63169038 A JP S63169038A JP 66287 A JP66287 A JP 66287A JP 66287 A JP66287 A JP 66287A JP S63169038 A JPS63169038 A JP S63169038A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- contact
- stylus
- chuck
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 20
- 239000011111 cardboard Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 abstract description 9
- 238000005452 bending Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 241001422033 Thestylus Species 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 25
- 241000257465 Echinoidea Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は１０−ブカードに関し、特にウェハー全体につ
いて電気的特性試験を行うことができる１０−ブカード
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a 10-bu card, and more particularly to a 10-bu card that allows electrical property testing to be performed on an entire wafer.
１、従来の技術〕
従来、この種の１０−ブカードは、ウェハーと接触する
ための針とテスターに接続するケーブルとのコンタクト
部とプローブカード基板から成り、基板上に部品取り付
は及び配線を施しウェハーとテスター間の電気的信号を
伝達している。また、ウニ、バーやチャックの大口径化
に対しては、プローブカードの基板の長さを長くして対
応していた。1. Prior art] Conventionally, this type of 10-book card consists of a needle for contacting the wafer, a contact part for a cable to be connected to a tester, and a probe card board, on which parts are mounted and wiring is carried out. It transmits electrical signals between the applied wafer and the tester. In addition, the length of the probe card substrate was lengthened to accommodate larger diameters of urchins, bars, and chucks.
第３図は従来のかかる一例を説明するための１０−ブカ
ードの正面図である。FIG. 3 is a front view of a 10-book card for explaining an example of such a conventional card.
第３図に禿すように、プローブカード基板１はその峠端
部にコンタクト部２を有し、また接触針３を備えた針載
竺台４を有する。この接触針３はウェハー５を電気的特
性の試験をするものであり、またウェハー５はチャック
６により固定される。 尚、コンタクト部２はウェハー
試験にあたり外部ケーブルコネクタ７に接続される。As shown in FIG. 3, the probe card board 1 has a contact portion 2 at the end thereof, and also has a needle mounting base 4 equipped with a contact needle 3. This contact needle 3 is used to test the electrical characteristics of the wafer 5, and the wafer 5 is fixed by a chuck 6. Note that the contact portion 2 is connected to an external cable connector 7 for wafer testing.
上述した従来のプローブカード基板は平面的であるため
、ウェハーまたはチャックのサイズが大きくなると、ウ
ェハーまたはチャックがケーブルコンタク１〜部に接続
されたケーブルのコネクタの最下面に接触してしまう問
題がある。従って、ウェハー全体についての電気的特性
試験を行えないという欠点がある。Since the above-mentioned conventional probe card board is flat, when the size of the wafer or chuck becomes large, there is a problem that the wafer or chuck comes into contact with the bottom surface of the connector of the cable connected to the cable contactors 1 to 1. . Therefore, there is a drawback that electrical characteristic tests cannot be performed on the entire wafer.
本発明はカード基板にウェハー試験用接触針を載置し且
つ前記基板の終端部に外部ケーブルコネクタとのコンタ
クト部を有し、チャック上に置かれた前記ウェハーの電
気的特性試験を行うプローブカードにおいて、前記コン
タクト部を含む前記基板の終端部を上方に折曲げる手段
と前記カード基板および前記接触針の間に設けた針位置
調整台とのうち少なくとも一方を備え、前記ケーブルコ
ネクタの最下面を前記ウェハー面よりも実質的に上にな
るように構成される。The present invention provides a probe card which has a contact needle for wafer testing on a card board, has a contact part with an external cable connector at the end of the board, and tests the electrical characteristics of the wafer placed on a chuck. The cable connector is provided with at least one of means for bending the terminal end portion of the board including the contact portion upward and a needle position adjustment stand provided between the card board and the contact needle, and the lowermost surface of the cable connector is The wafer is configured to be substantially above the wafer surface.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の第一の実施例を説明するためのプロー
ブカードの正面図である。FIG. 1 is a front view of a probe card for explaining a first embodiment of the present invention.
第１図に示すように、プローブカード基板１はその終端
部にケーブルとのコンタクト部２を有し、中央部には試
験用接触針３と針基板４を載置する穴を形成している。As shown in FIG. 1, the probe card board 1 has a contact part 2 with a cable at its terminal end, and a hole in the center for placing a test contact needle 3 and a needle board 4. .
５は被試験用ウェハー、６はウェハー５を固定するチャ
ック、７はコンタクト部２と接続されるケーブルコネク
タである。5 is a wafer to be tested; 6 is a chuck for fixing the wafer 5; and 7 is a cable connector connected to the contact section 2.
