JPS6369625A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPS6369625A JPS6369625A JP61214673A JP21467386A JPS6369625A JP S6369625 A JPS6369625 A JP S6369625A JP 61214673 A JP61214673 A JP 61214673A JP 21467386 A JP21467386 A JP 21467386A JP S6369625 A JPS6369625 A JP S6369625A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- laminate
- laminated sheet
- resin
- thereafter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 238000010791 quenching Methods 0.000 claims description 5
- 230000000171 quenching effect Effects 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract description 2
- 239000002966 varnish Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 241000723436 Chamaecyparis obtusa Species 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- -1 polybutylene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は′（気機器、電子機器、］算鏡器％通偵８１器
用等に用すられる積層板の製造方法に関す゛るものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a laminate plate used for mechanical equipment, electronic equipment, arithmetic instruments, etc.
従来、１気用等に用１八られる積層板は漬７４嘆必後、
所要寸法に切断し、自然放冷して製品と−’３−８もの
が殆んどで、特に寸法安定性が要求されるＩ′バ層板１
でつｈては所要寸法に切断後、史ｊｚ（アフメ〜キュア
ーし、自然放冷しで製品としてｂるが、叶今のファ、イ
ンパターン化におりては更に高ｉ′Ｆの寸法安定性と表
面平滑性が要求されてＩＡだ。Conventionally, the laminated boards used for one purpose, etc. have been soaked for 74 years.
The product is cut to the required size and left to cool naturally.Most of the products are 3-8, and particularly require dimensional stability.
After cutting to the required size, it is cured and left to cool naturally to become a product, but in today's F, in-patterning process, the dimensional stability of even higher i'F is achieved. IA is required because of its flexibility and surface smoothness.
本発明の目的とするところは寸法安定ｔｌ： 、、春面
平渭性（て優れた積層板の製造方法を提供することにあ
る。An object of the present invention is to provide a method for manufacturing a laminate with excellent dimensional stability, tl, and flatness.
本発明は撞Ｉ−板用基材に樹脂を含′ｌトした樹脂含浸
基材を所要枚数重ね、更に必要に応じてその上面及び又
は下面に金属箔を配役した穆１１体を積層成形後、所要
寸法に切断し、更にアフターキュア−後、急冷すること
を特徴とする積層板の製造方法のため、アフターキエア
ーにより樹脂の完全硬化及び積層成形時に発生する歪が
除去され、更に急冷によって反り、ねじれを発生するこ
となく表面平滑性に優れた積Ｉ−板を得ることができた
もので、以下本発明の詳細な説明する。In the present invention, a required number of resin-impregnated base materials containing resin are stacked on the base material for the I-board, and then 11 pieces are laminated and molded, with metal foil placed on the upper and/or lower surfaces as necessary. The manufacturing method of laminates is characterized by cutting to the required size, followed by after-curing, and then rapidly cooling.The after-curing process completely cures the resin and removes the distortion that occurs during lamination molding, and the laminates are then cut to the required size, followed by after-curing, and then rapidly cooled. A laminated I-plate with excellent surface smoothness was obtained without warping or twisting, and the present invention will be described in detail below.