１０−ブカード基板１を上方へ屈曲させることによりウ
ェハー５やチャック６はケーブルコネクタ７の最下面と
接触しないので、ウェハー５やチャック０の大きさに関
係なくウェハー５の全体について電気的特性試験を行う
ことができる。By bending the 10-block card board 1 upward, the wafer 5 and chuck 6 do not come into contact with the bottom surface of the cable connector 7, so the electrical characteristics test can be performed on the entire wafer 5 regardless of the size of the wafer 5 and chuck 0. It can be carried out.
第２図は本発明の第二の実施例を説明するための１０−
ブカードの正面図である。FIG. 2 is a diagram illustrating a second embodiment of the present invention.
FIG. 3 is a front view of the book card.
第２図に示すように、プローブカード基板１と針３の間
に針位置調整台８を挿入し針位置を下方へ修正する。こ
の実施例では針の位置が下がりウェハー５やチャック６
はケーブルコネクタ７の最下面と接触しないので、ウェ
ハー５やチャック６の大きさに関係なくウェハー全体に
ついて電気的特性試験を行うことができる。尚、４は前
記第一の実施例同様の針基板である。As shown in FIG. 2, a needle position adjustment table 8 is inserted between the probe card board 1 and the needle 3 to correct the needle position downward. In this embodiment, the needle position is lowered and the wafer 5 and chuck 6
Since it does not come into contact with the bottom surface of the cable connector 7, the electrical characteristics test can be performed on the entire wafer regardless of the size of the wafer 5 or chuck 6. Note that 4 is a needle substrate similar to the first embodiment.
以上説明したように、本発明はプローブカード基板を改
良することにより、ウェハーまたはチャックの大きさに
関係なく半導体集積回路ウェハーの電気的特性試験をウ
ェハー全体について実施できる効果がある。As described above, the present invention has the advantage that by improving the probe card substrate, electrical characteristic tests of semiconductor integrated circuit wafers can be performed on the entire wafer regardless of the size of the wafer or chuck.
第１図は本発明の第一の実施例を説明するためのプロー
ブカードの正面図、第２図は本発明の第二の実施例を説
明するためのプローブカードの正面図、第３図は従来の
１０−ブカードの正面図である。
１・・・プローブカード基板、２・・・ケーブルとのコ
ンタク１〜部、３・・・針、４・・・針基板、５・・・
ウェハー、６・・・チャック、７・・・ケーブルコネク
タ、８・・・針位置Ａ整合。
代理人 弁理士 内 原 昔、′パ
第３図FIG. 1 is a front view of a probe card for explaining a first embodiment of the present invention, FIG. 2 is a front view of a probe card for explaining a second embodiment of the present invention, and FIG. 3 is a front view of a probe card for explaining a second embodiment of the present invention. FIG. 2 is a front view of a conventional 10-book card. DESCRIPTION OF SYMBOLS 1... Probe card board, 2... Contact part 1 to cable, 3... Needle, 4... Needle board, 5...
Wafer, 6...Chuck, 7...Cable connector, 8...Needle position A alignment. Agent Patent Attorney Uchihara A long time ago, 'Pa Figure 3
Claims (1)
板の終端部に外部ケーブルコネクタとのコンタクト部を
有し、チャック上に置かれた前記ウェハーの電気的特性
試験を行うプローブカードにおいて、前記コンタクト部
を含む前記基板の終端部を上方に折曲げる手段と前記カ
ード基板および前記接触針の間に設けた針位置調整台と
のうち少くとも一方を備え、前記ケーブルコネクタの最
下面を前記ウェハー面よりも実質的に上になるようにし
たことを特徴とするプローブカード。In a probe card for testing the electrical characteristics of the wafer placed on a chuck, the probe card has a contact needle for wafer testing on a card board and has a contact part for connecting to an external cable connector at the end of the board, and the contact needle for testing the wafer is placed on a chuck. and a needle position adjustment table provided between the card board and the contact needle, the lowermost surface of the cable connector being aligned with the wafer surface. A probe card characterized in that the probe card is substantially higher than the probe card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP66287A JPS63169038A (en) | 1987-01-05 | 1987-01-05 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP66287A JPS63169038A (en) | 1987-01-05 | 1987-01-05 | Probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63169038A true JPS63169038A (en) | 1988-07-13 |
Family
ID=11479936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP66287A Pending JPS63169038A (en) | 1987-01-05 | 1987-01-05 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63169038A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6642729B2 (en) | 2001-06-16 | 2003-11-04 | Samsung Electronics Co., Ltd. | Probe card for tester head |
-
1987
- 1987-01-05 JP JP66287A patent/JPS63169038A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6642729B2 (en) | 2001-06-16 | 2003-11-04 | Samsung Electronics Co., Ltd. | Probe card for tester head |
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