本発明に用いる積層板用基材としてはガラス、アスベス
ト等の無機繊維やポリエステル、ポリアミド、ポリビニ
ルアルコール、アクリル等の有機合成繊維や木綿等の天
然禮維からなる織布、不織布、マット或は紙又はこれら
の組合せ基材等である。樹脂としてはフェノール樹脂、
クレゾール樹脂、エポキシ樹脂、不飽和ポリエステル樹
脂、メラミン樹脂、ポリイミド、ポリブタジェン、ポリ
アミド、ポリアミドイミＦ１ポリスルフォン、ポリフェ
ニレンサルファイド、ポリフェニレンオキサイド、ポリ
ブチレンテレツメレート、ポリエーテルエーテルケトン
、弗化樹脂等の単独、変性物、混合物等が用いられ必要
に応じて粘度調整に水、メチルアルコール、アセトン、
シクロヘキサノｙ１ スチレンモノマー等の溶媒を添加
したものである。樹脂は必要て応じて一次含浸用、二次
含浸用、三次含浸用等のようく複数回に分けて同−樹脂
又は異種樹脂を含浸させることもできる。金属層として
は銅、鉄、ニッケル、亜鉛、アルミニウム等の単独、合
金を用Ａることかでき、必要に応じて金属層の片面に接
着剤層を設は接−資性を同上させることもできる。積層
成形は多段プレス機、マルチロール機、ドラム成形機、
ダブルベルト成形機等による加熱加圧成形でもよく又、
エンドレスベルト成形機、連続加熱炉方式等だよる加熱
無圧成形でもよく特に限定するものではな−、切断後の
アブターキエアーは連続加熱炉方式、加熱炉方式等のよ
うにパンチ式、連続式の各れでもよく特に限定するもの
ではないがアフターキュアー後は急冷することが必要で
ある。急冷方式は特に限定するものではなく、冷却した
電気、炭酸ガス。The base materials for the laminate used in the present invention include woven fabrics, non-woven fabrics, mats, and paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. Or a combination base material etc. of these. The resin is phenolic resin,
Cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide F1 polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene teletumerate, polyether ether ketone, fluorinated resin, etc. alone, Modified products, mixtures, etc. are used, and water, methyl alcohol, acetone, etc. are used to adjust the viscosity as necessary.
Cyclohexano y1 A solvent such as styrene monomer is added. If necessary, the resin can be impregnated with the same resin or different resins in multiple steps, such as for primary impregnation, secondary impregnation, and tertiary impregnation. The metal layer can be made of copper, iron, nickel, zinc, aluminum, etc. alone or in an alloy, and if necessary, an adhesive layer can be provided on one side of the metal layer to improve the bondability. can. Laminate molding is done using multi-stage press machines, multi-roll machines, drum molding machines,
Heat and pressure molding using a double belt molding machine etc. may also be used.
It is not particularly limited to heating and pressureless forming using an endless belt forming machine, a continuous heating furnace method, etc., but the abutment air after cutting may be a punch type or continuous method such as a continuous heating furnace method, a heating furnace method, etc. Any of these may be used, but there is no particular limitation, but rapid cooling is required after after-curing. The rapid cooling method is not particularly limited, and can be cooled electricity or carbon dioxide gas.
ｔＡ素ガス、ツウ素ガス等の低温気体の充満した檜を通
過させたり、低温気体を吹き付けたりする低温気体によ
る冷却や、冷却した水、液化ガス液等の低温液体の充満
した槽を通過させたり、低温液体を吹付けたりする低温
液体による冷却や、冷却したロール、プレス等の低温金
属との接触による冷却等が用いられ任意である。更に上
記急冷方式を複数組み合わせて用することもできる。積
層成形、了フターキエアー、急冷条件については使用す
る基材、樹脂により異なるが、積層成形については８０
〜２５０℃、アフターキニアーにっｂでは８０〜２５０
℃、急冷については積層板表面温度で一１０〜６０℃迄
急冷することが好ましい。以下本発明を実施例にもとづ
ｂて説明する。Cooling with low-temperature gas such as passing through a hinoki cypress filled with low-temperature gas such as tA gas or fluorine gas, or blowing low-temperature gas, or passing through a tank filled with low-temperature liquid such as chilled water or liquefied gas liquid. Cooling with a low-temperature liquid such as spraying a low-temperature liquid, cooling by contact with a low-temperature metal such as a chilled roll or press, etc., may be used as desired. Furthermore, it is also possible to use a combination of a plurality of the above quenching methods. Laminate molding, cooling air, and quenching conditions vary depending on the base material and resin used, but for laminated molding, 80%
~250℃, 80~250 at after-kinear b
As for the rapid cooling, it is preferable to rapidly cool the laminate to a surface temperature of -10 to 60°C. The present invention will be explained below based on examples.
実施例
厚さ０．２ｆｌの長尺帯状ガラス布基材８枚に夫々硬化
剤含有エポキシ樹脂フェスを含浸させ、スクイズロール
で樹脂量が５０℃ｍｌ（以下単に憾と記す）になるよう
に調整すると共に８枚を１組くラミネートした後、上下
面に厚さ０．０３５ｆｒ１１の長尺銅箔を夫々配設した
積層体を無圧状態で加熱温度１５０℃のトンネル炉に連
続して導入し２０分間加熱してから１ｍ毎に切断し、更
に１６０ ’Ｃの加熱炉で１５分間アフターキュアー後
、直ちに２０℃の水槽中に導入しＦ７ｔＪｆＪ板表面温
度が３０℃になる迄１０分間急冷してから取出し、表面
水分を除去して積層板を得た。Example: Eight long strip-shaped glass cloth substrates each having a thickness of 0.2 fl were impregnated with an epoxy resin face containing a curing agent, and adjusted with a squeeze roll so that the resin amount was 50°C ml (hereinafter simply referred to as "regret"). At the same time, after laminating a set of 8 sheets, the laminate, in which long copper foils with a thickness of 0.035 fr11 were arranged on the upper and lower surfaces, was continuously introduced into a tunnel furnace at a heating temperature of 150° C. under no pressure. After heating for 20 minutes, it was cut into 1m sections, and then after-cured for 15 minutes in a 160'C heating furnace, it was immediately introduced into a 20℃ water tank and rapidly cooled for 10 minutes until the surface temperature of the F7tJfJ plate reached 30℃. A laminate was obtained by removing surface water from the laminate.
実施例２
アフターキ二アー′Ｖｔ１直ちに２０℃の水によるシャ
ーワー室を通過させ、積、１板表面温度が４０’Ｃにな
るＩＯ分間迄急冷した以外は実施例１と同様に処理して
積層板を得た。Example 2 A laminate was processed in the same manner as in Example 1, except that the after-tinier Vt1 was immediately passed through a shower room with 20°C water and rapidly cooled for 10 minutes to reach a surface temperature of 40°C. I got it.
′４４施例３
アフターキュツー後、直ちに２５℃のプレス成形機で接
触圧にて２０分間急冷し、積層板表面温度が５０℃にな
る迄急冷した以外は実施例１と同様に処理してａ１層板
を得た。'44 Example 3 The same process as in Example 1 was carried out, except that after the aftercut, the laminate was immediately quenched for 20 minutes under contact pressure in a press molding machine at 25°C until the surface temperature of the laminate reached 50°C. An a1-layer board was obtained.
実施！／ＩＩ ４
アフターキュアー後、石ちに２５℃のマルチ冷却ロール
を通過させ、積層板表面温度が５５℃になる迄５分間急
冷した以外は実施例１と同様に処理して積層板を得た。implementation! /II 4 After curing, a laminate was obtained in the same manner as in Example 1, except that the stone was passed through a multi-chilling roll at 25°C and rapidly cooled for 5 minutes until the surface temperature of the laminate reached 55°C. .
実施例５
アフターキュアー後、直ちに０〜５℃の低温室を通過さ
せ、積層板表面温度が６０℃になる迄２０分間急冷した
以外は実施例１と同様に処理して積層板を得た。Example 5 A laminate was obtained in the same manner as in Example 1, except that after the after-cure, it was immediately passed through a cold room at 0 to 5°C and rapidly cooled for 20 minutes until the surface temperature of the laminate reached 60°C.
比較例
アフターキュアー後、自然放冷したところ積層板表面温
度が２５℃になるのに要した時間は８時間であった。Comparative Example When the laminate was allowed to cool naturally after after-curing, it took 8 hours for the surface temperature of the laminate to reach 25°C.
実施例１乃至５及び比較例のｍ層板の表面平滑性及び寸
法安定性は第１表で明白なように本発明のものの性能は
よく、本発明の積層板の製造方法の優れてｂることを確
認した。As is clear from Table 1, the surface smoothness and dimensional stability of the m-layer plates of Examples 1 to 5 and the comparative example are good, and the performance of the laminated plates of the present invention is excellent. It was confirmed.
Claims (4)
要枚数重ね、更に必要に応じてその上面及び又は下面に
金属箔を配設した積層体を積層成形後、所要寸法に切断
し、更にアフターキュアー後、急冷することを特徴とす
る積層板の製造方法。(1) Layer the required number of resin-impregnated base materials made by impregnating the base material for a laminate with resin, and if necessary, arrange metal foil on the top and/or bottom surfaces of the laminate. After lamination molding, cut into the required dimensions. A method for producing a laminate, which further comprises rapidly cooling after after-curing.
る特許請求の範囲第１項記載の積層板の製造方法。(2) The method for manufacturing a laminate according to claim 1, wherein the quenching is performed using low-temperature gas.
る特許請求の範囲第１項記載の積層板の製造方法。(3) The method for manufacturing a laminate according to claim 1, wherein the quenching is performed using a low-temperature liquid.
る特許請求の範囲第１項記載の積層板の製造方法。(4) The method for manufacturing a laminate according to claim 1, wherein the quenching is performed using a low-temperature metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61214673A JP2550956B2 (en) | 1986-09-11 | 1986-09-11 | Laminated board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61214673A JP2550956B2 (en) | 1986-09-11 | 1986-09-11 | Laminated board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6369625A true JPS6369625A (en) | 1988-03-29 |
| JP2550956B2 JP2550956B2 (en) | 1996-11-06 |
Family
ID=16659679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61214673A Expired - Fee Related JP2550956B2 (en) | 1986-09-11 | 1986-09-11 | Laminated board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2550956B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371837A (en) * | 1989-08-11 | 1991-03-27 | Matsushita Electric Works Ltd | Preparation of laminated sheet |
-
1986
- 1986-09-11 JP JP61214673A patent/JP2550956B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371837A (en) * | 1989-08-11 | 1991-03-27 | Matsushita Electric Works Ltd | Preparation of laminated sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2550956B2 (en) | 1996-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6369625A (en) | Manufacture of laminated sheet | |
| JPS6365509B2 (en) | ||
| JPH0421413A (en) | Manufacture of laminated sheet | |
| JPH01272416A (en) | Manufacture of prepreg | |
| JPH01202424A (en) | Manufacture of multilayer printed wiring board | |
| JPS62233211A (en) | Manufacture of laminated sheet | |
| JPH02293111A (en) | Manufacture and manufacturing device for laminated sheet | |
| JPH0421410A (en) | Manufacture of laminated sheet | |
| JPS5894450A (en) | Manufacture of laminated board | |
| JP2001179762A (en) | Method for producing laminated plate and plate for molding laminated plate | |
| JPS63145006A (en) | Manufacture of laminated board | |
| JPH05309758A (en) | Manufacture of laminate | |
| JPH03126547A (en) | Manufacture of laminated board | |
| JPH021672B2 (en) | ||
| JPH0334677B2 (en) | ||
| JPH0263816A (en) | Manufacture of laminated sheet | |
| JPH0489254A (en) | Manufacture of laminated plate | |
| JPH02293128A (en) | Preparation of laminated sheet | |
| JPS58131029A (en) | Manufacture of thermosetting resin laminate | |
| JPH06315998A (en) | Production of laminated sheet | |
| JPH05318656A (en) | Production of laminated sheet | |
| JPH06316040A (en) | Manufacture of laminate | |
| JPH03126549A (en) | Manufacture of laminated board | |
| JPH06171019A (en) | Production of laminated sheet | |
| JPH0421411A (en) | Manufacture of laminated sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |